JPWO2023282350A5 - - Google Patents
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- Publication number
- JPWO2023282350A5 JPWO2023282350A5 JP2023533201A JP2023533201A JPWO2023282350A5 JP WO2023282350 A5 JPWO2023282350 A5 JP WO2023282350A5 JP 2023533201 A JP2023533201 A JP 2023533201A JP 2023533201 A JP2023533201 A JP 2023533201A JP WO2023282350 A5 JPWO2023282350 A5 JP WO2023282350A5
- Authority
- JP
- Japan
- Prior art keywords
- opening
- wiring board
- printed wiring
- board according
- convex portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims 14
- 239000004020 conductor Substances 0.000 claims 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 2
- 229910052804 chromium Inorganic materials 0.000 claims 2
- 239000011651 chromium Substances 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021114335 | 2021-07-09 | ||
| JP2021114335 | 2021-07-09 | ||
| PCT/JP2022/027124 WO2023282350A1 (ja) | 2021-07-09 | 2022-07-08 | プリント配線板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023282350A1 JPWO2023282350A1 (https=) | 2023-01-12 |
| JPWO2023282350A5 true JPWO2023282350A5 (https=) | 2023-09-28 |
| JP7485223B2 JP7485223B2 (ja) | 2024-05-16 |
Family
ID=84800771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023533201A Active JP7485223B2 (ja) | 2021-07-09 | 2022-07-08 | プリント配線板 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20240147612A1 (https=) |
| JP (1) | JP7485223B2 (https=) |
| CN (1) | CN116803219A (https=) |
| WO (1) | WO2023282350A1 (https=) |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4964947A (en) * | 1989-01-20 | 1990-10-23 | Casio Computer Co., Ltd. | Method of manufacturing double-sided wiring substrate |
| JP3395621B2 (ja) * | 1997-02-03 | 2003-04-14 | イビデン株式会社 | プリント配線板及びその製造方法 |
| JP2002198461A (ja) * | 2000-12-27 | 2002-07-12 | Sumitomo Metal Electronics Devices Inc | プラスチックパッケージ及びその製造方法 |
| JP2006229034A (ja) * | 2005-02-18 | 2006-08-31 | Toshiba Corp | 配線基板とその製造方法 |
| JP2006319314A (ja) | 2005-04-13 | 2006-11-24 | Kyocera Corp | 回路基板および回路基板の製造方法 |
| US7557304B2 (en) * | 2006-11-08 | 2009-07-07 | Motorola, Inc. | Printed circuit board having closed vias |
| US8102057B2 (en) * | 2006-12-27 | 2012-01-24 | Hewlett-Packard Development Company, L.P. | Via design for flux residue mitigation |
| CN101785103B (zh) * | 2007-07-05 | 2011-12-28 | Aac微技术有限公司 | 低阻抗晶圆穿孔 |
| EP2146561A1 (en) * | 2008-05-28 | 2010-01-20 | LG Electronics Inc. | Flexible film and display device including the same |
| JP2012195389A (ja) * | 2011-03-15 | 2012-10-11 | Fujitsu Ltd | 配線基板、配線基板ユニット、電子装置、及び配線基板の製造方法 |
| KR101514024B1 (ko) * | 2013-07-23 | 2015-04-22 | (주)이수엑사보드 | 필 도금된 동박 적층판 및 그 도금법 |
| JP6641717B2 (ja) * | 2015-04-08 | 2020-02-05 | 日立化成株式会社 | 多層配線基板の製造方法 |
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2022
- 2022-07-08 WO PCT/JP2022/027124 patent/WO2023282350A1/ja not_active Ceased
- 2022-07-08 JP JP2023533201A patent/JP7485223B2/ja active Active
- 2022-07-08 CN CN202280012700.5A patent/CN116803219A/zh active Pending
- 2022-07-08 US US18/278,253 patent/US20240147612A1/en active Pending