WO2023282350A1 - プリント配線板 - Google Patents

プリント配線板 Download PDF

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Publication number
WO2023282350A1
WO2023282350A1 PCT/JP2022/027124 JP2022027124W WO2023282350A1 WO 2023282350 A1 WO2023282350 A1 WO 2023282350A1 JP 2022027124 W JP2022027124 W JP 2022027124W WO 2023282350 A1 WO2023282350 A1 WO 2023282350A1
Authority
WO
WIPO (PCT)
Prior art keywords
opening
conductor layer
printed wiring
wiring board
protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/027124
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
賢治 高橋
将一郎 酒井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to US18/278,253 priority Critical patent/US20240147612A1/en
Priority to JP2023533201A priority patent/JP7485223B2/ja
Priority to CN202280012700.5A priority patent/CN116803219A/zh
Publication of WO2023282350A1 publication Critical patent/WO2023282350A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0352—Differences between the conductors of different layers of a multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Definitions

  • printed wiring boards are known in which conductive layers are formed on the front and back surfaces of a base material (see, for example, Japanese Patent Application Laid-Open No. 2019-197750).
  • FIG. 1 is a schematic partial cross-sectional view of a printed wiring board according to Embodiment 1.
  • FIG. FIG. 2 is a partially enlarged schematic cross-sectional view of the printed wiring board shown in FIG.
  • FIG. 3 is a schematic cross-sectional view for explaining a method of manufacturing the printed wiring board shown in FIG.
  • FIG. 4 is a schematic cross-sectional view for explaining a method of manufacturing the printed wiring board shown in FIG.
  • FIG. 5 is a schematic cross-sectional view for explaining the method of manufacturing the printed wiring board shown in FIG.
  • FIG. 6 is a schematic cross-sectional view for explaining the method of manufacturing the printed wiring board shown in FIG.
  • FIG. 7 is a schematic partial cross-sectional view showing a first modification of the printed wiring board shown in FIG. FIG.
  • the through hole is formed in the base material.
  • a portion of the conductor layer is filled inside the through hole.
  • a part of the conductor layer filled in the through hole electrically connects the conductor layer on the front surface side and the conductor layer on the back surface side of the substrate.
  • the width of the through-hole gradually decreases from the front surface side to the back surface side of the base material in order to suppress the occurrence of voids in the conductive layer inside the through-hole.
  • a printed wiring board of the present disclosure includes a base material and a conductor layer.
  • the substrate has a first surface and a second surface opposite the first surface.
  • a through-hole is formed in the base material to reach the second surface from the first surface.
  • a first opening which is an open end of the through hole, is formed on the first surface of the base material.
  • a second opening which is the open end of the through-hole, is formed on the second surface of the base material.
  • the conductor layer is arranged at least inside the through hole.
  • the base material includes a first protrusion.
  • the first protrusion protrudes from the edge of the first opening.
  • the first opening has a first opening width in a first cross section along the thickness direction of the substrate passing through the first protrusion and the center of the first opening.
  • the second opening has a second opening width in the first cross section. The first opening width is smaller than the second opening width.
  • the first opening width can be made smaller than the second opening width without significantly changing the width of the through-hole by forming the first protrusion at the edge of the first opening. Therefore, when forming the conductor layer inside the through hole, the conductor layer can be formed so as to close the through hole on the first opening side. After that, inside the through-hole, a conductor layer can be grown from the first opening side toward the second opening side. Therefore, it is possible to suppress the occurrence of voids due to blockage of the first opening side and the second opening side before the inside of the through hole is filled with the conductor layer.
  • the width of the through hole can be adjusted as in the case where the side wall of the through hole is inclined to make the first opening width narrower than the second opening width.
  • the inner wall itself is inclined with respect to the first plane. Therefore, the problem that the width of the second opening becomes excessively larger than that of the first opening due to the inclination of the inner wall of the through hole with respect to the first surface does not occur. Therefore, by making the width of the second opening on the second surface smaller than before, the area occupied by the through hole can be made smaller than before. As a result, it is possible to realize a printed wiring board with miniaturized through-holes while suppressing the generation of voids.
  • the inner wall of the through hole is positioned with respect to the first surface so that the width of the through hole increases from the first opening toward the second opening. It may be slanted. In this case, the generation of voids inside the through-hole can be further suppressed. In addition, since the first opening width is adjusted by the first protrusion, the effect of suppressing the generation of voids can be obtained even if the inclination angle of the inner wall of the through hole is minimized.
  • the first protrusion may include a first conductor layer having a material different from that of the conductor layer.
  • the conductive layer can be easily formed on the surface of the first protrusion using an electroplating method.
  • the first conductor layer may extend to a region adjacent to the first opening on the first surface of the base material.
  • the conductor layer can be easily formed on the first surface of the base material by electroplating.
  • the material forming the first conductor layer may contain nickel (Ni) or chromium (Cr).
  • the material forming the conductor layer may include, for example, copper (Cu).
  • the first conductor layer can be used as a base for forming the conductor layer. Therefore, the conductor layer can be easily formed so as to cover the first protrusion.
  • the material forming the second conductor layer may contain nickel (Ni) or chromium (Cr).
  • the second conductor layer can be used as a base for forming the conductor layer. Therefore, the conductor layer can be easily formed so as to cover the second protrusion.
  • the projection length of the first projection in the first radial direction from the first projection toward the center of the first opening is 0.1 ⁇ m or more and 5 ⁇ m. It may be below. In this case, when the conductor layer is formed inside the through-hole, the first opening side can be closed with the conductor layer before the second opening side.
  • the projection length of the first projection may be 0.1% or more and 10% or less of the width of the first opening. Also in this case, when forming the conductor layer inside the through-hole, the first opening side can be closed with the conductor layer before the second opening side.
  • FIG. 1 is a schematic partial cross-sectional view of a printed wiring board according to Embodiment 1.
  • FIG. 2 is a partially enlarged schematic cross-sectional view of the printed wiring board shown in FIG.
  • printed wiring board 1 includes base material 2 and conductor layer 4 .
  • the base material 2 has a first surface 2a and a second surface 2b opposite to the first surface 2a.
  • a through hole 3 is formed in the base material 2 to reach the second surface 2b from the first surface 2a. That is, the base material 2 has through holes 3 .
  • the first convex portion 31 is formed so as to extend in the direction along the first surface 2a.
  • the first projection 31 is formed to extend from the edge of the first opening 3a toward the center 3aa of the first opening 3a.
  • the first convex portion 31 is in a state of being embedded in the conductor layer 4 .
  • the first opening 3a has a first opening width W1 in the first cross section along the thickness direction of the base material 2 passing through the cross section shown in FIG. have.
  • the second opening 3b has a second opening width W2 in the first cross section shown in FIG.
  • the second opening width W2 is the width of the second opening 3b in a cross section along the thickness direction of the substrate 2 passing through the center 3ba of the second opening 3b.
  • the first opening width W1 is smaller than the second opening width W2.
  • the first opening width W1 and the second opening width W2 are, for example, 10 ⁇ m or more and 150 ⁇ m or less.
  • the electric resistance of the conductor layer 4 in the through hole 3 is increased.
  • the first opening width W1 and the second opening width W2 exceed 150 ⁇ m, there is a possibility that this may hinder the space saving of the circuit formed on the printed wiring board 1 .
  • the first opening width W1 and the second opening width W2 are preferably 15 ⁇ m or more and 100 ⁇ m or less.
  • the first opening width W1 and the second opening width W2 are more preferably 20 ⁇ m or more and 75 ⁇ m or less.
  • the protrusion length W3 of the first protrusion 31 in the first radial direction from the first protrusion 31 toward the center 3aa of the first opening 3a is 0.1 ⁇ m. It is more than 5 micrometers or less.
  • the projection length W3 of the first convex portion 31 may be 0.2 ⁇ m or more and 3 ⁇ m or less, 0.3 ⁇ m or more and 1.0 ⁇ m or less, or 0.4 ⁇ m or more and 0.8 ⁇ m or less. good.
  • the projection length W3 of the first convex portion 31 is 0.1% or more and 10% or less of the first opening width W1.
  • the projection length W3 of the first projection 31 may be 0.2% or more and 8% or less of the first opening width W1, or may be 0.3% or more and 5% or less, or 0.5%. It may be more than 3% or less.
  • the shape of the first projection 31 can be any shape as long as it protrudes from the edge of the first opening 3a.
  • the first protrusion 31 may be sheet-like or plate-like.
  • the thickness of the first convex portion 31 may be 0.1 ⁇ m or less.
  • the first protrusion 31 may have one or more bends.
  • the tip of the first projection 31 may have a bend so as to extend downward.
  • the thickness of the first convex portion 31 may decrease with distance from the edge of the first opening 3a.
  • the second thickness at a position distant from the first position as viewed from the edge of the first opening 3a is greater than the first thickness at the first position relatively close to the edge of the first opening 3a. It may be thick.
  • the conductor layer 4 includes a base conductor layer 4a extending from the inside of the through hole 3 onto the first surface or the second surface of the base material 2, and an upper conductor disposed on the base conductor layer 4a. layer 4b.
  • An electroless plated layer for example, can be used as the base conductor layer 4a.
  • An electroplated layer can be used as the upper conductor layer 4b.
  • the materials forming the base conductor layer 4a and the upper conductor layer 4b may be the same material or may be different materials. Any metal can be used as the material, and for example, copper or a copper alloy can be used.
  • the substrate 2 is a laminate of the base film 20, the first conductor layer 21, and the second conductor layer 22 as described above.
  • the first conductor layer 21 may include, for example, a first layer containing nickel and chromium formed on the back surface of the base film 20 and a second layer laminated on the first layer.
  • a metal layer such as copper can be used as the second layer.
  • a metal layer forming the second layer is formed by, for example, a sputtering method.
  • the through hole 3 and the first projection 31 may be formed using a chemical solution or the like.
  • the structure of the base material 2 includes a first surface layer forming the first surface 2a, a second surface layer forming the second surface 2b, and a A multilayer structure consisting of an intermediate layer may be employed. A material different from that of the first surface layer, the second surface layer and the intermediate layer may be used.
  • the step (S3) of forming the base conductor layer 4a on the surface of the base material 2 in which the through holes 3 are formed is performed.
  • the base conductor layer 4a is formed so as to cover the inside of the through-hole 3, the first convex portion 31, the first surface 2a and the second surface 2b.
  • any method for forming underlying conductor layer 4a any method can be used, and for example, electroless plating can be used.
  • the step (S4) of forming the upper conductor layer 4b is performed.
  • the upper conductor layer 4b is formed on the base conductor layer 4a. Any method can be used to form the upper conductor layer 4b, and for example, an electroplating method can be used.
  • the first opening width W1 is narrower than the second opening width W2 in the through hole 3 because the first protrusion 31 is formed. Therefore, as shown in FIG. 6, the through hole 3 is first closed by the upper conductor layer 4b on the side of the first opening 3a. After that, the upper conductor layer 4b is formed from the first opening 3a side toward the second opening 3b side.
  • the inside of the through-hole 3 is filled with the upper conductor layer 4b, and the generation of voids can be suppressed.
  • the printed wiring board 1 shown in FIG. 1 can be obtained.
  • Printed wiring board 1 includes base material 2 and conductor layer 4 .
  • the base material 2 has a first surface 2a and a second surface 2b opposite to the first surface 2a.
  • a through hole 3 is formed in the base material 2 to reach the second surface 2b from the first surface 2a.
  • a first opening 3a which is an opening end of the through hole 3, is formed in the first surface 2a of the base material 2.
  • a second opening 3b which is the opening end of the through hole 3, is formed on the second surface 2b of the base material 2.
  • the conductor layer 4 is arranged at least inside the through hole 3 .
  • the base material 2 includes first protrusions 31 .
  • the first protrusion 31 protrudes from the edge of the first opening 3a.
  • the first opening 3a has a first opening width W1 in a first cross section along the thickness direction of the base material 2 passing through the first projection 31 and the center 3aa of the first opening.
  • the second opening 3b has a second opening width W2 in the first cross section.
  • the first opening width W1 is smaller than the second opening width W2.
  • the width of the first opening W1 can be reduced to a maximum value without significantly changing the width of the central portion of the through hole 3 in the extending direction. 2 It can be made smaller than the opening width W2. Therefore, when forming the conductor layer 4 inside the through hole 3, the conductor layer 4 can be formed so as to close the through hole 3 on the first opening 3a side. After that, inside the through hole 3, the conductor layer 4 can be grown from the side of the first opening 3a toward the side of the second opening 3b. Therefore, before the inside of the through hole 3 is filled with the conductor layer 4, it is possible to prevent the first opening 3a side and the second opening 3b side from being closed to form a void.
  • the inner wall 3c of the through hole 3 is inclined to make the first opening width W1 narrower than the second opening width W2.
  • the problem that the second opening width W2 becomes excessively larger than the first opening width W1 due to the inclination of the inner wall 3c of the through hole 3 with respect to the first surface 2a does not occur. Therefore, by making the width (second opening width W2) of the second opening 3b on the second surface 2b smaller than before, the area occupied by the through hole 3 can be made smaller than before. As a result, it is possible to realize printed wiring board 1 in which through holes 3 are miniaturized while suppressing the generation of voids.
  • the first convex portion 31 includes the first conductor layer 21 having a material different from that of the conductor layer 4 .
  • the conductor layer 4 can be easily formed on the surfaces of the first protrusions 31 by electroplating.
  • the first conductor layer 21 may extend to a region adjacent to the first opening 3a on the first surface of the base material 2 .
  • the conductor layer 4 can be easily formed on the first surface 2a of the base material 2 by electroplating.
  • the first convex portion 31 may extend in the direction along the first surface 2a. In this case, the first opening width W1 can be reliably reduced by the first convex portion 31 .
  • the projection length W3 of the first projection in the first radial direction from the first projection 31 toward the center 3aa of the first opening 3a may be 0.1 ⁇ m or more and 5 ⁇ m or less. Moreover, in the printed wiring board 1 described above, the projection length W3 of the first projection 31 may be 0.1% or more and 10% or less of the first opening width W1. In this case, when the conductor layer 4 is formed inside the through hole 3, the conductor layer 4 can block the first opening 3a side before the second opening 3b side. Therefore, it is possible to suppress the occurrence of voids in the conductor layer 4 inside the through hole 3 .
  • FIG. 7 is a schematic partial cross-sectional view showing a first modification of printed wiring board 1 shown in FIG.
  • the printed wiring board 1 shown in FIG. 7 basically has the same configuration as the printed wiring board 1 shown in FIGS. It is different from the wiring board 1.
  • the base material 2 includes a second protrusion 32 that protrudes from the edge of the second opening 3b.
  • the edge portion of the second opening 3b is an annular line where a virtual plane extending the inner wall 3c of the second opening 3b toward the second surface 2b intersects the second surface 2b. It is a portion of the base material 2 that surrounds the loop line from the outer peripheral side and is adjacent to the loop line.
  • the second protrusion 32 includes a second conductor layer 22 having a material different from that of the conductor layer 4 .
  • the width (second opening width W2) of the second opening 3b in the second section passing through the second protrusion 32 and the center 3ba of the second opening 3b is larger than the first opening width W1. That is, the second cross section shown in FIG. 7 is substantially the same cross section as the first cross section shown in FIG.
  • the second convex portion 32 extends in a direction along the second surface 2b.
  • the second protrusion 32 is formed to extend from the edge of the second opening 3b toward the center 3ba of the second opening 3b.
  • the shape of the second protrusion 32 may be basically the same as the shape of the first protrusion 31 . Both the first protrusion 31 and the second protrusion 32 may be embedded in the conductor layer 4 .
  • the projection length W4 of the second protrusion 32 may be 0.2% or more and 8% or less of the second opening width W2, may be 0.3% or more and 5% or less, or may be 0.5%. It may be more than 3% or less. In this case, the conductor layer 4 can be easily formed so as to cover the periphery of the second convex portion 32 .
  • FIG. 8 is a schematic partial cross-sectional view showing a second modification of the printed wiring board shown in FIG.
  • FIG. 9 is a partially enlarged schematic cross-sectional view of the printed wiring board shown in FIG.
  • the printed wiring board 1 shown in FIGS. 8 and 9 basically has the same configuration as the printed wiring board 1 shown in FIGS. It differs from the printed wiring board 1 shown.
  • first convex portion 31 extends in a direction intersecting first surface 2a.
  • the first projection 31 extends away from the first surface 2a in the direction perpendicular to the first surface 2a as it approaches the center 3aa of the first opening 3a from the edge of the first opening 3a. In this case as well, the first projection 31 protrudes from the edge of the first opening 3a, so that the first opening width W1 can be reduced by the first projection 31.
  • FIG. 8 is a schematic partial cross-sectional view showing a second modification of the printed wiring board shown in FIG.
  • FIG. 9 is a partially enlarged schematic cross-sectional view
  • the projection length of the first projection 31 is the length shown in FIG.
  • the average value of length A and length B can be used.
  • the length A is the length of the member forming the first surface portion facing the inside of the through hole 3 in the first protrusion 31 (the base film 20 forming the first protrusion 31 in FIG. 9). ) from the inner wall of the through-hole 3. That is, as shown in FIG. 9, the length A extends from the connecting portion between the inner wall of the through-hole 3 and the first convex portion 31 to the connecting portion of the member constituting the first surface portion of the first convex portion 31. It is the distance from the part to the farthest part (tip).
  • the length B is the length of the member that constitutes the second surface portion located on the opposite side of the first surface portion of the first projection 31 (the first projection 31 in FIG. 9). part of the first conductor layer 21) from the first surface 2a. That is, as shown in FIG. 9, the length B is a member that forms the second surface portion of the first convex portion 31 from the connecting portion between the flat region of the first surface 2a and the first convex portion 31. is the distance from the connecting part to the farthest part (tip part).
  • the protruding length of the first convex portion 31 described above can also be applied when the first convex portion 31 has a bent portion.
  • the first convex portion 31 Let the average value of the distance from the said connection part to the farthest part (tip part) be the protrusion length of the 1st convex part 31. As shown in FIG.
  • the protrusion height T2 of the first protrusion 31 in the direction perpendicular to the first surface 2a is 0.01 ⁇ m or more and 1 ⁇ m or less.
  • the protrusion height T2 of the first protrusion 31 may be 0.02 ⁇ m or more and 0.8 ⁇ m or less, 0.03 ⁇ m or more and 0.7 ⁇ m or less, or 0.04 ⁇ m or more and 0.6 ⁇ m or less.
  • the protrusion height T2 of the first protrusion 31 is 0.01% or more and 10% or less of the thickness T1 (see FIG. 1) of the base material 2 .
  • the protrusion height T2 of the first protrusion 31 may be 0.02% or more and 8% or less of the thickness T1 of the base material 2, or may be 0.03% or more and 5% or less, or 0.05%. % or more and 3% or less.
  • the conductor layer 4 can be easily formed so as to cover the first protrusions 31 .
  • FIG. 10 is a schematic partial cross-sectional view showing a third modification of the printed wiring board shown in FIG.
  • the printed wiring board 1 shown in FIG. 10 basically has the same configuration as the printed wiring board 1 shown in FIG. there is Specifically, in printed wiring board 1 shown in FIG. 10, second protrusion 32 extends in a direction intersecting second surface 2b. The second protrusion 32 extends away from the second surface 2b in the direction perpendicular to the second surface 2b as it approaches the center 3ba of the second opening 3b from the edge of the second opening 3b.
  • the protrusion length of the second protrusion 32 is equal to the length C shown in FIG. It can be an average value with the length D.
  • the length C is the length of the member forming the third surface portion facing the inside of the through hole 3 in the second protrusion 32 (the base film 20 forming the second protrusion 32 in FIG. 10). ) from the inner wall of the through-hole 3. That is, as shown in FIG. 10, the length C extends from the connecting portion between the inner wall of the through-hole 3 and the second convex portion 32 to the connecting portion of the member constituting the third surface portion of the second convex portion 32 .
  • the second convex portion 32 Let the average value of the distance from the said connection part to the farthest part (tip part) be the protrusion length of the 2nd convex part 32. As shown in FIG.
  • a protrusion height T3 of the second protrusion 32 in the direction perpendicular to the second surface 2b is 0.01 ⁇ m or more and 1 ⁇ m or less.
  • the protrusion height T3 of the second protrusion 32 may be 0.02 ⁇ m or more and 0.8 ⁇ m or less, may be 0.03 ⁇ m or more and 0.7 ⁇ m or less, or may be 0.04 ⁇ m or more and 0.6 ⁇ m or less.
  • protrusion height T3 of second protrusion 32 is 0.01% or more and 10% or less of thickness T1 (see FIG. 1) of base material 2 .
  • the protrusion height T3 of the second protrusion 32 may be 0.02% or more and 8% or less of the thickness T1 of the base material 2, or may be 0.03% or more and 5% or less, or may be 0.05%. % or more and 3% or less.
  • the conductor layer 4 can be easily formed so as to cover the second protrusions 32 .
  • the conductor layer 4 can be reliably grown from the first opening 3a side, the occurrence of voids inside the through hole 3 can be further suppressed. Since the first opening width W1 is adjusted by the first convex portion 31, even if the inclination angle of the inner wall 3c of the through hole 3 is minimized, the effect of suppressing the generation of voids can be obtained.
  • ⁇ Modification> 12 is a schematic partial cross-sectional view showing a first modification of the printed wiring board shown in FIG. 11.
  • FIG. The printed wiring board 1 shown in FIG. 12 basically has the same configuration as the printed wiring board 1 shown in FIG. there is Specifically, in printed wiring board 1 shown in FIG. 12 , base material 2 includes second protrusion 32 that protrudes from the edge of second opening 3b.
  • the configuration of second convex portion 32 in printed wiring board 1 shown in FIG. 12 is the same as the configuration of second convex portion 32 in printed wiring board 1 shown in FIG.
  • Samples 1 to 4 were prepared. Samples 1 to 4 are printed wiring boards having 100 through holes. The configurations of the through-holes of samples 1, 2 and 3 are basically the same as the configuration of through-hole 3 shown in FIGS.
  • Samples 1, 2, and 3 are formed so that the projection length W3 of the first convex portion 31 is different. That is, the protrusion length W3 of the first convex portion 31 in Sample 1 is 0.05 ⁇ m.
  • the projection length W3 of the first convex portion 31 in Sample 2 is 0.1 ⁇ m.
  • the projection length W3 of the first convex portion 31 in Sample 3 is 0.5 ⁇ m.
  • the through-hole of sample 4 does not have the first projection as shown in FIG.
  • the through-hole of the sample 4 has a second opening width on the second surface 2b side that is wider than a first opening width on the first surface 2a side.
  • the through-hole of the sample 4 has an inner wall inclined with respect to the first surface 2a.
  • Table 1 shows the presence or absence of the first protrusion, the length of protrusion of the first protrusion, the first opening width W1, the second opening width W2, and the void generation rate for each sample.
  • the projection length of the first convex portion, the first opening width, and the second opening width are average values of data of 100 through-holes in each sample.
  • Samples 1 to 3 of Examples have a lower void generation rate than Sample 4.
  • sample 2 and sample 3 have lower void generation rates than sample 1.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
PCT/JP2022/027124 2021-07-09 2022-07-08 プリント配線板 Ceased WO2023282350A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US18/278,253 US20240147612A1 (en) 2021-07-09 2022-07-08 Printed wiring board
JP2023533201A JP7485223B2 (ja) 2021-07-09 2022-07-08 プリント配線板
CN202280012700.5A CN116803219A (zh) 2021-07-09 2022-07-08 印刷布线板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-114335 2021-07-09
JP2021114335 2021-07-09

Publications (1)

Publication Number Publication Date
WO2023282350A1 true WO2023282350A1 (ja) 2023-01-12

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JP (1) JP7485223B2 (https=)
CN (1) CN116803219A (https=)
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Citations (3)

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JP2002198461A (ja) * 2000-12-27 2002-07-12 Sumitomo Metal Electronics Devices Inc プラスチックパッケージ及びその製造方法
KR20150011466A (ko) * 2013-07-23 2015-02-02 주식회사 이수엑사보드 필 도금된 동박 적층판 및 그 도금법
JP2016201416A (ja) * 2015-04-08 2016-12-01 日立化成株式会社 多層配線基板の製造方法

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US4964947A (en) * 1989-01-20 1990-10-23 Casio Computer Co., Ltd. Method of manufacturing double-sided wiring substrate
JP3395621B2 (ja) * 1997-02-03 2003-04-14 イビデン株式会社 プリント配線板及びその製造方法
JP2006229034A (ja) * 2005-02-18 2006-08-31 Toshiba Corp 配線基板とその製造方法
JP2006319314A (ja) 2005-04-13 2006-11-24 Kyocera Corp 回路基板および回路基板の製造方法
US7557304B2 (en) * 2006-11-08 2009-07-07 Motorola, Inc. Printed circuit board having closed vias
US8102057B2 (en) * 2006-12-27 2012-01-24 Hewlett-Packard Development Company, L.P. Via design for flux residue mitigation
CN101785103B (zh) * 2007-07-05 2011-12-28 Aac微技术有限公司 低阻抗晶圆穿孔
EP2146561A1 (en) * 2008-05-28 2010-01-20 LG Electronics Inc. Flexible film and display device including the same
JP2012195389A (ja) * 2011-03-15 2012-10-11 Fujitsu Ltd 配線基板、配線基板ユニット、電子装置、及び配線基板の製造方法

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Publication number Priority date Publication date Assignee Title
JP2002198461A (ja) * 2000-12-27 2002-07-12 Sumitomo Metal Electronics Devices Inc プラスチックパッケージ及びその製造方法
KR20150011466A (ko) * 2013-07-23 2015-02-02 주식회사 이수엑사보드 필 도금된 동박 적층판 및 그 도금법
JP2016201416A (ja) * 2015-04-08 2016-12-01 日立化成株式会社 多層配線基板の製造方法

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CN116803219A (zh) 2023-09-22
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JP7485223B2 (ja) 2024-05-16

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