JPWO2023282350A1 - - Google Patents

Info

Publication number
JPWO2023282350A1
JPWO2023282350A1 JP2023533201A JP2023533201A JPWO2023282350A1 JP WO2023282350 A1 JPWO2023282350 A1 JP WO2023282350A1 JP 2023533201 A JP2023533201 A JP 2023533201A JP 2023533201 A JP2023533201 A JP 2023533201A JP WO2023282350 A1 JPWO2023282350 A1 JP WO2023282350A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023533201A
Other languages
Japanese (ja)
Other versions
JPWO2023282350A5 (https=
JP7485223B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023282350A1 publication Critical patent/JPWO2023282350A1/ja
Publication of JPWO2023282350A5 publication Critical patent/JPWO2023282350A5/ja
Application granted granted Critical
Publication of JP7485223B2 publication Critical patent/JP7485223B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0352—Differences between the conductors of different layers of a multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
JP2023533201A 2021-07-09 2022-07-08 プリント配線板 Active JP7485223B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021114335 2021-07-09
JP2021114335 2021-07-09
PCT/JP2022/027124 WO2023282350A1 (ja) 2021-07-09 2022-07-08 プリント配線板

Publications (3)

Publication Number Publication Date
JPWO2023282350A1 true JPWO2023282350A1 (https=) 2023-01-12
JPWO2023282350A5 JPWO2023282350A5 (https=) 2023-09-28
JP7485223B2 JP7485223B2 (ja) 2024-05-16

Family

ID=84800771

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023533201A Active JP7485223B2 (ja) 2021-07-09 2022-07-08 プリント配線板

Country Status (4)

Country Link
US (1) US20240147612A1 (https=)
JP (1) JP7485223B2 (https=)
CN (1) CN116803219A (https=)
WO (1) WO2023282350A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10322027A (ja) * 1997-02-03 1998-12-04 Ibiden Co Ltd プリント配線板及びその製造方法
JP2002198461A (ja) * 2000-12-27 2002-07-12 Sumitomo Metal Electronics Devices Inc プラスチックパッケージ及びその製造方法
JP2006319314A (ja) * 2005-04-13 2006-11-24 Kyocera Corp 回路基板および回路基板の製造方法
KR20150011466A (ko) * 2013-07-23 2015-02-02 주식회사 이수엑사보드 필 도금된 동박 적층판 및 그 도금법
JP2016201416A (ja) * 2015-04-08 2016-12-01 日立化成株式会社 多層配線基板の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4964947A (en) * 1989-01-20 1990-10-23 Casio Computer Co., Ltd. Method of manufacturing double-sided wiring substrate
JP2006229034A (ja) * 2005-02-18 2006-08-31 Toshiba Corp 配線基板とその製造方法
US7557304B2 (en) * 2006-11-08 2009-07-07 Motorola, Inc. Printed circuit board having closed vias
US8102057B2 (en) * 2006-12-27 2012-01-24 Hewlett-Packard Development Company, L.P. Via design for flux residue mitigation
CN101785103B (zh) * 2007-07-05 2011-12-28 Aac微技术有限公司 低阻抗晶圆穿孔
EP2146561A1 (en) * 2008-05-28 2010-01-20 LG Electronics Inc. Flexible film and display device including the same
JP2012195389A (ja) * 2011-03-15 2012-10-11 Fujitsu Ltd 配線基板、配線基板ユニット、電子装置、及び配線基板の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10322027A (ja) * 1997-02-03 1998-12-04 Ibiden Co Ltd プリント配線板及びその製造方法
JP2002198461A (ja) * 2000-12-27 2002-07-12 Sumitomo Metal Electronics Devices Inc プラスチックパッケージ及びその製造方法
JP2006319314A (ja) * 2005-04-13 2006-11-24 Kyocera Corp 回路基板および回路基板の製造方法
KR20150011466A (ko) * 2013-07-23 2015-02-02 주식회사 이수엑사보드 필 도금된 동박 적층판 및 그 도금법
JP2016201416A (ja) * 2015-04-08 2016-12-01 日立化成株式会社 多層配線基板の製造方法

Also Published As

Publication number Publication date
WO2023282350A1 (ja) 2023-01-12
CN116803219A (zh) 2023-09-22
US20240147612A1 (en) 2024-05-02
JP7485223B2 (ja) 2024-05-16

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