DE69033245T2 - Verfahren und vorrichtung zur herstellung von feinen leiterbahnen mit kleinen abständen - Google Patents
Verfahren und vorrichtung zur herstellung von feinen leiterbahnen mit kleinen abständenInfo
- Publication number
- DE69033245T2 DE69033245T2 DE69033245T DE69033245T DE69033245T2 DE 69033245 T2 DE69033245 T2 DE 69033245T2 DE 69033245 T DE69033245 T DE 69033245T DE 69033245 T DE69033245 T DE 69033245T DE 69033245 T2 DE69033245 T2 DE 69033245T2
- Authority
- DE
- Germany
- Prior art keywords
- copper
- cylinder
- wires
- fibers
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/14—Electrodes, e.g. composition, counter electrode for pad-plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Electroplating Methods And Accessories (AREA)
- Cell Electrode Carriers And Collectors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/311,212 US5024735A (en) | 1989-02-15 | 1989-02-15 | Method and apparatus for manufacturing interconnects with fine lines and spacing |
PCT/US1990/000835 WO1990009469A1 (en) | 1989-02-15 | 1990-02-14 | Method and apparatus for manufacturing interconnects with fine lines and spacing |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69033245D1 DE69033245D1 (de) | 1999-09-16 |
DE69033245T2 true DE69033245T2 (de) | 2000-03-16 |
Family
ID=23205900
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69033245T Expired - Lifetime DE69033245T2 (de) | 1989-02-15 | 1990-02-14 | Verfahren und vorrichtung zur herstellung von feinen leiterbahnen mit kleinen abständen |
Country Status (7)
Country | Link |
---|---|
US (1) | US5024735A (de) |
EP (1) | EP0458863B1 (de) |
JP (1) | JP3215412B2 (de) |
KR (1) | KR100204405B1 (de) |
AT (1) | ATE183250T1 (de) |
DE (1) | DE69033245T2 (de) |
WO (1) | WO1990009469A1 (de) |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5167747A (en) * | 1989-02-15 | 1992-12-01 | Kadija Igor V | Apparatus for manufacturing interconnects with fine lines and fine spacing |
US6303181B1 (en) | 1993-05-17 | 2001-10-16 | Electrochemicals Inc. | Direct metallization process employing a cationic conditioner and a binder |
US5690805A (en) * | 1993-05-17 | 1997-11-25 | Electrochemicals Inc. | Direct metallization process |
US5476580A (en) * | 1993-05-17 | 1995-12-19 | Electrochemicals Inc. | Processes for preparing a non-conductive substrate for electroplating |
US5725807A (en) * | 1993-05-17 | 1998-03-10 | Electrochemicals Inc. | Carbon containing composition for electroplating |
US6171468B1 (en) | 1993-05-17 | 2001-01-09 | Electrochemicals Inc. | Direct metallization process |
US6710259B2 (en) | 1993-05-17 | 2004-03-23 | Electrochemicals, Inc. | Printed wiring boards and methods for making them |
DE4418278C1 (de) * | 1994-05-26 | 1995-04-20 | Atotech Deutschland Gmbh | Elektrolytisches Verfahren zur Leiterplattenbehandlung in horizontalen Durchlaufanlagen |
EP0889680A3 (de) * | 1997-07-01 | 2000-07-05 | Deutsche Thomson-Brandt Gmbh | Verfahren zur Entfernung und/oder Aufbringung von leitendem Material |
US5975410A (en) * | 1997-09-02 | 1999-11-02 | Mcdonnell Douglas Corporation | Process of bonding a metal brush structure to a planar surface of a metal substrate |
US6939447B2 (en) * | 1998-04-06 | 2005-09-06 | Tdao Limited | Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method |
GB2336161B (en) * | 1998-04-06 | 2003-03-26 | John Michael Lowe | Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method |
US6176992B1 (en) * | 1998-11-03 | 2001-01-23 | Nutool, Inc. | Method and apparatus for electro-chemical mechanical deposition |
US6902659B2 (en) * | 1998-12-01 | 2005-06-07 | Asm Nutool, Inc. | Method and apparatus for electro-chemical mechanical deposition |
US7204924B2 (en) * | 1998-12-01 | 2007-04-17 | Novellus Systems, Inc. | Method and apparatus to deposit layers with uniform properties |
US7427337B2 (en) * | 1998-12-01 | 2008-09-23 | Novellus Systems, Inc. | System for electropolishing and electrochemical mechanical polishing |
US6413388B1 (en) * | 2000-02-23 | 2002-07-02 | Nutool Inc. | Pad designs and structures for a versatile materials processing apparatus |
US7204917B2 (en) | 1998-12-01 | 2007-04-17 | Novellus Systems, Inc. | Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same |
US6409904B1 (en) * | 1998-12-01 | 2002-06-25 | Nutool, Inc. | Method and apparatus for depositing and controlling the texture of a thin film |
US7425250B2 (en) * | 1998-12-01 | 2008-09-16 | Novellus Systems, Inc. | Electrochemical mechanical processing apparatus |
US7578923B2 (en) * | 1998-12-01 | 2009-08-25 | Novellus Systems, Inc. | Electropolishing system and process |
US6328872B1 (en) | 1999-04-03 | 2001-12-11 | Nutool, Inc. | Method and apparatus for plating and polishing a semiconductor substrate |
TW466729B (en) | 1999-07-26 | 2001-12-01 | Tokyo Electron Ltd | Plating method and device, and plating system |
US6355153B1 (en) * | 1999-09-17 | 2002-03-12 | Nutool, Inc. | Chip interconnect and packaging deposition methods and structures |
US6270646B1 (en) | 1999-12-28 | 2001-08-07 | International Business Machines Corporation | Electroplating apparatus and method using a compressible contact |
US20090020437A1 (en) * | 2000-02-23 | 2009-01-22 | Basol Bulent M | Method and system for controlled material removal by electrochemical polishing |
US6582579B1 (en) | 2000-03-24 | 2003-06-24 | Nutool, Inc. | Methods for repairing defects on a semiconductor substrate |
US6478936B1 (en) * | 2000-05-11 | 2002-11-12 | Nutool Inc. | Anode assembly for plating and planarizing a conductive layer |
US6921551B2 (en) * | 2000-08-10 | 2005-07-26 | Asm Nutool, Inc. | Plating method and apparatus for controlling deposition on predetermined portions of a workpiece |
US7754061B2 (en) * | 2000-08-10 | 2010-07-13 | Novellus Systems, Inc. | Method for controlling conductor deposition on predetermined portions of a wafer |
US20040170753A1 (en) * | 2000-12-18 | 2004-09-02 | Basol Bulent M. | Electrochemical mechanical processing using low temperature process environment |
US7172497B2 (en) * | 2001-01-05 | 2007-02-06 | Asm Nutool, Inc. | Fabrication of semiconductor interconnect structures |
JP2003062993A (ja) * | 2001-08-24 | 2003-03-05 | Toshiba Tec Corp | インクジェットプリンタヘッドおよびその製造方法 |
US20050040049A1 (en) * | 2002-09-20 | 2005-02-24 | Rimma Volodarsky | Anode assembly for plating and planarizing a conductive layer |
US7648622B2 (en) * | 2004-02-27 | 2010-01-19 | Novellus Systems, Inc. | System and method for electrochemical mechanical polishing |
WO2005089968A1 (en) * | 2004-03-17 | 2005-09-29 | Franco Fornasari | Conductive brush for cleaning metals |
KR100907841B1 (ko) | 2004-09-24 | 2009-07-14 | 이비덴 가부시키가이샤 | 도금 방법 및 도금 장치 |
US8500985B2 (en) * | 2006-07-21 | 2013-08-06 | Novellus Systems, Inc. | Photoresist-free metal deposition |
US20080237048A1 (en) * | 2007-03-30 | 2008-10-02 | Ismail Emesh | Method and apparatus for selective electrofilling of through-wafer vias |
WO2016130548A1 (en) | 2015-02-10 | 2016-08-18 | Arcanum Alloy Design, Inc. | Methods and systems for slurry coating |
TWM522954U (zh) * | 2015-12-03 | 2016-06-01 | 財團法人工業技術研究院 | 電沉積設備 |
WO2017201418A1 (en) | 2016-05-20 | 2017-11-23 | Arcanum Alloys, Inc. | Methods and systems for coating a steel substrate |
US10184189B2 (en) | 2016-07-18 | 2019-01-22 | ECSI Fibrotools, Inc. | Apparatus and method of contact electroplating of isolated structures |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2590927A (en) * | 1948-07-17 | 1952-04-01 | Westinghouse Electric Corp | Electrolytic method of removing burrs |
DE2150748C3 (de) * | 1971-10-12 | 1979-07-19 | Kernforschungsanlage Juelich Gmbh, 5170 Juelich | Verfahren und Vorrichtung zur elektrochemischen Bearbeitung der Oberflächen von festen Körpern |
JPS5952716B2 (ja) * | 1977-10-25 | 1984-12-21 | 凸版印刷株式会社 | めつき装置 |
US4159934A (en) * | 1977-12-05 | 1979-07-03 | Kadija Igor V | Selective plating brush applicator |
JPS56163839A (en) * | 1980-05-15 | 1981-12-16 | Inoue Japax Res Inc | Electric discharge machining apparatus |
JPS56169798A (en) * | 1980-05-31 | 1981-12-26 | Matsushita Electric Works Ltd | Plating apparatus |
JPS59185777A (ja) * | 1983-04-06 | 1984-10-22 | Ig Tech Res Inc | 金属表面に食刻模様を形成する方法 |
JPS63297588A (ja) * | 1987-05-29 | 1988-12-05 | Sagami Shokai:Kk | 孤立した導電体の電解メッキ法 |
JPS63297587A (ja) * | 1987-05-29 | 1988-12-05 | Sagami Shokai:Kk | 孤立した導電体の局所電解メッキ法およびその装置 |
-
1989
- 1989-02-15 US US07/311,212 patent/US5024735A/en not_active Expired - Lifetime
-
1990
- 1990-02-14 WO PCT/US1990/000835 patent/WO1990009469A1/en active IP Right Grant
- 1990-02-14 JP JP50356090A patent/JP3215412B2/ja not_active Expired - Lifetime
- 1990-02-14 KR KR1019910700942A patent/KR100204405B1/ko not_active IP Right Cessation
- 1990-02-14 DE DE69033245T patent/DE69033245T2/de not_active Expired - Lifetime
- 1990-02-14 AT AT90903489T patent/ATE183250T1/de not_active IP Right Cessation
- 1990-02-14 EP EP90903489A patent/EP0458863B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
ATE183250T1 (de) | 1999-08-15 |
JP3215412B2 (ja) | 2001-10-09 |
KR100204405B1 (ko) | 1999-06-15 |
WO1990009469A1 (en) | 1990-08-23 |
EP0458863A1 (de) | 1991-12-04 |
EP0458863B1 (de) | 1999-08-11 |
US5024735A (en) | 1991-06-18 |
DE69033245D1 (de) | 1999-09-16 |
EP0458863A4 (en) | 1992-07-08 |
KR920701527A (ko) | 1992-08-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69033245D1 (de) | Verfahren und vorrichtung zur herstellung von feinen leiterbahnen mit kleinen abständen | |
US3022230A (en) | Process for electroforming grooved and channeled bodies | |
MY119378A (en) | A copper foil for a printed circuit board, a process and an apparatus for producing the same | |
TW574437B (en) | Electrodeposition device and electrodeposition system for coating structures which have already been made conductive | |
GB2203451B (en) | Method and apparatus for making the inner crowns of composite-layered crowns for restoring crowns | |
ATE25114T1 (de) | Netzartige elektrode fuer die abscheidung von metallionen und verfahren zu deren herstellung. | |
ES8604321A1 (es) | Perfeccionamientos en electrodos conteniendo fibras | |
GB1098182A (en) | Electrolyte or electroless plating process | |
US5114558A (en) | Method and apparatus for manufacturing interconnects with fine lines and spacing | |
DE69602907D1 (de) | Verfahren zur Elektrolyse von Silber in Moebius-Zellen | |
SE7702863L (sv) | Hjelpelektrod for samlingsror for allvetska samt forfarande for att minska korrosion pa detta samlingsror | |
US3729389A (en) | Method of electroplating discrete conductive regions | |
ATE135417T1 (de) | Verfahren und vorrichtung zum elektrolytischen austragen von metallen aus einer metallionen enthaltenden lösung sowie elektrode zur durchführung des verfahrens | |
CN220224399U (zh) | 一种解镀电镀一体化电镀设备 | |
ATE58921T1 (de) | Verfahren und vorrichtung zur herstellung einer hauchduennen metallfolie durch galvanische beschichtung. | |
CN107761158A (zh) | 一种电镀设备及电镀方法 | |
KR930013211A (ko) | 전착에 의한 금속박의 연속 제조용 장치에 사용되는 반원통형 불용성 양극의 재생방법 | |
JPH0688285A (ja) | 金属の電着方法 | |
US3622284A (en) | Electrodeposition of metal over large nonconducting surfaces | |
JPS5943896A (ja) | 金属物の内面メツキ方法及び装置 | |
SU1125114A1 (ru) | Анодное устройство дл гальванического хонинговани | |
JPS56139689A (en) | Production of electrolytic copper foil | |
SU136146A1 (ru) | Способ нанесени гальванических покрытий на металлокерамические лампы и способ креплени ламп и подвода тока к ним в гальванической ванне | |
SU711183A1 (ru) | Способ электролитического осаждени паллади | |
JPS5938397A (ja) | 電気メツキ装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |