JPWO2023153334A1 - - Google Patents
Info
- Publication number
- JPWO2023153334A1 JPWO2023153334A1 JP2023580222A JP2023580222A JPWO2023153334A1 JP WO2023153334 A1 JPWO2023153334 A1 JP WO2023153334A1 JP 2023580222 A JP2023580222 A JP 2023580222A JP 2023580222 A JP2023580222 A JP 2023580222A JP WO2023153334 A1 JPWO2023153334 A1 JP WO2023153334A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
- H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/241—Dispositions, e.g. layouts
- H10W72/247—Dispositions of multiple bumps
- H10W72/248—Top-view layouts, e.g. mirror arrays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/877—Bump connectors and die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
- H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022020303 | 2022-02-14 | ||
| PCT/JP2023/003640 WO2023153334A1 (ja) | 2022-02-14 | 2023-02-03 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023153334A1 true JPWO2023153334A1 (https=) | 2023-08-17 |
| JPWO2023153334A5 JPWO2023153334A5 (https=) | 2024-05-27 |
Family
ID=87564290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023580222A Pending JPWO2023153334A1 (https=) | 2022-02-14 | 2023-02-03 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250096063A1 (https=) |
| JP (1) | JPWO2023153334A1 (https=) |
| GB (1) | GB2629261A (https=) |
| WO (1) | WO2023153334A1 (https=) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08306849A (ja) * | 1995-05-10 | 1996-11-22 | Shinko Electric Ind Co Ltd | 放熱部材及び該放熱部材を備えた半導体装置 |
| JP2004327558A (ja) * | 2003-04-22 | 2004-11-18 | Matsushita Electric Works Ltd | 半導体装置 |
| US20070210438A1 (en) * | 2006-03-07 | 2007-09-13 | Briere Michael A | Semiconductor package |
| JP2008042063A (ja) * | 2006-08-09 | 2008-02-21 | Renesas Technology Corp | 半導体装置 |
| US20100327432A1 (en) * | 2006-09-26 | 2010-12-30 | Utac Thai Limited | Package with heat transfer |
| JP2015070146A (ja) * | 2013-09-30 | 2015-04-13 | 力成科技股▲分▼有限公司 | 半導体装置 |
| US20150145115A1 (en) * | 2013-11-22 | 2015-05-28 | Taiwan Semicomductor Manufacturing Company Ltd. | Emiconductor device and manufacturing method thereof |
| US20170194268A1 (en) * | 2015-12-31 | 2017-07-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Lid Structure for a Semiconductor Device Package and Method for Forming the Same |
| US20210043536A1 (en) * | 2019-08-07 | 2021-02-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor package |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014216326A (ja) * | 2013-04-22 | 2014-11-17 | 株式会社デンソー | 電子装置およびその製造方法 |
| JP6605382B2 (ja) * | 2016-03-30 | 2019-11-13 | 新光電気工業株式会社 | 半導体装置及び半導体装置の製造方法 |
| JP6847266B2 (ja) * | 2017-12-20 | 2021-03-24 | 三菱電機株式会社 | 半導体パッケージおよびその製造方法 |
| KR102328997B1 (ko) * | 2020-04-21 | 2021-11-18 | 삼성전기주식회사 | 방열부를 갖는 전자 소자 모듈 및 그 제조 방법 |
-
2023
- 2023-02-03 GB GB2408859.3A patent/GB2629261A/en active Pending
- 2023-02-03 JP JP2023580222A patent/JPWO2023153334A1/ja active Pending
- 2023-02-03 WO PCT/JP2023/003640 patent/WO2023153334A1/ja not_active Ceased
- 2023-02-03 US US18/729,548 patent/US20250096063A1/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08306849A (ja) * | 1995-05-10 | 1996-11-22 | Shinko Electric Ind Co Ltd | 放熱部材及び該放熱部材を備えた半導体装置 |
| JP2004327558A (ja) * | 2003-04-22 | 2004-11-18 | Matsushita Electric Works Ltd | 半導体装置 |
| US20070210438A1 (en) * | 2006-03-07 | 2007-09-13 | Briere Michael A | Semiconductor package |
| JP2008042063A (ja) * | 2006-08-09 | 2008-02-21 | Renesas Technology Corp | 半導体装置 |
| US20100327432A1 (en) * | 2006-09-26 | 2010-12-30 | Utac Thai Limited | Package with heat transfer |
| JP2015070146A (ja) * | 2013-09-30 | 2015-04-13 | 力成科技股▲分▼有限公司 | 半導体装置 |
| US20150145115A1 (en) * | 2013-11-22 | 2015-05-28 | Taiwan Semicomductor Manufacturing Company Ltd. | Emiconductor device and manufacturing method thereof |
| US20170194268A1 (en) * | 2015-12-31 | 2017-07-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Lid Structure for a Semiconductor Device Package and Method for Forming the Same |
| US20210043536A1 (en) * | 2019-08-07 | 2021-02-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor package |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023153334A1 (ja) | 2023-08-17 |
| GB202408859D0 (en) | 2024-08-07 |
| GB2629261A (en) | 2024-10-23 |
| US20250096063A1 (en) | 2025-03-20 |
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