JPWO2024090336A5 - - Google Patents

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Publication number
JPWO2024090336A5
JPWO2024090336A5 JP2024553013A JP2024553013A JPWO2024090336A5 JP WO2024090336 A5 JPWO2024090336 A5 JP WO2024090336A5 JP 2024553013 A JP2024553013 A JP 2024553013A JP 2024553013 A JP2024553013 A JP 2024553013A JP WO2024090336 A5 JPWO2024090336 A5 JP WO2024090336A5
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JP
Japan
Prior art keywords
conductor
wiring board
board according
oxide layer
land
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2024553013A
Other languages
English (en)
Japanese (ja)
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JPWO2024090336A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/037966 external-priority patent/WO2024090336A1/ja
Publication of JPWO2024090336A1 publication Critical patent/JPWO2024090336A1/ja
Publication of JPWO2024090336A5 publication Critical patent/JPWO2024090336A5/ja
Withdrawn legal-status Critical Current

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JP2024553013A 2022-10-28 2023-10-20 Withdrawn JPWO2024090336A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022173508 2022-10-28
PCT/JP2023/037966 WO2024090336A1 (ja) 2022-10-28 2023-10-20 配線基板およびそれを用いた実装構造体

Publications (2)

Publication Number Publication Date
JPWO2024090336A1 JPWO2024090336A1 (https=) 2024-05-02
JPWO2024090336A5 true JPWO2024090336A5 (https=) 2025-07-01

Family

ID=90830821

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024553013A Withdrawn JPWO2024090336A1 (https=) 2022-10-28 2023-10-20

Country Status (3)

Country Link
JP (1) JPWO2024090336A1 (https=)
TW (1) TW202428076A (https=)
WO (1) WO2024090336A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004158703A (ja) * 2002-11-07 2004-06-03 Internatl Business Mach Corp <Ibm> プリント配線板とその製造方法
SG126776A1 (en) * 2005-04-08 2006-11-29 3M Innovative Properties Co Flexible circuit substrate
JP2008192938A (ja) * 2007-02-06 2008-08-21 Kyocera Corp 配線基板、実装構造体および配線基板の製造方法

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