CN119032635A - 基板 - Google Patents

基板 Download PDF

Info

Publication number
CN119032635A
CN119032635A CN202380036950.7A CN202380036950A CN119032635A CN 119032635 A CN119032635 A CN 119032635A CN 202380036950 A CN202380036950 A CN 202380036950A CN 119032635 A CN119032635 A CN 119032635A
Authority
CN
China
Prior art keywords
electronic components
filler
region
wall surface
sealing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380036950.7A
Other languages
English (en)
Chinese (zh)
Inventor
久保龙一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of CN119032635A publication Critical patent/CN119032635A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0266—Size distribution
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
CN202380036950.7A 2022-06-27 2023-02-17 基板 Pending CN119032635A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-102606 2022-06-27
JP2022102606 2022-06-27
PCT/JP2023/005690 WO2024004263A1 (ja) 2022-06-27 2023-02-17 基板

Publications (1)

Publication Number Publication Date
CN119032635A true CN119032635A (zh) 2024-11-26

Family

ID=89381915

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380036950.7A Pending CN119032635A (zh) 2022-06-27 2023-02-17 基板

Country Status (4)

Country Link
US (1) US20250056729A1 (https=)
JP (1) JP7537637B2 (https=)
CN (1) CN119032635A (https=)
WO (1) WO2024004263A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022125554A1 (de) * 2022-10-04 2024-04-04 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Package mit Komponententräger mit Hohlraum und elektronischer Komponente sowie funktionellem Füllmedium darin
US20240243036A1 (en) * 2023-01-12 2024-07-18 Qualcomm Incorporated Cavity-embedded tunable filter
WO2026009567A1 (ja) * 2024-07-04 2026-01-08 株式会社村田製作所 電子部品集積モジュール、モジュール内蔵基板及び電子部品集積モジュールの製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4365641B2 (ja) * 2002-07-10 2009-11-18 日本特殊陶業株式会社 多層配線基板及び多層配線基板の製造方法
WO2006011508A1 (ja) * 2004-07-30 2006-02-02 Murata Manufacturing Co., Ltd. 複合型電子部品及びその製造方法
TW201436684A (zh) * 2013-03-01 2014-09-16 Unimicron Technology Corp 嵌埋有電子元件的線路板結構及其製法
WO2014162478A1 (ja) * 2013-04-01 2014-10-09 株式会社メイコー 部品内蔵基板及びその製造方法
US10681821B2 (en) * 2014-10-16 2020-06-09 The Charles Stark Draper Laboratory, Inc. Methods and devices for improved space utilization in wafer based modules
CN209314146U (zh) * 2016-05-18 2019-08-27 株式会社村田制作所 部件内置基板
JP2019207978A (ja) * 2018-05-30 2019-12-05 イビデン株式会社 プリント配線板

Also Published As

Publication number Publication date
JP7537637B2 (ja) 2024-08-21
US20250056729A1 (en) 2025-02-13
WO2024004263A1 (ja) 2024-01-04
JPWO2024004263A1 (https=) 2024-01-04

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