GB2629261A - Semiconductor device - Google Patents

Semiconductor device Download PDF

Info

Publication number
GB2629261A
GB2629261A GB2408859.3A GB202408859A GB2629261A GB 2629261 A GB2629261 A GB 2629261A GB 202408859 A GB202408859 A GB 202408859A GB 2629261 A GB2629261 A GB 2629261A
Authority
GB
United Kingdom
Prior art keywords
heat
dissipating plate
sealing resin
semiconductor device
convex portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
GB2408859.3A
Other languages
English (en)
Other versions
GB202408859D0 (en
Inventor
Higashide Seiu
Miyawaki Katsumi
Abe Shunichi
Nagamine Takumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of GB202408859D0 publication Critical patent/GB202408859D0/en
Publication of GB2629261A publication Critical patent/GB2629261A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/247—Dispositions of multiple bumps
    • H10W72/248—Top-view layouts, e.g. mirror arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB2408859.3A 2022-02-14 2023-02-03 Semiconductor device Pending GB2629261A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022020303 2022-02-14
PCT/JP2023/003640 WO2023153334A1 (ja) 2022-02-14 2023-02-03 半導体装置

Publications (2)

Publication Number Publication Date
GB202408859D0 GB202408859D0 (en) 2024-08-07
GB2629261A true GB2629261A (en) 2024-10-23

Family

ID=87564290

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2408859.3A Pending GB2629261A (en) 2022-02-14 2023-02-03 Semiconductor device

Country Status (4)

Country Link
US (1) US20250096063A1 (https=)
JP (1) JPWO2023153334A1 (https=)
GB (1) GB2629261A (https=)
WO (1) WO2023153334A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014216326A (ja) * 2013-04-22 2014-11-17 株式会社デンソー 電子装置およびその製造方法
JP2017183521A (ja) * 2016-03-30 2017-10-05 新光電気工業株式会社 半導体装置及び半導体装置の製造方法
WO2019124024A1 (ja) * 2017-12-20 2019-06-27 三菱電機株式会社 半導体パッケージおよびその製造方法
US20210327780A1 (en) * 2020-04-21 2021-10-21 Samsung Electro-Mechanics Co., Ltd. Electronic device module having heat radiating portion and manufacturing method thereof

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08306849A (ja) * 1995-05-10 1996-11-22 Shinko Electric Ind Co Ltd 放熱部材及び該放熱部材を備えた半導体装置
JP4283588B2 (ja) * 2003-04-22 2009-06-24 パナソニック電工株式会社 半導体装置
US8564124B2 (en) * 2006-03-07 2013-10-22 International Rectifier Corporation Semiconductor package
JP2008042063A (ja) * 2006-08-09 2008-02-21 Renesas Technology Corp 半導体装置
US8125077B2 (en) * 2006-09-26 2012-02-28 Utac Thai Limited Package with heat transfer
JP2015070146A (ja) * 2013-09-30 2015-04-13 力成科技股▲分▼有限公司 半導体装置
US9142523B2 (en) * 2013-11-22 2015-09-22 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor device and manufacturing method thereof
US9812410B2 (en) * 2015-12-31 2017-11-07 Taiwan Semiconductor Manufacturing Company, Ltd. Lid structure for a semiconductor device package and method for forming the same
KR20210017271A (ko) * 2019-08-07 2021-02-17 삼성전기주식회사 반도체 패키지

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014216326A (ja) * 2013-04-22 2014-11-17 株式会社デンソー 電子装置およびその製造方法
JP2017183521A (ja) * 2016-03-30 2017-10-05 新光電気工業株式会社 半導体装置及び半導体装置の製造方法
WO2019124024A1 (ja) * 2017-12-20 2019-06-27 三菱電機株式会社 半導体パッケージおよびその製造方法
US20210327780A1 (en) * 2020-04-21 2021-10-21 Samsung Electro-Mechanics Co., Ltd. Electronic device module having heat radiating portion and manufacturing method thereof

Also Published As

Publication number Publication date
WO2023153334A1 (ja) 2023-08-17
GB202408859D0 (en) 2024-08-07
JPWO2023153334A1 (https=) 2023-08-17
US20250096063A1 (en) 2025-03-20

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