JP2025145247A5 - - Google Patents
Info
- Publication number
- JP2025145247A5 JP2025145247A5 JP2024045330A JP2024045330A JP2025145247A5 JP 2025145247 A5 JP2025145247 A5 JP 2025145247A5 JP 2024045330 A JP2024045330 A JP 2024045330A JP 2024045330 A JP2024045330 A JP 2024045330A JP 2025145247 A5 JP2025145247 A5 JP 2025145247A5
- Authority
- JP
- Japan
- Prior art keywords
- metal body
- surface metal
- base material
- insulating base
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024045330A JP2025145247A (ja) | 2024-03-21 | 2024-03-21 | 半導体装置 |
| PCT/JP2025/004444 WO2025197362A1 (ja) | 2024-03-21 | 2025-02-11 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024045330A JP2025145247A (ja) | 2024-03-21 | 2024-03-21 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2025145247A JP2025145247A (ja) | 2025-10-03 |
| JP2025145247A5 true JP2025145247A5 (https=) | 2026-01-21 |
Family
ID=97139322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024045330A Pending JP2025145247A (ja) | 2024-03-21 | 2024-03-21 | 半導体装置 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2025145247A (https=) |
| WO (1) | WO2025197362A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10170433B2 (en) * | 2014-12-18 | 2019-01-01 | Mitsubishi Electric Corporation | Insulated circuit board, power module and power unit |
| WO2019003725A1 (ja) * | 2017-06-28 | 2019-01-03 | 京セラ株式会社 | パワーモジュール用基板およびパワーモジュール |
| JP2021005618A (ja) * | 2019-06-26 | 2021-01-14 | 株式会社豊田自動織機 | パワーモジュール |
| CN114365279B (zh) * | 2019-09-13 | 2025-09-19 | 株式会社电装 | 半导体装置 |
| JP2023058259A (ja) * | 2021-10-13 | 2023-04-25 | 富士電機株式会社 | 半導体装置の製造方法及び半導体装置 |
-
2024
- 2024-03-21 JP JP2024045330A patent/JP2025145247A/ja active Pending
-
2025
- 2025-02-11 WO PCT/JP2025/004444 patent/WO2025197362A1/ja active Pending
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