JP2025145247A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JP2025145247A
JP2025145247A JP2024045330A JP2024045330A JP2025145247A JP 2025145247 A JP2025145247 A JP 2025145247A JP 2024045330 A JP2024045330 A JP 2024045330A JP 2024045330 A JP2024045330 A JP 2024045330A JP 2025145247 A JP2025145247 A JP 2025145247A
Authority
JP
Japan
Prior art keywords
corner
substrate
surface metal
corners
metal body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024045330A
Other languages
English (en)
Japanese (ja)
Other versions
JP2025145247A5 (https=
Inventor
崇功 川島
Takayoshi Kawashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2024045330A priority Critical patent/JP2025145247A/ja
Priority to PCT/JP2025/004444 priority patent/WO2025197362A1/ja
Publication of JP2025145247A publication Critical patent/JP2025145247A/ja
Publication of JP2025145247A5 publication Critical patent/JP2025145247A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Inverter Devices (AREA)
JP2024045330A 2024-03-21 2024-03-21 半導体装置 Pending JP2025145247A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2024045330A JP2025145247A (ja) 2024-03-21 2024-03-21 半導体装置
PCT/JP2025/004444 WO2025197362A1 (ja) 2024-03-21 2025-02-11 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2024045330A JP2025145247A (ja) 2024-03-21 2024-03-21 半導体装置

Publications (2)

Publication Number Publication Date
JP2025145247A true JP2025145247A (ja) 2025-10-03
JP2025145247A5 JP2025145247A5 (https=) 2026-01-21

Family

ID=97139322

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024045330A Pending JP2025145247A (ja) 2024-03-21 2024-03-21 半導体装置

Country Status (2)

Country Link
JP (1) JP2025145247A (https=)
WO (1) WO2025197362A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10170433B2 (en) * 2014-12-18 2019-01-01 Mitsubishi Electric Corporation Insulated circuit board, power module and power unit
WO2019003725A1 (ja) * 2017-06-28 2019-01-03 京セラ株式会社 パワーモジュール用基板およびパワーモジュール
JP2021005618A (ja) * 2019-06-26 2021-01-14 株式会社豊田自動織機 パワーモジュール
CN114365279B (zh) * 2019-09-13 2025-09-19 株式会社电装 半导体装置
JP2023058259A (ja) * 2021-10-13 2023-04-25 富士電機株式会社 半導体装置の製造方法及び半導体装置

Also Published As

Publication number Publication date
WO2025197362A1 (ja) 2025-09-25

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Legal Events

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Effective date: 20260113

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