CN118044340A - 印刷布线板用基板及印刷布线板 - Google Patents

印刷布线板用基板及印刷布线板 Download PDF

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Publication number
CN118044340A
CN118044340A CN202380013812.7A CN202380013812A CN118044340A CN 118044340 A CN118044340 A CN 118044340A CN 202380013812 A CN202380013812 A CN 202380013812A CN 118044340 A CN118044340 A CN 118044340A
Authority
CN
China
Prior art keywords
sintered body
body layer
copper plating
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380013812.7A
Other languages
English (en)
Chinese (zh)
Inventor
部谷拓斗
三浦宏介
御影胜成
新田耕司
冈良雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Publication of CN118044340A publication Critical patent/CN118044340A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
CN202380013812.7A 2022-03-29 2023-03-17 印刷布线板用基板及印刷布线板 Pending CN118044340A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022053406 2022-03-29
JP2022-053406 2022-03-29
PCT/JP2023/010645 WO2023189745A1 (ja) 2022-03-29 2023-03-17 プリント配線板用基板及びプリント配線板

Publications (1)

Publication Number Publication Date
CN118044340A true CN118044340A (zh) 2024-05-14

Family

ID=88201019

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380013812.7A Pending CN118044340A (zh) 2022-03-29 2023-03-17 印刷布线板用基板及印刷布线板

Country Status (3)

Country Link
JP (1) JP7758168B2 (https=)
CN (1) CN118044340A (https=)
WO (1) WO2023189745A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013135089A (ja) * 2011-12-27 2013-07-08 Ishihara Chem Co Ltd 導電膜形成方法、銅微粒子分散液及び回路基板
JP6466110B2 (ja) * 2014-09-09 2019-02-06 住友電気工業株式会社 プリント配線板用基板、プリント配線板及びプリント配線板用基板の製造方法
JP6484026B2 (ja) * 2014-12-22 2019-03-13 住友電気工業株式会社 プリント配線板用基板及びプリント配線板並びにプリント配線板用基板の製造方法
JP6400503B2 (ja) * 2015-02-19 2018-10-03 住友電工プリントサーキット株式会社 プリント配線板用基材及びプリント配線板
JP7032127B2 (ja) * 2017-12-25 2022-03-08 住友電気工業株式会社 プリント配線板用基材、プリント配線板及びプリント配線板用基材の製造方法
JP7208803B2 (ja) * 2019-01-16 2023-01-19 旭化成株式会社 導電性パターン領域付構造体及びその製造方法

Also Published As

Publication number Publication date
JP7758168B2 (ja) 2025-10-22
JPWO2023189745A1 (https=) 2023-10-05
WO2023189745A1 (ja) 2023-10-05

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