CN119096707A - 基板以及模块 - Google Patents

基板以及模块 Download PDF

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Publication number
CN119096707A
CN119096707A CN202380039088.5A CN202380039088A CN119096707A CN 119096707 A CN119096707 A CN 119096707A CN 202380039088 A CN202380039088 A CN 202380039088A CN 119096707 A CN119096707 A CN 119096707A
Authority
CN
China
Prior art keywords
metal
electronic component
substrate
metal column
sealing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380039088.5A
Other languages
English (en)
Chinese (zh)
Inventor
久保龙一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of CN119096707A publication Critical patent/CN119096707A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CN202380039088.5A 2022-07-06 2023-02-27 基板以及模块 Pending CN119096707A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-109098 2022-07-06
JP2022109098 2022-07-06
PCT/JP2023/006988 WO2024009554A1 (ja) 2022-07-06 2023-02-27 基板及びモジュール

Publications (1)

Publication Number Publication Date
CN119096707A true CN119096707A (zh) 2024-12-06

Family

ID=89452948

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380039088.5A Pending CN119096707A (zh) 2022-07-06 2023-02-27 基板以及模块

Country Status (4)

Country Link
US (1) US20250071906A1 (https=)
JP (1) JP7662057B2 (https=)
CN (1) CN119096707A (https=)
WO (1) WO2024009554A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI833522B (zh) * 2022-12-23 2024-02-21 稜研科技股份有限公司 封裝結構
WO2026009567A1 (ja) * 2024-07-04 2026-01-08 株式会社村田製作所 電子部品集積モジュール、モジュール内蔵基板及び電子部品集積モジュールの製造方法
WO2026075093A1 (ja) * 2024-10-02 2026-04-09 株式会社村田製作所 電子部品内蔵基板

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001291799A (ja) 2000-04-11 2001-10-19 Ngk Spark Plug Co Ltd 配線基板
JP2005210074A (ja) 2003-12-26 2005-08-04 Tdk Corp 多層基板及びパワーアンプモジュール
JP5540960B2 (ja) 2010-07-15 2014-07-02 日本電気株式会社 機能素子内蔵基板
KR20130014122A (ko) 2011-07-29 2013-02-07 삼성전기주식회사 전자 소자 내장 인쇄회로기판 및 그 제조방법
KR101514518B1 (ko) 2013-05-24 2015-04-22 삼성전기주식회사 전자부품 내장 인쇄회로기판 및 그 제조방법
WO2022124262A1 (ja) 2020-12-09 2022-06-16 株式会社村田製作所 高周波モジュール及び通信装置

Also Published As

Publication number Publication date
US20250071906A1 (en) 2025-02-27
JP7662057B2 (ja) 2025-04-15
WO2024009554A1 (ja) 2024-01-11
JPWO2024009554A1 (https=) 2024-01-11

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