JPWO2024090336A1 - - Google Patents
Info
- Publication number
- JPWO2024090336A1 JPWO2024090336A1 JP2024553013A JP2024553013A JPWO2024090336A1 JP WO2024090336 A1 JPWO2024090336 A1 JP WO2024090336A1 JP 2024553013 A JP2024553013 A JP 2024553013A JP 2024553013 A JP2024553013 A JP 2024553013A JP WO2024090336 A1 JPWO2024090336 A1 JP WO2024090336A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022173508 | 2022-10-28 | ||
| PCT/JP2023/037966 WO2024090336A1 (ja) | 2022-10-28 | 2023-10-20 | 配線基板およびそれを用いた実装構造体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024090336A1 true JPWO2024090336A1 (https=) | 2024-05-02 |
| JPWO2024090336A5 JPWO2024090336A5 (https=) | 2025-07-01 |
Family
ID=90830821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024553013A Withdrawn JPWO2024090336A1 (https=) | 2022-10-28 | 2023-10-20 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2024090336A1 (https=) |
| TW (1) | TW202428076A (https=) |
| WO (1) | WO2024090336A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004158703A (ja) * | 2002-11-07 | 2004-06-03 | Internatl Business Mach Corp <Ibm> | プリント配線板とその製造方法 |
| SG126776A1 (en) * | 2005-04-08 | 2006-11-29 | 3M Innovative Properties Co | Flexible circuit substrate |
| JP2008192938A (ja) * | 2007-02-06 | 2008-08-21 | Kyocera Corp | 配線基板、実装構造体および配線基板の製造方法 |
-
2023
- 2023-10-20 JP JP2024553013A patent/JPWO2024090336A1/ja not_active Withdrawn
- 2023-10-20 WO PCT/JP2023/037966 patent/WO2024090336A1/ja not_active Ceased
- 2023-10-25 TW TW112140904A patent/TW202428076A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024090336A1 (ja) | 2024-05-02 |
| TW202428076A (zh) | 2024-07-01 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250414 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250414 |
|
| RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20250521 |
|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20260105 |