JP6511776B2 - 発光モジュール - Google Patents
発光モジュール Download PDFInfo
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- JP6511776B2 JP6511776B2 JP2014226099A JP2014226099A JP6511776B2 JP 6511776 B2 JP6511776 B2 JP 6511776B2 JP 2014226099 A JP2014226099 A JP 2014226099A JP 2014226099 A JP2014226099 A JP 2014226099A JP 6511776 B2 JP6511776 B2 JP 6511776B2
- Authority
- JP
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- Prior art keywords
- electrode
- driver
- laser diode
- submount
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000003287 optical effect Effects 0.000 description 20
- 239000000758 substrate Substances 0.000 description 13
- 239000000919 ceramic Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 230000005540 biological transmission Effects 0.000 description 7
- 230000008878 coupling Effects 0.000 description 6
- 238000010168 coupling process Methods 0.000 description 6
- 238000005859 coupling reaction Methods 0.000 description 6
- 238000013461 design Methods 0.000 description 6
- 238000005253 cladding Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 230000003071 parasitic effect Effects 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- GBYFRWZNEYJWAD-VTWSTLNFSA-N (3S,6S,12S,15S,21S,24S,30S,33S)-3,12,21,30-tetrabenzyl-1,4,10,13,19,22,28,31-octazapentacyclo[31.3.0.06,10.015,19.024,28]hexatriacontane-2,5,11,14,20,23,29,32-octone Chemical compound O=C1N[C@@H](Cc2ccccc2)C(=O)N2CCC[C@H]2C(=O)N[C@@H](Cc2ccccc2)C(=O)N2CCC[C@H]2C(=O)N[C@@H](Cc2ccccc2)C(=O)N2CCC[C@H]2C(=O)N[C@@H](Cc2ccccc2)C(=O)N2CCC[C@@H]12 GBYFRWZNEYJWAD-VTWSTLNFSA-N 0.000 description 1
- 235000011449 Rosa Nutrition 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 101150014352 mtb12 gene Proteins 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04J—MULTIPLEX COMMUNICATION
- H04J14/00—Optical multiplex systems
- H04J14/02—Wavelength-division multiplex systems
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/426—Details of housings mounting, engaging or coupling of the package to a board, a frame or a panel
- G02B6/4261—Packages with mounting structures to be pluggable or detachable, e.g. having latches or rails
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4284—Electrical aspects of optical modules with disconnectable electrical connectors
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/50—Transmitters
- H04B10/501—Structural aspects
- H04B10/503—Laser transmitters
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B3/00—Line transmission systems
- H04B3/02—Details
- H04B3/32—Reducing cross-talk, e.g. by compensating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Semiconductor Lasers (AREA)
Description
Claims (4)
- 信号光を出射する第1および第2のレーザダイオードと、
前記第1のレーザダイオードに供給するバイアス電流を中継する中継パッドと、前記第1のレーザダイオードを搭載する電極パッドを有するLDサブマウントと、
前記第1および第2のレーザダイオードを駆動するドライバICと、
前記第1および第2のレーザダイオード、前記LDサブマウント、前記ドライバICを搭載しシャーシグランドを提供するハウジングと、
を備え、
前記第1のレーザダイオードの一方の電極は、前記シャーシグランドに接地されることなく前記ドライバICに接続され、前記第1のレーザダイオードの他方の電極は、前記中継パッドを介して前記ドライバICに接続され、
前記第1のレーザダイオードは前記一方の電極および前記他方の電極を前記第1のレーザダイオードの表面に有し、さらに、前記第1のレーザダイオードの裏面に前記一方の電極と前記第1のレーザダイオードの内部で接続されている裏面電極を備えており、
前記第1のレーザダイオードは前記裏面電極と前記LDサブマウント上の前記電極パッドを接触させて前記LDサブマウント上に搭載されており、
前記一方の電極および前記LDサブマウント上の前記電極パッドの双方が前記ドライバICと個別に接続され、
前記第2のレーザダイオードはその表面に一方の電極及び他方の電極を、その裏面に裏面電極を有し、前記第2のレーザダイオードに係る一方の電極と当該裏面電極は前記第2のレーザダイオード内部で接続されており、
前記LDサブマウントは、前記第2のレーザダイオードに係る中継パッドおよび電極パッドを前記第1のレーザダイオードに係る中継パッドおよび電極パッドとは独立に備えており、
前記第2のレーザダイオードの他方の電極は、前記第2のレーザダイオードに係る中継パッドを介して前記ドライバICに接続され、前記第2のレーザダイオードに係る一方の電極および前記LDサブマウント上であって前記第2のレーザダイオードに係る電極パッドは、前記シャーシグランドに接続されることなく前記ドライバICに接続されている、
発光モジュール。 - 前記一方の電極と前記ドライバICは第1のボンディングワイヤで接続されており、前記電極パッドと前記ドライバICは第2のボンディングワイヤで接続されており、前記他方の電極と前記ドライバICは第3のボンディングワイヤで接続されており、
前記第3のボンディングワイヤは前記第1のボンディングワイヤと前記第2のボンディングワイヤに挟まれている、
請求項1に記載の発光モジュール。 - 前記第1のボンディングワイヤおよび前記第2のボンディングワイヤの少なくともいずれか一方は、複数のボンディングワイヤを含んでいる、
請求項2に記載の発光モジュール。 - 前記ドライバICはスイッチングトランジスタを含み、当該スイッチングトランジスタは前記中継パッドに対して前記第1のレーザダイオードと並列に接続されている、
請求項1〜3のいずれか一項に記載の発光モジュール。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014226099A JP6511776B2 (ja) | 2014-11-06 | 2014-11-06 | 発光モジュール |
US14/932,022 US9979506B2 (en) | 2014-11-06 | 2015-11-04 | Transmitter optical module implemented with a plurality of signal sources |
CN201510745398.6A CN105589140A (zh) | 2014-11-06 | 2015-11-05 | 配备有多个信号源的发射器光学模块 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014226099A JP6511776B2 (ja) | 2014-11-06 | 2014-11-06 | 発光モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016092260A JP2016092260A (ja) | 2016-05-23 |
JP6511776B2 true JP6511776B2 (ja) | 2019-05-15 |
Family
ID=55913081
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014226099A Active JP6511776B2 (ja) | 2014-11-06 | 2014-11-06 | 発光モジュール |
Country Status (3)
Country | Link |
---|---|
US (1) | US9979506B2 (ja) |
JP (1) | JP6511776B2 (ja) |
CN (1) | CN105589140A (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9548817B1 (en) * | 2015-06-19 | 2017-01-17 | Inphi Corporation | Small form factor transmitting device |
JP6988493B2 (ja) * | 2018-01-11 | 2022-01-05 | 住友電気工業株式会社 | 光モジュール及びその製造方法 |
JP6986453B2 (ja) * | 2018-01-12 | 2021-12-22 | ローム株式会社 | 半導体レーザ装置 |
JP7141880B2 (ja) * | 2018-07-26 | 2022-09-26 | 日本ルメンタム株式会社 | 光受信サブアセンブリ及び光モジュール |
CN109856734A (zh) * | 2019-02-11 | 2019-06-07 | 武汉电信器件有限公司 | 一种光器件的管壳 |
WO2020166566A1 (ja) * | 2019-02-14 | 2020-08-20 | 古河電気工業株式会社 | 光モジュール |
CN113296198A (zh) * | 2020-02-21 | 2021-08-24 | 佑胜光电股份有限公司 | 光发射组件、光学收发模块及光纤缆线模块 |
CN112558235B (zh) * | 2019-09-25 | 2024-08-13 | 青岛海信宽带多媒体技术有限公司 | 光发射器及光模块 |
CN111146684A (zh) * | 2019-12-20 | 2020-05-12 | 中国电子科技集团公司第十三研究所 | 多线半导体激光器光源及制备方法 |
WO2023248895A1 (ja) * | 2022-06-20 | 2023-12-28 | ローム株式会社 | 半導体発光装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19719853A1 (de) * | 1997-05-12 | 1998-11-19 | Bosch Gmbh Robert | Hochfrequenz-Halbleitermodul |
JPH11271546A (ja) * | 1998-03-20 | 1999-10-08 | Fujitsu Ltd | 光送受信デバイス |
JP3744354B2 (ja) * | 2000-12-22 | 2006-02-08 | 日本碍子株式会社 | レーザダイオード駆動装置 |
US7110676B2 (en) * | 2001-02-13 | 2006-09-19 | Tellabs Operations, Inc. | Power pre-emphasis for WDM transmission systems |
JP2003014994A (ja) * | 2001-07-04 | 2003-01-15 | Hitachi Ltd | マルチチャンネル光素子搭載基板および光通信モジュール |
JP2003134051A (ja) * | 2001-10-25 | 2003-05-09 | Opnext Japan Inc | 光受信モジュール、光受信器及び光ファイバ通信機器 |
JP2003264334A (ja) * | 2002-03-08 | 2003-09-19 | Hitachi Ltd | 半導体レーザ素子及び半導体レーザモジュール |
KR20050025387A (ko) * | 2003-09-06 | 2005-03-14 | 한국전자통신연구원 | 전기적 혼신이 감소된 광송수신기 |
JP2005244038A (ja) * | 2004-02-27 | 2005-09-08 | Fujitsu Ltd | 光送受信モジュール |
US20060140233A1 (en) * | 2004-12-28 | 2006-06-29 | Jesse Chin | Laser driver with integrated bond options for selectable currents |
JP5309416B2 (ja) * | 2005-07-19 | 2013-10-09 | ソニー株式会社 | 光モジュール |
JP4793630B2 (ja) * | 2005-10-26 | 2011-10-12 | 住友電気工業株式会社 | 一心双方向光モジュール及び一心双方向光送受信器 |
JP5340583B2 (ja) * | 2007-11-26 | 2013-11-13 | スタンレー電気株式会社 | 半導体発光装置 |
US8346037B2 (en) | 2009-01-30 | 2013-01-01 | Kaiam Corp. | Micromechanically aligned optical assembly |
-
2014
- 2014-11-06 JP JP2014226099A patent/JP6511776B2/ja active Active
-
2015
- 2015-11-04 US US14/932,022 patent/US9979506B2/en active Active
- 2015-11-05 CN CN201510745398.6A patent/CN105589140A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
CN105589140A (zh) | 2016-05-18 |
JP2016092260A (ja) | 2016-05-23 |
US20160134388A1 (en) | 2016-05-12 |
US9979506B2 (en) | 2018-05-22 |
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