JPWO2023189745A1 - - Google Patents

Info

Publication number
JPWO2023189745A1
JPWO2023189745A1 JP2024511831A JP2024511831A JPWO2023189745A1 JP WO2023189745 A1 JPWO2023189745 A1 JP WO2023189745A1 JP 2024511831 A JP2024511831 A JP 2024511831A JP 2024511831 A JP2024511831 A JP 2024511831A JP WO2023189745 A1 JPWO2023189745 A1 JP WO2023189745A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024511831A
Other languages
Japanese (ja)
Other versions
JP7758168B2 (ja
JPWO2023189745A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023189745A1 publication Critical patent/JPWO2023189745A1/ja
Publication of JPWO2023189745A5 publication Critical patent/JPWO2023189745A5/ja
Application granted granted Critical
Publication of JP7758168B2 publication Critical patent/JP7758168B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
JP2024511831A 2022-03-29 2023-03-17 プリント配線板用基板及びプリント配線板 Active JP7758168B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022053406 2022-03-29
JP2022053406 2022-03-29
PCT/JP2023/010645 WO2023189745A1 (ja) 2022-03-29 2023-03-17 プリント配線板用基板及びプリント配線板

Publications (3)

Publication Number Publication Date
JPWO2023189745A1 true JPWO2023189745A1 (https=) 2023-10-05
JPWO2023189745A5 JPWO2023189745A5 (https=) 2024-06-04
JP7758168B2 JP7758168B2 (ja) 2025-10-22

Family

ID=88201019

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024511831A Active JP7758168B2 (ja) 2022-03-29 2023-03-17 プリント配線板用基板及びプリント配線板

Country Status (3)

Country Link
JP (1) JP7758168B2 (https=)
CN (1) CN118044340A (https=)
WO (1) WO2023189745A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013135089A (ja) * 2011-12-27 2013-07-08 Ishihara Chem Co Ltd 導電膜形成方法、銅微粒子分散液及び回路基板
JP2016058545A (ja) * 2014-09-09 2016-04-21 住友電気工業株式会社 プリント配線板用基板、プリント配線板及びプリント配線板用基板の製造方法
JP2016119424A (ja) * 2014-12-22 2016-06-30 住友電気工業株式会社 プリント配線板用基板及びプリント配線板並びにプリント配線板用基板の製造方法
JP2016152405A (ja) * 2015-02-19 2016-08-22 住友電工プリントサーキット株式会社 プリント配線板用基材、プリント配線板及びプリント配線板用基材の製造方法
JP2019114681A (ja) * 2017-12-25 2019-07-11 住友電気工業株式会社 プリント配線板用基材及びプリント配線板
JP2020113706A (ja) * 2019-01-16 2020-07-27 旭化成株式会社 導電性パターン領域付構造体及びその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013135089A (ja) * 2011-12-27 2013-07-08 Ishihara Chem Co Ltd 導電膜形成方法、銅微粒子分散液及び回路基板
JP2016058545A (ja) * 2014-09-09 2016-04-21 住友電気工業株式会社 プリント配線板用基板、プリント配線板及びプリント配線板用基板の製造方法
JP2016119424A (ja) * 2014-12-22 2016-06-30 住友電気工業株式会社 プリント配線板用基板及びプリント配線板並びにプリント配線板用基板の製造方法
JP2016152405A (ja) * 2015-02-19 2016-08-22 住友電工プリントサーキット株式会社 プリント配線板用基材、プリント配線板及びプリント配線板用基材の製造方法
JP2019114681A (ja) * 2017-12-25 2019-07-11 住友電気工業株式会社 プリント配線板用基材及びプリント配線板
JP2020113706A (ja) * 2019-01-16 2020-07-27 旭化成株式会社 導電性パターン領域付構造体及びその製造方法

Also Published As

Publication number Publication date
JP7758168B2 (ja) 2025-10-22
CN118044340A (zh) 2024-05-14
WO2023189745A1 (ja) 2023-10-05

Similar Documents

Publication Publication Date Title
CL2026000253A1 (es) Instanciación del formato multifuente de medios codificados (cmmf) para el transporte de datos de medios.
BR102023012440A2 (https=)
BR102023010976A2 (https=)
BR102023009641A2 (https=)
JPWO2023189745A1 (https=)
CN307044619S (https=)
CN307045517S (https=)
CN307049822S (https=)
CN307049724S (https=)
CN307049560S (https=)
CN307049499S (https=)
CN307049392S (https=)
CN307049371S (https=)
CN307048567S (https=)
CN307048531S (https=)
CN307048096S (https=)
CN307047504S (https=)
CN307046924S (https=)
BY13172U (https=)
CN307045702S (https=)
BY13174U (https=)
CN307045454S (https=)
CN307045257S (https=)
CN307044919S (https=)
BY13163U (https=)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240311

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240311

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240903

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240925

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20241224

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250120

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250513

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20250909

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20250922

R150 Certificate of patent or registration of utility model

Ref document number: 7758168

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150