JPWO2023243306A5 - - Google Patents
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- Publication number
- JPWO2023243306A5 JPWO2023243306A5 JP2024528407A JP2024528407A JPWO2023243306A5 JP WO2023243306 A5 JPWO2023243306 A5 JP WO2023243306A5 JP 2024528407 A JP2024528407 A JP 2024528407A JP 2024528407 A JP2024528407 A JP 2024528407A JP WO2023243306 A5 JPWO2023243306 A5 JP WO2023243306A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- main surface
- disposed
- conductive portion
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 14
- 239000000463 material Substances 0.000 claims 9
- 229920005989 resin Polymers 0.000 claims 4
- 239000011347 resin Substances 0.000 claims 4
- 238000007789 sealing Methods 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022095181 | 2022-06-13 | ||
| PCT/JP2023/018745 WO2023243306A1 (ja) | 2022-06-13 | 2023-05-19 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023243306A1 JPWO2023243306A1 (https=) | 2023-12-21 |
| JPWO2023243306A5 true JPWO2023243306A5 (https=) | 2025-02-21 |
Family
ID=89191063
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024528407A Pending JPWO2023243306A1 (https=) | 2022-06-13 | 2023-05-19 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2023243306A1 (https=) |
| WO (1) | WO2023243306A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3466329B2 (ja) * | 1995-06-16 | 2003-11-10 | 三菱電機株式会社 | 半導体パワーモジュール |
| JP2011054625A (ja) * | 2009-08-31 | 2011-03-17 | Sanyo Electric Co Ltd | 回路装置 |
| JP2013058726A (ja) * | 2011-08-12 | 2013-03-28 | Sanyo Electric Co Ltd | 実装基板および実装基板を用いた回路装置 |
| JP5633496B2 (ja) * | 2011-09-29 | 2014-12-03 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
| JPWO2014064822A1 (ja) * | 2012-10-26 | 2016-09-05 | 株式会社日立産機システム | パワー半導体モジュールおよびこれを搭載した電力変換装置 |
| JPWO2015174198A1 (ja) * | 2014-05-13 | 2017-04-20 | 三菱電機株式会社 | 半導体装置とその製造方法 |
| JP7577955B2 (ja) * | 2020-09-25 | 2024-11-06 | 富士電機株式会社 | 半導体装置 |
-
2023
- 2023-05-19 JP JP2024528407A patent/JPWO2023243306A1/ja active Pending
- 2023-05-19 WO PCT/JP2023/018745 patent/WO2023243306A1/ja not_active Ceased
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