JPWO2023190822A5 - - Google Patents

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Publication number
JPWO2023190822A5
JPWO2023190822A5 JP2024512768A JP2024512768A JPWO2023190822A5 JP WO2023190822 A5 JPWO2023190822 A5 JP WO2023190822A5 JP 2024512768 A JP2024512768 A JP 2024512768A JP 2024512768 A JP2024512768 A JP 2024512768A JP WO2023190822 A5 JPWO2023190822 A5 JP WO2023190822A5
Authority
JP
Japan
Prior art keywords
hole
hole conductor
conductor
wiring board
board according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024512768A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023190822A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/013074 external-priority patent/WO2023190822A1/ja
Publication of JPWO2023190822A1 publication Critical patent/JPWO2023190822A1/ja
Publication of JPWO2023190822A5 publication Critical patent/JPWO2023190822A5/ja
Pending legal-status Critical Current

Links

JP2024512768A 2022-03-30 2023-03-30 Pending JPWO2023190822A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022056483 2022-03-30
PCT/JP2023/013074 WO2023190822A1 (ja) 2022-03-30 2023-03-30 配線基板

Publications (2)

Publication Number Publication Date
JPWO2023190822A1 JPWO2023190822A1 (https=) 2023-10-05
JPWO2023190822A5 true JPWO2023190822A5 (https=) 2024-12-04

Family

ID=88202753

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024512768A Pending JPWO2023190822A1 (https=) 2022-03-30 2023-03-30

Country Status (7)

Country Link
US (1) US20250240876A1 (https=)
EP (1) EP4503872A1 (https=)
JP (1) JPWO2023190822A1 (https=)
KR (1) KR20240151849A (https=)
CN (1) CN118975416A (https=)
TW (1) TWI859795B (https=)
WO (1) WO2023190822A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI911024B (zh) * 2025-01-22 2026-01-01 大陸商宏啟勝精密電子（秦皇島）有限公司 電路板及其製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI310670B (en) * 2003-08-28 2009-06-01 Ibm Printed wiring board manufacturing method and printed wiring board
US8925192B2 (en) * 2009-06-09 2015-01-06 Ibiden Co., Ltd. Printed wiring board and method for manufacturing the same
JP5763962B2 (ja) * 2011-04-19 2015-08-12 日本特殊陶業株式会社 セラミック配線基板、多数個取りセラミック配線基板、およびその製造方法
JP2014110293A (ja) * 2012-11-30 2014-06-12 Ibiden Co Ltd 半導体素子搭載用プリント配線板およびその製造方法
JP5883542B2 (ja) * 2014-02-21 2016-03-15 三井金属鉱業株式会社 保護層付銅張積層板及び多層プリント配線板
JP2019016733A (ja) * 2017-07-10 2019-01-31 大日本印刷株式会社 貫通電極基板、貫通電極基板の製造方法及び貫通電極基板を用いた半導体装置
JP2021027167A (ja) 2019-08-05 2021-02-22 イビデン株式会社 配線基板

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