JP4863988B2 - 導電性微粒子、及び異方性導電材料 - Google Patents
導電性微粒子、及び異方性導電材料 Download PDFInfo
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- JP4863988B2 JP4863988B2 JP2007500506A JP2007500506A JP4863988B2 JP 4863988 B2 JP4863988 B2 JP 4863988B2 JP 2007500506 A JP2007500506 A JP 2007500506A JP 2007500506 A JP2007500506 A JP 2007500506A JP 4863988 B2 JP4863988 B2 JP 4863988B2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/17—Metallic particles coated with metal
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1689—After-treatment
- C23C18/1692—Heat-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0218—Composite particles, i.e. first metal coated with second metal
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Powder Metallurgy (AREA)
- Chemically Coating (AREA)
- Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
Description
本発明1の導電性微粒子は、粒子表面に無電解メッキ法による錫メッキ被膜が形成されておりその上に無電解メッキ法による銀メッキ被膜を形成させている導電性微粒子を、240℃以上で加熱することにより金属熱拡散を起こさせ錫−銀−銅の三元系の合金被膜を形成させたものである。
上記下地触媒型の還元銀メッキによる方法は、下地である錫を触媒として銀メッキ被膜を析出させる方法である。
粒径5μmの銅金属粒子(純度99重量%)を、過酸化水素−硫酸混合液に浸して行う湿式法で浄化処理し、表面に金属銅が露出し表面が浄化された銅金属粒子を得た。
得られた水性懸濁液に、コハク酸イミド30g、イミダゾール80g、及び、グリオキシル酸5gを投入しメッキ液を調整した。
得られたメッキ液にアンモニアを用いpHを9に合わせ、浴温を20℃にし、15〜20分程度反応させることにより銀メッキ被膜が形成された粒子を得た。
浄化した粒径5μmの銅金属粒子を用いるかわりに、粒径5μmのジビニルベンゼン粒子(商品名「ミクロパール」、積水化学工業株式会社製)を用いたこと以外は実施例1と同様にして導電性微粒子を得た。
実施例1と同様にして、表面が浄化された銅金属粒子を得た。
得られた表面が浄化された銅金属粒子に、錫メッキ被膜は形成させなかった。
得られたそれぞれの導電性微粒子について、微小圧縮試験機(「DUH−200」、島津製作所社製)を、抵抗値が測定できるようにして用い、導電性微粒子を圧縮しながら10-7Vの電圧をかけて通電を行い、粒子1個当たりの抵抗値を測定することにより、導電性微粒子の抵抗値を測定した。
評価結果を表1に示す。
樹脂バインダーの樹脂としてエポキシ樹脂(ジャパンエポキシレジン社製、「エピコート828」)100重量部、トリスジメチルアミノエチルフェノール2重量部、及びトルエン100重量部に、得られたそれぞれの導電性微粒子を添加し、遊星式攪拌機を用いて充分に混合した後、離型フィルム上に乾燥後の厚さが7μmとなるように塗布し、トルエンを蒸発させて導電性微粒子を含有する接着フィルムを得た。なお、導電性微粒子の配合量は、フィルム中の含有量が5万個/cm2
とした。
評価結果を表1に示す。
Claims (2)
- 粒子表面に無電解メッキ法による錫メッキ被膜が形成されておりその上に無電解メッキ法による銀メッキ被膜を形成させている導電性微粒子を、
240℃以上で加熱することにより金属熱拡散を起こさせ錫−銀−銅の三元系の合金被膜が形成されており、
錫−銀−銅の三元系の合金被膜における組成の含有割合は、錫が80〜99.8重量%、銀が0.1〜10重量%、銅が0.1〜10重量%であることを特徴とする導電性微粒子。 - 請求項1記載の導電性微粒子が樹脂バインダーに分散されてなることを特徴とする異方性導電材料。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007500506A JP4863988B2 (ja) | 2005-01-25 | 2006-01-24 | 導電性微粒子、及び異方性導電材料 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005017442 | 2005-01-25 | ||
JP2005017442 | 2005-01-25 | ||
PCT/JP2006/301013 WO2006080289A1 (ja) | 2005-01-25 | 2006-01-24 | 導電性微粒子、及び異方性導電材料 |
JP2007500506A JP4863988B2 (ja) | 2005-01-25 | 2006-01-24 | 導電性微粒子、及び異方性導電材料 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2006080289A1 JPWO2006080289A1 (ja) | 2008-06-19 |
JP4863988B2 true JP4863988B2 (ja) | 2012-01-25 |
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JP2007500506A Active JP4863988B2 (ja) | 2005-01-25 | 2006-01-24 | 導電性微粒子、及び異方性導電材料 |
Country Status (3)
Country | Link |
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JP (1) | JP4863988B2 (ja) |
TW (1) | TW200632133A (ja) |
WO (1) | WO2006080289A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014002893A1 (ja) * | 2012-06-25 | 2014-01-03 | 株式会社村田製作所 | 異方性導電シート、および、それを用いた電極接合方法 |
WO2023058798A1 (ko) * | 2021-10-08 | 2023-04-13 | 주식회사 씨앤씨머티리얼즈 | 내식성이 우수한 다층 구조의 구리 입자 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5768455B2 (ja) * | 2011-04-14 | 2015-08-26 | 日立化成株式会社 | 電極用ペースト組成物及び太陽電池素子 |
JP5695510B2 (ja) * | 2011-06-22 | 2015-04-08 | 株式会社日本触媒 | 導電性微粒子の製造方法 |
JP6083165B2 (ja) * | 2012-09-12 | 2017-02-22 | 凸版印刷株式会社 | 金属/セルロース複合化微細繊維の製造方法、金属/セルロース複合化微細繊維を含む分散体および透明導電膜の製造方法 |
US10056505B2 (en) * | 2013-03-15 | 2018-08-21 | Inkron Ltd | Multi shell metal particles and uses thereof |
FI20135253L (fi) | 2013-03-15 | 2014-09-16 | Inkron Ltd | Monikerrosmetallipartikkelit ja niiden käyttö |
TWI590259B (zh) | 2016-04-29 | 2017-07-01 | 南茂科技股份有限公司 | 焊球、其製造方法以及半導體元件 |
CN111095441B (zh) | 2017-09-20 | 2021-11-23 | 积水化学工业株式会社 | 含金属粒子、连接材料、连接结构体及连接结构体的制造方法、导通检查用部件以及导通检查装置 |
JPWO2020100991A1 (ja) * | 2018-11-15 | 2020-05-22 | ||
WO2020222301A1 (ja) * | 2019-05-01 | 2020-11-05 | デクセリアルズ株式会社 | 接続構造体、接続構造体の製造方法、接続材料、及び被覆導電粒子 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06346111A (ja) * | 1993-06-15 | 1994-12-20 | Taiho Kogyo Co Ltd | 摺動材料及びその製造方法 |
JP2001011502A (ja) * | 1999-06-24 | 2001-01-16 | Dowa Mining Co Ltd | 銀拡散銅粉およびその製法並びにそれを用いた導電ペースト |
JP2004156062A (ja) * | 2002-11-01 | 2004-06-03 | Mitsui Mining & Smelting Co Ltd | 二層コート銅粉並びにその二層コート銅粉の製造方法及びその二層コート銅粉を用いた導電性ペースト |
JP2004362809A (ja) * | 2003-06-02 | 2004-12-24 | Nissan Motor Co Ltd | 非水電池用負極及びそれを用いる非水電池と負極活物質の製造方法 |
-
2006
- 2006-01-24 WO PCT/JP2006/301013 patent/WO2006080289A1/ja not_active Application Discontinuation
- 2006-01-24 JP JP2007500506A patent/JP4863988B2/ja active Active
- 2006-01-25 TW TW095102865A patent/TW200632133A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06346111A (ja) * | 1993-06-15 | 1994-12-20 | Taiho Kogyo Co Ltd | 摺動材料及びその製造方法 |
JP2001011502A (ja) * | 1999-06-24 | 2001-01-16 | Dowa Mining Co Ltd | 銀拡散銅粉およびその製法並びにそれを用いた導電ペースト |
JP2004156062A (ja) * | 2002-11-01 | 2004-06-03 | Mitsui Mining & Smelting Co Ltd | 二層コート銅粉並びにその二層コート銅粉の製造方法及びその二層コート銅粉を用いた導電性ペースト |
JP2004362809A (ja) * | 2003-06-02 | 2004-12-24 | Nissan Motor Co Ltd | 非水電池用負極及びそれを用いる非水電池と負極活物質の製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014002893A1 (ja) * | 2012-06-25 | 2014-01-03 | 株式会社村田製作所 | 異方性導電シート、および、それを用いた電極接合方法 |
WO2023058798A1 (ko) * | 2021-10-08 | 2023-04-13 | 주식회사 씨앤씨머티리얼즈 | 내식성이 우수한 다층 구조의 구리 입자 |
Also Published As
Publication number | Publication date |
---|---|
TW200632133A (en) | 2006-09-16 |
WO2006080289A1 (ja) | 2006-08-03 |
JPWO2006080289A1 (ja) | 2008-06-19 |
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