JPWO2024071007A5 - - Google Patents
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- Publication number
- JPWO2024071007A5 JPWO2024071007A5 JP2024549351A JP2024549351A JPWO2024071007A5 JP WO2024071007 A5 JPWO2024071007 A5 JP WO2024071007A5 JP 2024549351 A JP2024549351 A JP 2024549351A JP 2024549351 A JP2024549351 A JP 2024549351A JP WO2024071007 A5 JPWO2024071007 A5 JP WO2024071007A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- board according
- metal layer
- conductor
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022157395 | 2022-09-30 | ||
| JP2023088732 | 2023-05-30 | ||
| PCT/JP2023/034644 WO2024071007A1 (ja) | 2022-09-30 | 2023-09-25 | 配線基板およびそれを用いた実装構造体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024071007A1 JPWO2024071007A1 (https=) | 2024-04-04 |
| JPWO2024071007A5 true JPWO2024071007A5 (https=) | 2025-05-30 |
Family
ID=90477802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024549351A Withdrawn JPWO2024071007A1 (https=) | 2022-09-30 | 2023-09-25 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20260107383A1 (https=) |
| JP (1) | JPWO2024071007A1 (https=) |
| CN (1) | CN119896046A (https=) |
| TW (1) | TWI881482B (https=) |
| WO (1) | WO2024071007A1 (https=) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05251849A (ja) * | 1992-03-09 | 1993-09-28 | Matsushita Electric Works Ltd | 銅メタライズドセラミック基板の製造方法 |
| JPH09326547A (ja) * | 1996-06-04 | 1997-12-16 | Ibiden Co Ltd | プリント配線板の製造方法 |
| JP2004158703A (ja) * | 2002-11-07 | 2004-06-03 | Internatl Business Mach Corp <Ibm> | プリント配線板とその製造方法 |
| JP2005146328A (ja) * | 2003-11-13 | 2005-06-09 | Ebara Udylite Kk | 微細配線の製造方法 |
| JP5070767B2 (ja) * | 2006-08-28 | 2012-11-14 | トヨタ自動車株式会社 | めっき処理方法及びファインピッチ配線基板の製造方法 |
| JP2008192938A (ja) * | 2007-02-06 | 2008-08-21 | Kyocera Corp | 配線基板、実装構造体および配線基板の製造方法 |
| US9832883B2 (en) * | 2013-04-25 | 2017-11-28 | Intel Corporation | Integrated circuit package substrate |
| JP6543921B2 (ja) * | 2014-12-01 | 2019-07-17 | 大日本印刷株式会社 | 導電性基板 |
| US12127340B2 (en) * | 2019-09-30 | 2024-10-22 | Kyocera Corporation | Wiring substrate |
-
2023
- 2023-09-25 CN CN202380068050.0A patent/CN119896046A/zh not_active Withdrawn
- 2023-09-25 WO PCT/JP2023/034644 patent/WO2024071007A1/ja not_active Ceased
- 2023-09-25 US US19/116,741 patent/US20260107383A1/en active Pending
- 2023-09-25 JP JP2024549351A patent/JPWO2024071007A1/ja not_active Withdrawn
- 2023-09-27 TW TW112137146A patent/TWI881482B/zh active
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