JP7485223B2 - プリント配線板 - Google Patents

プリント配線板 Download PDF

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Publication number
JP7485223B2
JP7485223B2 JP2023533201A JP2023533201A JP7485223B2 JP 7485223 B2 JP7485223 B2 JP 7485223B2 JP 2023533201 A JP2023533201 A JP 2023533201A JP 2023533201 A JP2023533201 A JP 2023533201A JP 7485223 B2 JP7485223 B2 JP 7485223B2
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JP
Japan
Prior art keywords
opening
printed wiring
conductive layer
wiring board
convex portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023533201A
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English (en)
Japanese (ja)
Other versions
JPWO2023282350A1 (https=
JPWO2023282350A5 (https=
Inventor
賢治 高橋
将一郎 酒井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Publication of JPWO2023282350A1 publication Critical patent/JPWO2023282350A1/ja
Publication of JPWO2023282350A5 publication Critical patent/JPWO2023282350A5/ja
Application granted granted Critical
Publication of JP7485223B2 publication Critical patent/JP7485223B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0352—Differences between the conductors of different layers of a multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
JP2023533201A 2021-07-09 2022-07-08 プリント配線板 Active JP7485223B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021114335 2021-07-09
JP2021114335 2021-07-09
PCT/JP2022/027124 WO2023282350A1 (ja) 2021-07-09 2022-07-08 プリント配線板

Publications (3)

Publication Number Publication Date
JPWO2023282350A1 JPWO2023282350A1 (https=) 2023-01-12
JPWO2023282350A5 JPWO2023282350A5 (https=) 2023-09-28
JP7485223B2 true JP7485223B2 (ja) 2024-05-16

Family

ID=84800771

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023533201A Active JP7485223B2 (ja) 2021-07-09 2022-07-08 プリント配線板

Country Status (4)

Country Link
US (1) US20240147612A1 (https=)
JP (1) JP7485223B2 (https=)
CN (1) CN116803219A (https=)
WO (1) WO2023282350A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002198461A (ja) 2000-12-27 2002-07-12 Sumitomo Metal Electronics Devices Inc プラスチックパッケージ及びその製造方法
JP2006319314A (ja) 2005-04-13 2006-11-24 Kyocera Corp 回路基板および回路基板の製造方法
JP2016201416A (ja) 2015-04-08 2016-12-01 日立化成株式会社 多層配線基板の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4964947A (en) * 1989-01-20 1990-10-23 Casio Computer Co., Ltd. Method of manufacturing double-sided wiring substrate
JP3395621B2 (ja) * 1997-02-03 2003-04-14 イビデン株式会社 プリント配線板及びその製造方法
JP2006229034A (ja) * 2005-02-18 2006-08-31 Toshiba Corp 配線基板とその製造方法
US7557304B2 (en) * 2006-11-08 2009-07-07 Motorola, Inc. Printed circuit board having closed vias
US8102057B2 (en) * 2006-12-27 2012-01-24 Hewlett-Packard Development Company, L.P. Via design for flux residue mitigation
CN101785103B (zh) * 2007-07-05 2011-12-28 Aac微技术有限公司 低阻抗晶圆穿孔
EP2146561A1 (en) * 2008-05-28 2010-01-20 LG Electronics Inc. Flexible film and display device including the same
JP2012195389A (ja) * 2011-03-15 2012-10-11 Fujitsu Ltd 配線基板、配線基板ユニット、電子装置、及び配線基板の製造方法
KR101514024B1 (ko) * 2013-07-23 2015-04-22 (주)이수엑사보드 필 도금된 동박 적층판 및 그 도금법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002198461A (ja) 2000-12-27 2002-07-12 Sumitomo Metal Electronics Devices Inc プラスチックパッケージ及びその製造方法
JP2006319314A (ja) 2005-04-13 2006-11-24 Kyocera Corp 回路基板および回路基板の製造方法
JP2016201416A (ja) 2015-04-08 2016-12-01 日立化成株式会社 多層配線基板の製造方法

Also Published As

Publication number Publication date
WO2023282350A1 (ja) 2023-01-12
JPWO2023282350A1 (https=) 2023-01-12
CN116803219A (zh) 2023-09-22
US20240147612A1 (en) 2024-05-02

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