JPWO2023243619A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2023243619A5
JPWO2023243619A5 JP2024528866A JP2024528866A JPWO2023243619A5 JP WO2023243619 A5 JPWO2023243619 A5 JP WO2023243619A5 JP 2024528866 A JP2024528866 A JP 2024528866A JP 2024528866 A JP2024528866 A JP 2024528866A JP WO2023243619 A5 JPWO2023243619 A5 JP WO2023243619A5
Authority
JP
Japan
Prior art keywords
substrate
printed wiring
main surface
base film
conductive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024528866A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023243619A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/021821 external-priority patent/WO2023243619A1/ja
Publication of JPWO2023243619A1 publication Critical patent/JPWO2023243619A1/ja
Publication of JPWO2023243619A5 publication Critical patent/JPWO2023243619A5/ja
Pending legal-status Critical Current

Links

JP2024528866A 2022-06-16 2023-06-13 Pending JPWO2023243619A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022097564 2022-06-16
PCT/JP2023/021821 WO2023243619A1 (ja) 2022-06-16 2023-06-13 プリント配線板用基板及びプリント配線板

Publications (2)

Publication Number Publication Date
JPWO2023243619A1 JPWO2023243619A1 (https=) 2023-12-21
JPWO2023243619A5 true JPWO2023243619A5 (https=) 2025-02-26

Family

ID=89191327

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024528866A Pending JPWO2023243619A1 (https=) 2022-06-16 2023-06-13

Country Status (4)

Country Link
US (1) US20250365861A1 (https=)
JP (1) JPWO2023243619A1 (https=)
CN (1) CN119302042A (https=)
WO (1) WO2023243619A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4849284A (en) * 1987-02-17 1989-07-18 Rogers Corporation Electrical substrate material
US5055342A (en) * 1990-02-16 1991-10-08 International Business Machines Corporation Fluorinated polymeric composition, fabrication thereof and use thereof
JP6639775B2 (ja) * 2014-10-21 2020-02-05 住友電工プリントサーキット株式会社 樹脂フィルム、プリント配線板用カバーレイ、プリント配線板用基板及びプリント配線板
WO2019031071A1 (ja) * 2017-08-08 2019-02-14 住友電気工業株式会社 高周波プリント配線板用基材

Similar Documents

Publication Publication Date Title
CN101066005B (zh) 多层布线基板及其制造方法
US20140251656A1 (en) Wiring board and method for manufacturing the same
TWI484875B (zh) 電路板及電路板製作方法
JP2009088474A (ja) 印刷回路基板の層間導通方法
JP4963981B2 (ja) フレキシブルプリント配線板
CN102469691A (zh) 印刷电路板及其制造方法
TW201813458A (zh) 鏤空柔性電路板及製作方法
TWM568018U (zh) Circuit board structure for forming a connection terminal by using a solder-proof limited window
TWI682695B (zh) 利用防焊限定開窗形成連接端子之電路板結構
JPWO2023243619A5 (https=)
JP2005150552A (ja) 配線基板の製造方法
TWM450934U (zh) 軟性電路板
CN109757037A (zh) 高密度电路板及其制作方法
TWI511628B (zh) 承載電路板、承載電路板的製作方法及封裝結構
JPWO2021234875A5 (https=)
JP2021161516A5 (https=)
JPWO2023189745A5 (https=)
JPWO2023189744A5 (https=)
CN1728920A (zh) 线路连接结构及其制程
CN216134641U (zh) 一种迷你led玻璃基印制板结构
CN206212398U (zh) 具细线路的超薄电路板
TW592007B (en) Build-up circuit board with conductive barrier structure and method for fabricating the same
CN107466168B (zh) 具细线路的电路板及其制作方法
CN104012186A (zh) 用于存储卡的印刷电路板及其制造方法
TW201415978A (zh) 線路層之製法