TW202428076A - 配線基板及使用該配線基板之安裝構造體 - Google Patents

配線基板及使用該配線基板之安裝構造體 Download PDF

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Publication number
TW202428076A
TW202428076A TW112140904A TW112140904A TW202428076A TW 202428076 A TW202428076 A TW 202428076A TW 112140904 A TW112140904 A TW 112140904A TW 112140904 A TW112140904 A TW 112140904A TW 202428076 A TW202428076 A TW 202428076A
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TW
Taiwan
Prior art keywords
layer
conductor
insulating layer
hole
nickel
Prior art date
Application number
TW112140904A
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English (en)
Chinese (zh)
Inventor
湯川英敏
Original Assignee
日商京瓷股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商京瓷股份有限公司 filed Critical 日商京瓷股份有限公司
Publication of TW202428076A publication Critical patent/TW202428076A/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
TW112140904A 2022-10-28 2023-10-25 配線基板及使用該配線基板之安裝構造體 TW202428076A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022173508 2022-10-28
JP2022-173508 2022-10-28

Publications (1)

Publication Number Publication Date
TW202428076A true TW202428076A (zh) 2024-07-01

Family

ID=90830821

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112140904A TW202428076A (zh) 2022-10-28 2023-10-25 配線基板及使用該配線基板之安裝構造體

Country Status (3)

Country Link
JP (1) JPWO2024090336A1 (https=)
TW (1) TW202428076A (https=)
WO (1) WO2024090336A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004158703A (ja) * 2002-11-07 2004-06-03 Internatl Business Mach Corp <Ibm> プリント配線板とその製造方法
SG126776A1 (en) * 2005-04-08 2006-11-29 3M Innovative Properties Co Flexible circuit substrate
JP2008192938A (ja) * 2007-02-06 2008-08-21 Kyocera Corp 配線基板、実装構造体および配線基板の製造方法

Also Published As

Publication number Publication date
JPWO2024090336A1 (https=) 2024-05-02
WO2024090336A1 (ja) 2024-05-02

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