JPWO2023189745A5 - - Google Patents

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Publication number
JPWO2023189745A5
JPWO2023189745A5 JP2024511831A JP2024511831A JPWO2023189745A5 JP WO2023189745 A5 JPWO2023189745 A5 JP WO2023189745A5 JP 2024511831 A JP2024511831 A JP 2024511831A JP 2024511831 A JP2024511831 A JP 2024511831A JP WO2023189745 A5 JPWO2023189745 A5 JP WO2023189745A5
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JP
Japan
Prior art keywords
printed wiring
sintered
main surface
atomic percent
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024511831A
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English (en)
Japanese (ja)
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JP7758168B2 (ja
JPWO2023189745A1 (https=
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Priority claimed from PCT/JP2023/010645 external-priority patent/WO2023189745A1/ja
Publication of JPWO2023189745A1 publication Critical patent/JPWO2023189745A1/ja
Publication of JPWO2023189745A5 publication Critical patent/JPWO2023189745A5/ja
Application granted granted Critical
Publication of JP7758168B2 publication Critical patent/JP7758168B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2024511831A 2022-03-29 2023-03-17 プリント配線板用基板及びプリント配線板 Active JP7758168B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022053406 2022-03-29
JP2022053406 2022-03-29
PCT/JP2023/010645 WO2023189745A1 (ja) 2022-03-29 2023-03-17 プリント配線板用基板及びプリント配線板

Publications (3)

Publication Number Publication Date
JPWO2023189745A1 JPWO2023189745A1 (https=) 2023-10-05
JPWO2023189745A5 true JPWO2023189745A5 (https=) 2024-06-04
JP7758168B2 JP7758168B2 (ja) 2025-10-22

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ID=88201019

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024511831A Active JP7758168B2 (ja) 2022-03-29 2023-03-17 プリント配線板用基板及びプリント配線板

Country Status (3)

Country Link
JP (1) JP7758168B2 (https=)
CN (1) CN118044340A (https=)
WO (1) WO2023189745A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013135089A (ja) * 2011-12-27 2013-07-08 Ishihara Chem Co Ltd 導電膜形成方法、銅微粒子分散液及び回路基板
JP6484026B2 (ja) * 2014-12-22 2019-03-13 住友電気工業株式会社 プリント配線板用基板及びプリント配線板並びにプリント配線板用基板の製造方法
JP6466110B2 (ja) * 2014-09-09 2019-02-06 住友電気工業株式会社 プリント配線板用基板、プリント配線板及びプリント配線板用基板の製造方法
JP6400503B2 (ja) * 2015-02-19 2018-10-03 住友電工プリントサーキット株式会社 プリント配線板用基材及びプリント配線板
JP7032127B2 (ja) * 2017-12-25 2022-03-08 住友電気工業株式会社 プリント配線板用基材、プリント配線板及びプリント配線板用基材の製造方法
JP7208803B2 (ja) * 2019-01-16 2023-01-19 旭化成株式会社 導電性パターン領域付構造体及びその製造方法

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