JPWO2024004263A5 - - Google Patents

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Publication number
JPWO2024004263A5
JPWO2024004263A5 JP2023579251A JP2023579251A JPWO2024004263A5 JP WO2024004263 A5 JPWO2024004263 A5 JP WO2024004263A5 JP 2023579251 A JP2023579251 A JP 2023579251A JP 2023579251 A JP2023579251 A JP 2023579251A JP WO2024004263 A5 JPWO2024004263 A5 JP WO2024004263A5
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JP
Japan
Prior art keywords
electronic components
opening
wall surface
sealing material
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023579251A
Other languages
English (en)
Japanese (ja)
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JP7537637B2 (ja
JPWO2024004263A1 (https=
Filing date
Publication date
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Priority claimed from PCT/JP2023/005690 external-priority patent/WO2024004263A1/ja
Publication of JPWO2024004263A1 publication Critical patent/JPWO2024004263A1/ja
Publication of JPWO2024004263A5 publication Critical patent/JPWO2024004263A5/ja
Application granted granted Critical
Publication of JP7537637B2 publication Critical patent/JP7537637B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2023579251A 2022-06-27 2023-02-17 基板 Active JP7537637B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022102606 2022-06-27
JP2022102606 2022-06-27
PCT/JP2023/005690 WO2024004263A1 (ja) 2022-06-27 2023-02-17 基板

Publications (3)

Publication Number Publication Date
JPWO2024004263A1 JPWO2024004263A1 (https=) 2024-01-04
JPWO2024004263A5 true JPWO2024004263A5 (https=) 2024-06-04
JP7537637B2 JP7537637B2 (ja) 2024-08-21

Family

ID=89381915

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023579251A Active JP7537637B2 (ja) 2022-06-27 2023-02-17 基板

Country Status (4)

Country Link
US (1) US20250056729A1 (https=)
JP (1) JP7537637B2 (https=)
CN (1) CN119032635A (https=)
WO (1) WO2024004263A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022125554A1 (de) * 2022-10-04 2024-04-04 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Package mit Komponententräger mit Hohlraum und elektronischer Komponente sowie funktionellem Füllmedium darin
US20240243036A1 (en) * 2023-01-12 2024-07-18 Qualcomm Incorporated Cavity-embedded tunable filter
WO2026009567A1 (ja) * 2024-07-04 2026-01-08 株式会社村田製作所 電子部品集積モジュール、モジュール内蔵基板及び電子部品集積モジュールの製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4365641B2 (ja) * 2002-07-10 2009-11-18 日本特殊陶業株式会社 多層配線基板及び多層配線基板の製造方法
WO2006011508A1 (ja) * 2004-07-30 2006-02-02 Murata Manufacturing Co., Ltd. 複合型電子部品及びその製造方法
TW201436684A (zh) * 2013-03-01 2014-09-16 Unimicron Technology Corp 嵌埋有電子元件的線路板結構及其製法
WO2014162478A1 (ja) * 2013-04-01 2014-10-09 株式会社メイコー 部品内蔵基板及びその製造方法
US10681821B2 (en) * 2014-10-16 2020-06-09 The Charles Stark Draper Laboratory, Inc. Methods and devices for improved space utilization in wafer based modules
CN209314146U (zh) * 2016-05-18 2019-08-27 株式会社村田制作所 部件内置基板
JP2019207978A (ja) * 2018-05-30 2019-12-05 イビデン株式会社 プリント配線板

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