JPWO2023248895A5 - - Google Patents
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- Publication number
- JPWO2023248895A5 JPWO2023248895A5 JP2024528914A JP2024528914A JPWO2023248895A5 JP WO2023248895 A5 JPWO2023248895 A5 JP WO2023248895A5 JP 2024528914 A JP2024528914 A JP 2024528914A JP 2024528914 A JP2024528914 A JP 2024528914A JP WO2023248895 A5 JPWO2023248895 A5 JP WO2023248895A5
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- substrate
- semiconductor light
- heat sink
- emitting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 33
- 239000004065 semiconductor Substances 0.000 claims 31
- 239000003990 capacitor Substances 0.000 claims 10
- 239000000463 material Substances 0.000 claims 6
- 229910045601 alloy Inorganic materials 0.000 claims 2
- 239000000956 alloy Substances 0.000 claims 2
- 229910003460 diamond Inorganic materials 0.000 claims 2
- 239000010432 diamond Substances 0.000 claims 2
- 229910001080 W alloy Inorganic materials 0.000 claims 1
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 claims 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022099142 | 2022-06-20 | ||
| PCT/JP2023/022089 WO2023248895A1 (ja) | 2022-06-20 | 2023-06-14 | 半導体発光装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023248895A1 JPWO2023248895A1 (https=) | 2023-12-28 |
| JPWO2023248895A5 true JPWO2023248895A5 (https=) | 2025-02-28 |
Family
ID=89379827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024528914A Pending JPWO2023248895A1 (https=) | 2022-06-20 | 2023-06-14 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2023248895A1 (https=) |
| WO (1) | WO2023248895A1 (https=) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5895884A (ja) * | 1981-12-01 | 1983-06-07 | Canon Inc | レ−ザユニツト |
| JPS5925292A (ja) * | 1982-07-30 | 1984-02-09 | Fujitsu Ltd | 半導体レ−ザ装置 |
| JP3405402B2 (ja) * | 1999-06-23 | 2003-05-12 | 日本電気株式会社 | 並列伝送型光モジュールおよびその製造方法 |
| JP2004006450A (ja) * | 2002-03-28 | 2004-01-08 | Sumitomo Electric Ind Ltd | Ｌｄ（レーザーダイオード）モジュール用パッケージおよびレーザーダイオードモジュール |
| JP2005033019A (ja) * | 2003-07-04 | 2005-02-03 | Sumitomo Electric Ind Ltd | 発光モジュール |
| JP2005079542A (ja) * | 2003-09-03 | 2005-03-24 | Tdk Corp | 半導体レーザ駆動回路および光ヘッド |
| JP5835470B2 (ja) * | 2012-04-04 | 2015-12-24 | 三菱電機株式会社 | 半導体パッケージ |
| JP2013236010A (ja) * | 2012-05-10 | 2013-11-21 | Mitsubishi Electric Corp | 半導体装置 |
| JP6511776B2 (ja) * | 2014-11-06 | 2019-05-15 | 住友電気工業株式会社 | 発光モジュール |
| US20180278011A1 (en) * | 2017-03-23 | 2018-09-27 | Infineon Technologies Ag | Laser diode module |
-
2023
- 2023-06-14 WO PCT/JP2023/022089 patent/WO2023248895A1/ja not_active Ceased
- 2023-06-14 JP JP2024528914A patent/JPWO2023248895A1/ja active Pending
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