TWI881482B - 配線基板及使用該配線基板之安裝構造體 - Google Patents

配線基板及使用該配線基板之安裝構造體 Download PDF

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Publication number
TWI881482B
TWI881482B TW112137146A TW112137146A TWI881482B TW I881482 B TWI881482 B TW I881482B TW 112137146 A TW112137146 A TW 112137146A TW 112137146 A TW112137146 A TW 112137146A TW I881482 B TWI881482 B TW I881482B
Authority
TW
Taiwan
Prior art keywords
layer
conductor
metal layer
insulating layer
hole
Prior art date
Application number
TW112137146A
Other languages
English (en)
Chinese (zh)
Other versions
TW202423202A (zh
Inventor
湯川英敏
Original Assignee
日商京瓷股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商京瓷股份有限公司 filed Critical 日商京瓷股份有限公司
Publication of TW202423202A publication Critical patent/TW202423202A/zh
Application granted granted Critical
Publication of TWI881482B publication Critical patent/TWI881482B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
TW112137146A 2022-09-30 2023-09-27 配線基板及使用該配線基板之安裝構造體 TWI881482B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2022157395 2022-09-30
JP2022-157395 2022-09-30
JP2023088732 2023-05-30
JP2023-088732 2023-05-30

Publications (2)

Publication Number Publication Date
TW202423202A TW202423202A (zh) 2024-06-01
TWI881482B true TWI881482B (zh) 2025-04-21

Family

ID=90477802

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112137146A TWI881482B (zh) 2022-09-30 2023-09-27 配線基板及使用該配線基板之安裝構造體

Country Status (5)

Country Link
US (1) US20260107383A1 (https=)
JP (1) JPWO2024071007A1 (https=)
CN (1) CN119896046A (https=)
TW (1) TWI881482B (https=)
WO (1) WO2024071007A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI228022B (en) * 2002-11-07 2005-02-11 Ibm Printed circuit board and manufacturing method thereof
US10390438B2 (en) * 2013-04-25 2019-08-20 Intel Corporation Integrated circuit package substrate
TWI763052B (zh) * 2019-09-30 2022-05-01 日商京瓷股份有限公司 配線基板

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05251849A (ja) * 1992-03-09 1993-09-28 Matsushita Electric Works Ltd 銅メタライズドセラミック基板の製造方法
JPH09326547A (ja) * 1996-06-04 1997-12-16 Ibiden Co Ltd プリント配線板の製造方法
JP2005146328A (ja) * 2003-11-13 2005-06-09 Ebara Udylite Kk 微細配線の製造方法
JP5070767B2 (ja) * 2006-08-28 2012-11-14 トヨタ自動車株式会社 めっき処理方法及びファインピッチ配線基板の製造方法
JP2008192938A (ja) * 2007-02-06 2008-08-21 Kyocera Corp 配線基板、実装構造体および配線基板の製造方法
JP6543921B2 (ja) * 2014-12-01 2019-07-17 大日本印刷株式会社 導電性基板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI228022B (en) * 2002-11-07 2005-02-11 Ibm Printed circuit board and manufacturing method thereof
US10390438B2 (en) * 2013-04-25 2019-08-20 Intel Corporation Integrated circuit package substrate
TWI763052B (zh) * 2019-09-30 2022-05-01 日商京瓷股份有限公司 配線基板

Also Published As

Publication number Publication date
JPWO2024071007A1 (https=) 2024-04-04
TW202423202A (zh) 2024-06-01
WO2024071007A1 (ja) 2024-04-04
US20260107383A1 (en) 2026-04-16
CN119896046A (zh) 2025-04-25

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