JPWO2023153334A5 - - Google Patents

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Publication number
JPWO2023153334A5
JPWO2023153334A5 JP2023580222A JP2023580222A JPWO2023153334A5 JP WO2023153334 A5 JPWO2023153334 A5 JP WO2023153334A5 JP 2023580222 A JP2023580222 A JP 2023580222A JP 2023580222 A JP2023580222 A JP 2023580222A JP WO2023153334 A5 JPWO2023153334 A5 JP WO2023153334A5
Authority
JP
Japan
Prior art keywords
semiconductor device
heat sink
protrusion
sealing resin
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023580222A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023153334A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/003640 external-priority patent/WO2023153334A1/ja
Publication of JPWO2023153334A1 publication Critical patent/JPWO2023153334A1/ja
Publication of JPWO2023153334A5 publication Critical patent/JPWO2023153334A5/ja
Pending legal-status Critical Current

Links

JP2023580222A 2022-02-14 2023-02-03 Pending JPWO2023153334A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022020303 2022-02-14
PCT/JP2023/003640 WO2023153334A1 (ja) 2022-02-14 2023-02-03 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023153334A1 JPWO2023153334A1 (https=) 2023-08-17
JPWO2023153334A5 true JPWO2023153334A5 (https=) 2024-05-27

Family

ID=87564290

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023580222A Pending JPWO2023153334A1 (https=) 2022-02-14 2023-02-03

Country Status (4)

Country Link
US (1) US20250096063A1 (https=)
JP (1) JPWO2023153334A1 (https=)
GB (1) GB2629261A (https=)
WO (1) WO2023153334A1 (https=)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08306849A (ja) * 1995-05-10 1996-11-22 Shinko Electric Ind Co Ltd 放熱部材及び該放熱部材を備えた半導体装置
JP4283588B2 (ja) * 2003-04-22 2009-06-24 パナソニック電工株式会社 半導体装置
US8564124B2 (en) * 2006-03-07 2013-10-22 International Rectifier Corporation Semiconductor package
JP2008042063A (ja) * 2006-08-09 2008-02-21 Renesas Technology Corp 半導体装置
US8125077B2 (en) * 2006-09-26 2012-02-28 Utac Thai Limited Package with heat transfer
JP2014216326A (ja) * 2013-04-22 2014-11-17 株式会社デンソー 電子装置およびその製造方法
JP2015070146A (ja) * 2013-09-30 2015-04-13 力成科技股▲分▼有限公司 半導体装置
US9142523B2 (en) * 2013-11-22 2015-09-22 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor device and manufacturing method thereof
US9812410B2 (en) * 2015-12-31 2017-11-07 Taiwan Semiconductor Manufacturing Company, Ltd. Lid structure for a semiconductor device package and method for forming the same
JP6605382B2 (ja) * 2016-03-30 2019-11-13 新光電気工業株式会社 半導体装置及び半導体装置の製造方法
JP6847266B2 (ja) * 2017-12-20 2021-03-24 三菱電機株式会社 半導体パッケージおよびその製造方法
KR20210017271A (ko) * 2019-08-07 2021-02-17 삼성전기주식회사 반도체 패키지
KR102328997B1 (ko) * 2020-04-21 2021-11-18 삼성전기주식회사 방열부를 갖는 전자 소자 모듈 및 그 제조 방법

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