JPWO2023243619A5 - - Google Patents
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- Publication number
- JPWO2023243619A5 JPWO2023243619A5 JP2024528866A JP2024528866A JPWO2023243619A5 JP WO2023243619 A5 JPWO2023243619 A5 JP WO2023243619A5 JP 2024528866 A JP2024528866 A JP 2024528866A JP 2024528866 A JP2024528866 A JP 2024528866A JP WO2023243619 A5 JPWO2023243619 A5 JP WO2023243619A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- printed wiring
- main surface
- base film
- conductive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 9
- 239000002245 particle Substances 0.000 claims 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 5
- 229910052802 copper Inorganic materials 0.000 claims 5
- 239000010949 copper Substances 0.000 claims 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 4
- 238000007747 plating Methods 0.000 claims 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 239000000945 filler Substances 0.000 claims 2
- 229910052757 nitrogen Inorganic materials 0.000 claims 2
- -1 polytetrafluoroethylene Polymers 0.000 claims 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims 1
- 239000004810 polytetrafluoroethylene Substances 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022097564 | 2022-06-16 | ||
| PCT/JP2023/021821 WO2023243619A1 (ja) | 2022-06-16 | 2023-06-13 | プリント配線板用基板及びプリント配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023243619A1 JPWO2023243619A1 (https=) | 2023-12-21 |
| JPWO2023243619A5 true JPWO2023243619A5 (https=) | 2025-02-26 |
Family
ID=89191327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024528866A Pending JPWO2023243619A1 (https=) | 2022-06-16 | 2023-06-13 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250365861A1 (https=) |
| JP (1) | JPWO2023243619A1 (https=) |
| CN (1) | CN119302042A (https=) |
| WO (1) | WO2023243619A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4849284A (en) * | 1987-02-17 | 1989-07-18 | Rogers Corporation | Electrical substrate material |
| US5055342A (en) * | 1990-02-16 | 1991-10-08 | International Business Machines Corporation | Fluorinated polymeric composition, fabrication thereof and use thereof |
| JP6639775B2 (ja) * | 2014-10-21 | 2020-02-05 | 住友電工プリントサーキット株式会社 | 樹脂フィルム、プリント配線板用カバーレイ、プリント配線板用基板及びプリント配線板 |
| CN110024492B (zh) * | 2017-08-08 | 2022-05-06 | 住友电气工业株式会社 | 高频印刷线路板用基材 |
-
2023
- 2023-06-13 CN CN202380046857.4A patent/CN119302042A/zh active Pending
- 2023-06-13 JP JP2024528866A patent/JPWO2023243619A1/ja active Pending
- 2023-06-13 US US18/872,378 patent/US20250365861A1/en active Pending
- 2023-06-13 WO PCT/JP2023/021821 patent/WO2023243619A1/ja not_active Ceased
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