JP2020184530A5 - - Google Patents
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- Publication number
- JP2020184530A5 JP2020184530A5 JP2020076961A JP2020076961A JP2020184530A5 JP 2020184530 A5 JP2020184530 A5 JP 2020184530A5 JP 2020076961 A JP2020076961 A JP 2020076961A JP 2020076961 A JP2020076961 A JP 2020076961A JP 2020184530 A5 JP2020184530 A5 JP 2020184530A5
- Authority
- JP
- Japan
- Prior art keywords
- particles
- metal
- conductive layer
- terminal
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims 18
- 229910052751 metal Inorganic materials 0.000 claims 18
- 239000002245 particle Substances 0.000 claims 15
- 239000007771 core particle Substances 0.000 claims 9
- 239000000463 material Substances 0.000 claims 8
- 239000002923 metal particle Substances 0.000 claims 6
- 229910001111 Fine metal Inorganic materials 0.000 claims 5
- 239000010419 fine particle Substances 0.000 claims 4
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 239000011162 core material Substances 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 238000007747 plating Methods 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000011230 binding agent Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/607,466 US12237096B2 (en) | 2019-05-01 | 2020-04-23 | Connection structure, method of manufacturing connection structure, connection material, and coated conductive particle |
| PCT/JP2020/017582 WO2020222301A1 (ja) | 2019-05-01 | 2020-04-23 | 接続構造体、接続構造体の製造方法、接続材料、及び被覆導電粒子 |
| KR1020217035504A KR102783058B1 (ko) | 2019-05-01 | 2020-04-23 | 접속 구조체, 접속 구조체의 제조 방법, 접속 재료, 및 피복 도전 입자 |
| TW109114319A TWI883000B (zh) | 2019-05-01 | 2020-04-29 | 連接構造體、連接構造體之製造方法、連接材料及被覆導電粒子 |
| JP2024166460A JP2024175135A (ja) | 2019-05-01 | 2024-09-25 | 接続構造体、接続構造体の製造方法、接続材料、及び被覆導電粒子 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019087150 | 2019-05-01 | ||
| JP2019087150 | 2019-05-01 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024166460A Division JP2024175135A (ja) | 2019-05-01 | 2024-09-25 | 接続構造体、接続構造体の製造方法、接続材料、及び被覆導電粒子 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020184530A JP2020184530A (ja) | 2020-11-12 |
| JP2020184530A5 true JP2020184530A5 (https=) | 2023-04-28 |
| JP7592399B2 JP7592399B2 (ja) | 2024-12-02 |
Family
ID=73044245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020076961A Active JP7592399B2 (ja) | 2019-05-01 | 2020-04-23 | 接続構造体、接続構造体の製造方法、接続材料、及び被覆導電粒子 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7592399B2 (https=) |
| KR (1) | KR102783058B1 (https=) |
| CN (1) | CN113728402B (https=) |
| TW (1) | TWI883000B (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114170925A (zh) * | 2021-12-07 | 2022-03-11 | Tcl华星光电技术有限公司 | 显示模组及其制作方法 |
| KR102743445B1 (ko) * | 2022-12-06 | 2024-12-16 | 덕산네오룩스 주식회사 | 도전입자, 도전재료 및 접속 구조체 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001220691A (ja) * | 2000-02-03 | 2001-08-14 | Okuno Chem Ind Co Ltd | 導電性微粒子 |
| JP2005317270A (ja) | 2004-04-27 | 2005-11-10 | Sekisui Chem Co Ltd | 導電性微粒子及び導電接続構造体 |
| WO2006080289A1 (ja) | 2005-01-25 | 2006-08-03 | Sekisui Chemical Co., Ltd. | 導電性微粒子、及び異方性導電材料 |
| JP5316410B2 (ja) | 2007-08-02 | 2013-10-16 | 日立化成株式会社 | 回路部材の接続構造 |
| EP2265100A1 (en) * | 2008-03-31 | 2010-12-22 | Mitsubishi Electric Corporation | Low-temperature fired ceramic circuit board |
| JP5887086B2 (ja) | 2011-08-11 | 2016-03-16 | 株式会社タムラ製作所 | 導電性材料 |
| JP2014143189A (ja) | 2012-12-27 | 2014-08-07 | Sekisui Chem Co Ltd | 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体 |
| WO2014133124A1 (ja) * | 2013-02-28 | 2014-09-04 | 積水化学工業株式会社 | 導電性微粒子、異方性導電材料、及び、導電接続構造体 |
| JP7007138B2 (ja) * | 2016-09-09 | 2022-02-10 | 積水化学工業株式会社 | 金属原子含有粒子、接続材料、接続構造体及び接続構造体の製造方法 |
| KR102309135B1 (ko) | 2017-03-06 | 2021-10-07 | 데쿠세리아루즈 가부시키가이샤 | 수지 조성물, 수지 조성물의 제조 방법, 및 구조체 |
| TWI772522B (zh) * | 2017-09-20 | 2022-08-01 | 日商積水化學工業股份有限公司 | 含金屬粒子、連接材料、連接結構體、連接結構體之製造方法、導通檢查用構件及導通檢查裝置 |
-
2020
- 2020-04-23 KR KR1020217035504A patent/KR102783058B1/ko active Active
- 2020-04-23 CN CN202080032355.2A patent/CN113728402B/zh active Active
- 2020-04-23 JP JP2020076961A patent/JP7592399B2/ja active Active
- 2020-04-29 TW TW109114319A patent/TWI883000B/zh active
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