JP7758168B2 - プリント配線板用基板及びプリント配線板 - Google Patents

プリント配線板用基板及びプリント配線板

Info

Publication number
JP7758168B2
JP7758168B2 JP2024511831A JP2024511831A JP7758168B2 JP 7758168 B2 JP7758168 B2 JP 7758168B2 JP 2024511831 A JP2024511831 A JP 2024511831A JP 2024511831 A JP2024511831 A JP 2024511831A JP 7758168 B2 JP7758168 B2 JP 7758168B2
Authority
JP
Japan
Prior art keywords
sintered body
body layer
copper plating
layer
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024511831A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023189745A5 (https=
JPWO2023189745A1 (https=
Inventor
拓斗 部谷
宏介 三浦
勝成 御影
耕司 新田
良雄 岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Publication of JPWO2023189745A1 publication Critical patent/JPWO2023189745A1/ja
Publication of JPWO2023189745A5 publication Critical patent/JPWO2023189745A5/ja
Application granted granted Critical
Publication of JP7758168B2 publication Critical patent/JP7758168B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
JP2024511831A 2022-03-29 2023-03-17 プリント配線板用基板及びプリント配線板 Active JP7758168B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022053406 2022-03-29
JP2022053406 2022-03-29
PCT/JP2023/010645 WO2023189745A1 (ja) 2022-03-29 2023-03-17 プリント配線板用基板及びプリント配線板

Publications (3)

Publication Number Publication Date
JPWO2023189745A1 JPWO2023189745A1 (https=) 2023-10-05
JPWO2023189745A5 JPWO2023189745A5 (https=) 2024-06-04
JP7758168B2 true JP7758168B2 (ja) 2025-10-22

Family

ID=88201019

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024511831A Active JP7758168B2 (ja) 2022-03-29 2023-03-17 プリント配線板用基板及びプリント配線板

Country Status (3)

Country Link
JP (1) JP7758168B2 (https=)
CN (1) CN118044340A (https=)
WO (1) WO2023189745A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013135089A (ja) 2011-12-27 2013-07-08 Ishihara Chem Co Ltd 導電膜形成方法、銅微粒子分散液及び回路基板
JP2016058545A (ja) 2014-09-09 2016-04-21 住友電気工業株式会社 プリント配線板用基板、プリント配線板及びプリント配線板用基板の製造方法
JP2016152405A (ja) 2015-02-19 2016-08-22 住友電工プリントサーキット株式会社 プリント配線板用基材、プリント配線板及びプリント配線板用基材の製造方法
JP2019114681A (ja) 2017-12-25 2019-07-11 住友電気工業株式会社 プリント配線板用基材及びプリント配線板
JP2020113706A (ja) 2019-01-16 2020-07-27 旭化成株式会社 導電性パターン領域付構造体及びその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6484026B2 (ja) * 2014-12-22 2019-03-13 住友電気工業株式会社 プリント配線板用基板及びプリント配線板並びにプリント配線板用基板の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013135089A (ja) 2011-12-27 2013-07-08 Ishihara Chem Co Ltd 導電膜形成方法、銅微粒子分散液及び回路基板
JP2016058545A (ja) 2014-09-09 2016-04-21 住友電気工業株式会社 プリント配線板用基板、プリント配線板及びプリント配線板用基板の製造方法
JP2016152405A (ja) 2015-02-19 2016-08-22 住友電工プリントサーキット株式会社 プリント配線板用基材、プリント配線板及びプリント配線板用基材の製造方法
JP2019114681A (ja) 2017-12-25 2019-07-11 住友電気工業株式会社 プリント配線板用基材及びプリント配線板
JP2020113706A (ja) 2019-01-16 2020-07-27 旭化成株式会社 導電性パターン領域付構造体及びその製造方法

Also Published As

Publication number Publication date
CN118044340A (zh) 2024-05-14
JPWO2023189745A1 (https=) 2023-10-05
WO2023189745A1 (ja) 2023-10-05

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