JPWO2023243306A1 - - Google Patents
Info
- Publication number
- JPWO2023243306A1 JPWO2023243306A1 JP2024528407A JP2024528407A JPWO2023243306A1 JP WO2023243306 A1 JPWO2023243306 A1 JP WO2023243306A1 JP 2024528407 A JP2024528407 A JP 2024528407A JP 2024528407 A JP2024528407 A JP 2024528407A JP WO2023243306 A1 JPWO2023243306 A1 JP WO2023243306A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W42/00—Arrangements for protection of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022095181 | 2022-06-13 | ||
| PCT/JP2023/018745 WO2023243306A1 (ja) | 2022-06-13 | 2023-05-19 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023243306A1 true JPWO2023243306A1 (https=) | 2023-12-21 |
| JPWO2023243306A5 JPWO2023243306A5 (https=) | 2025-02-21 |
Family
ID=89191063
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024528407A Pending JPWO2023243306A1 (https=) | 2022-06-13 | 2023-05-19 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2023243306A1 (https=) |
| WO (1) | WO2023243306A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3466329B2 (ja) * | 1995-06-16 | 2003-11-10 | 三菱電機株式会社 | 半導体パワーモジュール |
| JP2011054625A (ja) * | 2009-08-31 | 2011-03-17 | Sanyo Electric Co Ltd | 回路装置 |
| JP2013058726A (ja) * | 2011-08-12 | 2013-03-28 | Sanyo Electric Co Ltd | 実装基板および実装基板を用いた回路装置 |
| JP5633496B2 (ja) * | 2011-09-29 | 2014-12-03 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
| JPWO2014064822A1 (ja) * | 2012-10-26 | 2016-09-05 | 株式会社日立産機システム | パワー半導体モジュールおよびこれを搭載した電力変換装置 |
| JPWO2015174198A1 (ja) * | 2014-05-13 | 2017-04-20 | 三菱電機株式会社 | 半導体装置とその製造方法 |
| JP7577955B2 (ja) * | 2020-09-25 | 2024-11-06 | 富士電機株式会社 | 半導体装置 |
-
2023
- 2023-05-19 JP JP2024528407A patent/JPWO2023243306A1/ja active Pending
- 2023-05-19 WO PCT/JP2023/018745 patent/WO2023243306A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023243306A1 (ja) | 2023-12-21 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20241113 |