CN1103499C - 用于引线键合芯片返工及替换的散热片及封装结构 - Google Patents

用于引线键合芯片返工及替换的散热片及封装结构 Download PDF

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CN1103499C
CN1103499C CN97122532A CN97122532A CN1103499C CN 1103499 C CN1103499 C CN 1103499C CN 97122532 A CN97122532 A CN 97122532A CN 97122532 A CN97122532 A CN 97122532A CN 1103499 C CN1103499 C CN 1103499C
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chip
paper tinsel
over again
carrier module
fin
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CN1190797A (zh
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马克·肯尼斯·豪夫梅耶尔
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International Business Machines Corp
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International Business Machines Corp
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Abstract

可返工芯片直接焊接结构。叠层散热片固定到载体组件。粘结剂将箔层固定到散热片，并提供了芯片必须被去除和替换时的分离界面。通过将箔从散热片剥离，箔、芯片和不可返工的管芯固定粘结剂作为一个整体被去除，固定位置上没有留下需刮擦或研磨掉的芯片固定粘结剂。这种结构提供了小外形的组件、可以返工/替换、缩短了连线长度并减小了键合引线线环的高度。

Description

用于引线键合芯片返工及替换的散热片及封装结构
本发明涉及电子元件的表面安装，尤其涉及这样一种安装技术，当需要返工时，它允许简单的去除和替换。
在实际的电子封装中通常要提供具有增强的散热特性的载体结构以帮助被固定元件和装配子部件的冷却。一种着重用于集成电路芯片直接焊接到各种载体如挠性聚酰亚胺、玻璃增强环氧树脂(FR4)及陶瓷芯片载体的挠曲基板上芯片(COF)及印制电路板基芯片(COB)封装的结构不仅提供增强散热特性而且附加接地或电屏蔽特性，该结构通常是采用以下两种技术提供的。
第一种技术包括将集成电路芯片直接粘结到被键合到或层叠到电路载体的金属散热片上。在这些应用中，引线键合芯片通常用环氧树脂粘结剂固定到金属散热片上，粘结剂可以含有混合的导电颗粒和/或可降低芯片/散热片界面热阻的导热颗粒。第二种技术包括将集成电路芯片直接粘结到具有芯片固定键合区位置的电路载体表面，该芯片固定键合区位置通过金属填充或电镀的通孔与位于电路载体内部或另一面上的大的金属接地或屏蔽板之间进行电、热互连。
尽管芯片直接焊接(DCA)到热沉的结构提供了有效的增强散热和初步的电隔离，但用于将芯片粘结到散热片或载体表面的粘结剂是不能轻易返工的。因此大位置的电制造组件及与芯片装配有关的测试损耗是不可恢复的。这些降低成品率的因素包括确优管芯(KGD)问题和常见的DCA组件及制造加工流程缺陷，包括：粘结剂溢出到键合区上，定向错误的管芯、引线键合图形识别错误及引线键合偏差，还有其它键合及键合后测试引入的缺陷。对于单个芯片封装这些回收率损失通常可达到几个百分比，而对于多芯片组件结构，回收率损失根据组件的复杂性可达到30％或更多。通过给出与依赖于挠曲基板上芯片(COF)及印制电路板基芯片(COB)技术的大部分封装组件有关的大批量制造的需要而引起的总的组件回收率损失后(典型地是每周1,000至100,000)，可清楚地看到开发及应用一种简单的、成本效益好的支持芯片返工及替换的芯片直接焊接(DCA)到散热片的封装结构可以大大节约成本。
上面问题的一种解决办法可以在1994年12月6日申请的名为“可返工的具有用于粘结元件的可熔层的电子装置及其方法”的美国专利申请系列号08/349,854，和1995年9月19日申请的名为“用于可返工的带热增强的芯片直接焊接(DCA)结构的方法及系统”的美国专利申请系列号08/530,452的技术应用中找到，上述两申请均被转让给本专利申请的受让人。应用一层可熔材料层，如焊料，可以使将芯片键合到载体的粘结剂或胶泥和芯片一起去除。这就避免了需要刮擦、抛光或研磨芯片固定的载体位置以去除剩余的胶泥或粘结剂。因此，可以避免剩余的胶泥或粘结剂去除过程引起的困难、成本及附加的位置损失。
尽管这些方法是问题的一个解决办法，但需要用热来完成分离。温度必须足够高，以便能充分地软化可熔材料以释放芯片，同时温度不能够高到破坏芯片或载体上的电子元件的程度。尽管这一过程可以在可控温度范围内进行，如果分离加工能不需要高温而直接完成，则返工将会得到简化。
当所用的载体是散热片时，散热特性会使热的应用更严格，误差容限更有限。在这种环境下，一种代替加热组件加工的方法会有更多好处。一种更直接的将芯片从组件的剩余位置分离的方法将不仅简化加工，还减少了降低返工组件成品率的热或机械损伤的发生。
如果可以全部消除直接焊接器件的固化粘结剂过程的话，可以得到进一步的成本方面的好处。粘结剂的应用和固化加工费时又昂贵，并占小的形状系数封装的制造组件成本的很大一部分。例如，常规的芯片直接焊接在诸如用于目前技术水平的小型硬磁盘驱动器产品中的支路电子电缆中所要求的粘结剂散布及固化操作，几乎可以占到总的元件装配部件成本的25％。而且，如上面讨论的，一旦环氧粘结剂被固化，有缺陷的芯片或芯片位置缺陷的返工/修理或替换是没有成本效益的。因此，发展一种经济的芯片固定结构和一种既能返工又能消除成本高和费时的粘结加工步骤的组装工艺，对于提供电子组件的大的形状系数的封装工业来说，是有很大经济价值的。
与用在特殊场合的电子组件有关的另一个问题是符合特殊应用要求的紧凑性。例如，用于硬磁盘数据存储器的挠性电路和卡式电子组件、远距离通信设备、便携式计算机、计算机外设及许多消费电子产品通常要求元件封装的高密度及形状系数封装中的紧凑有效的电子载体集成。在许多这些封装应用中的不同形状系数设计的物理限制同时限制了用于电载体连线元件定位、器件互连及形状系数罩内的载体固定的可用的面积大小及高度。可用于电子元件的受限的三维空间经常促进封装小型化的一个或多个形式，如采用薄的有精细线条/间隔/通孔连线的挠性载体材料、小的惰性分立元件及各种支持硅器件集成和定位的芯片直接焊接技术，包括引线键合的挠曲基板上芯片和引线键合的印制电路板基芯片的固定方法。然而，除了要节省空间外，封装设计及装配方法还必须支持高产量、低利润容限的制造，因为高密度形状系数封装主要用于低成本的消费电子产品应用。
不幸的是，采用芯片直接焊接技术的形状系数电子产品的低成本制造本来就是困难的，因为大多数芯片直接焊接加工及封装结构的生产是相对昂贵的，这是由于制造需要多个采用专门设备的步骤，及低产量批装配步骤包括粘结剂和/或密封剂的应用及固化步骤。而且由于不能测试确优管芯及不能对目前使用的许多芯片直接焊接结构进行返工而造成的装配故障经常引入附加的成本。另外，芯片直接焊接装配、最后的制造成本、成品率及后来的将芯片直接焊接载体组件集成到形状系数封装中所需要的许多步骤也很大程度上取决于应用特定的载体组件设计。
在本发明中，芯片直接焊接到散热封装结构通过采用可分离的金属散热叠层及散热带结构，它们可以快速、简单和同时地移开芯片和不能返工的芯片固定粘结剂，以此来提供芯片返工的能力。完全的散热叠层结构包括与粘结剂层结合在一起的一个基层金属散热片和一个薄金属箔层。粘结剂层确定了可分离的散热叠层键合界面并可用干膜粘结剂及层叠工艺来制作、或采用压感粘结剂(PSA)。为了用压感粘结剂制作散热结构，粘结剂可以是独立薄片形式或放在金属箔上。在压感粘结剂的后一种使用中，包括键合到金属箔的压感粘结剂的金属带被固定到基层金属散热片以构成散热叠层结构。另外，如果需要的话，粘结剂层也可以掺入导热和/或导电的颗粒以增强散热叠层界面的散热和/或电特性。用常规的(即不能返工的)管芯固定粘结剂固定到散热片上。当芯片固定粘结剂被固化后，用引线键合来制作芯片输入/输出端键合区到载体线路的连接。
当出现缺陷从而需要去除及替换芯片以便修理电子元件或组件时，通过剥去被固定芯片范围内的散热叠层的可分离的金属箔层，芯片及管芯固定粘结剂可以被轻易去除。有缺陷的芯片组件的去除是这样完成的：首先用机械方法去除所有键合引线并用手工工具或有图形模具切割方法在管芯固定粘结剂周长附近切割键合到基层金属散热片的金属箔。接着，金属箔的一边或一角从基层金属散热片被剥开，然后芯片及管芯固定粘结剂四周及下面的金属箔整个被去除。因为管芯固定粘结剂及有缺陷的芯片被键合到金属箔上，因此当金属箔从基层金属散热片上被剥下时，芯片及管芯固定粘结剂同时被去除了。芯片的替换通过简单地将新的芯片用新鲜的管芯固定粘结剂固定到基层金属散热材料，再用引线键合固定到载体互连键合表面即可完成。
使用包括一个箔层的叠层的散热片，它允许采用一种金属的箔及另一种金属形成的散热片，以在叠层结构中提供不同的特性。典型的是用铜箔使叠层组件的上表面可焊。这种结构在具有用作散热的内部接地板的电路板上也是有用的。
在本发明的另一个实施例中，直接固定集成电路器件用两边有粘结剂涂层的箔层固定在芯片固定位置的载体或散热片上，以提供简化的装配及固定结构，当需要时，可以通过固定界面的可剥离箔层提供返工的方便。箔层既可用在载体上的芯片固定位置或用在一个金属散热片的表面，金属散热片在载体中一个确定芯片固定位置的孔处被粘结到载体组件。在这种结构中，不需要芯片固定粘结剂。
当得到一个紧凑的电子装配结构或将一个包括直接固定集成电路器件及载体组件的电子封装外形减至最小是很重要时，可以采用本发明的另一个改进形式。为减小电子封装的最大高度，载体组件中的芯片固定位置由对准的开孔确定，该开孔穿过载体及粘结到载体的散热片或传热器。一个箔层贴着散热片，它具有用压感粘结剂涂覆的邻接面以便将箔与散热片键合，并在芯片固定位置有一个涂覆粘结剂的表面。如果电子封装放在有关器件的相邻面上，则箔的两个表面都有粘结剂涂层。远离载体元件的表面的箔粘结剂涂层在将电子封装装配到使用的器件以前，可以覆盖一个释放片以保护粘结剂层。
在任一种说明及描述的应用中，箔上的粘结剂层可以含有填充材料以增强导热性、使粘结剂层导电或使粘结剂层或涂层既导电又导热。而且填充材料的应用增加了粘结剂层的硬度，这增强了高成品率的引线键合。当端键合区的支撑做得更硬时，传到键合发生的界面的超声能量可以有效地进行引线键合。在键合表面的支撑是挠性或弹性的时候，超声能量将微动传给端键合区而被部分消弱，这损害了对准且键合界面上减小的能量密度也降低了键合质量。
图1是芯片载体位置剖面的断开的正视图，载体在切开的芯片固定位置安装了散热片，包括本发明的带有连续的箔层的叠层散热结构。
图2与图1相似，但包括在芯片固定位置上单独地层叠在散热片上的有图形的箔层。
图3与图1相似，并进一步包括在叠层散热片和固定芯片的管芯固定粘结剂之间的可熔层。
图4与图2相似，并进一步包括在有图形的箔和管芯固定粘结剂之间的可熔层。
图5是位置剖面的断开的正视图，带有在切开的芯片固定位置上安装的散热片，且芯片用两面带粘结剂的箔层固定。
图6示出用现有技术进行挠曲基板上芯片的安装，其中芯片被固定在层叠到载体组件的传热片上。
图7图示了本发明的带式载体封装(TCP)，其中芯片被安装在载体/散热片组件内的一个对准的开孔内并被固定到一个粘结在散热片下表面的箔层以减小引线键合线的长度和高度，简化了密封并减小了所完成的组件的外形。
图1图示了一个芯片直接焊接组件(DCA)，其中芯片10被有效地固定到基层电路载体12并通过键合引线14与这个载体的线路进行电连接，键合引线14从芯片外部的电接触16延伸到载体上的线迹或端键合区18。基层载体12可以由各种材料形成，如聚酰亚胺、环氧树脂/玻璃板或陶瓷，可以是硬的或挠性的，并包括一层或多层带有导体接触端位置的支撑导体，导体接触端位置在芯片附近，从电绝缘涂层19伸出。如图所示，载体12在芯片需要直接固定到散热片的位置处有一个切开的开孔32。芯片10安装在散热叠层组件20上，散热叠层组件20包括金属散热片22和一个薄的箔层24，它们被粘结剂层或薄膜26层叠在一起。散热叠层组件20被粘结剂键合薄膜28固定在载体12上。芯片10被管芯固定粘结剂30、诸如不能返工的固化环氧树脂材料，安装在散热叠层组件20上。当需要去除芯片时，用管芯固定粘结剂材料30作为分离界面，固化的粘结剂不规则地去除，在替换芯片被装上前，要从表面刮去或磨去载体组件上剩余的部分。
散热叠层组件20包括金属散热片22、箔层24及将箔键合到散热片的粘结剂薄膜26。粘结剂薄膜层26可以由干膜粘结剂及相应的层叠加工形成，或在本发明实现的优选形式中，以独立薄片形式或作为箔层上涂层的箔带形式的压感粘结剂形成。另外，粘结剂层可以掺有增强导热性、导电性或两者的颗粒。通常散热片由铝形成，且箔是铝箔。然而不同的金属也可用于散热叠层结构以提供装配应用的其它特殊性能。例如，采用带有铜的层叠箔层的铝基层金属散热片，可以使散热叠层组件的表面可焊，或容易接受贵金属镀层。
当电子组件的返工需要去除并替换芯片10时，键合引线14被以机械方法去除，且箔层在载体切开开孔的边32和将芯片粘结到散热叠层组件的粘结剂30之间的区域34被切割。箔的切割可以用手工工具或用有图形模具切割方法。随着管芯固定粘结剂30下面的箔位置从箔层的其余位置分离，从一个角开始，管芯固定粘结剂下面的箔可以被剥开，以沿着压感粘结剂薄膜26形成的界面将芯片、管芯固定粘结剂及箔位置作为一个整体与载体电子组件的剩余位置分离。通过用新鲜的管芯固定粘结剂安装替换的芯片或在载体切开开孔处将有图形的箔层重新装到散热片上，然后用管芯固定粘结剂固定替换的芯片，就可以进行芯片的替换。接着通过恢复芯片外部电接触与相应的载体导体端键合区之间的引线键合连接，就完成了替换。
图2与图1相似，提供了带有切开开孔32的载体组件，在开孔处芯片10被安装在用粘结剂28键合到载体12的散热片22上。在这个实施例中，只有在载体开孔32内的芯片位置才有箔结构图形36，金属散热片被直接键合到载体12。箔层用压感粘结剂层或薄膜38粘结到金属散热片，以提供在返工需要去除芯片10时的分离界面。芯片10以常规的方式用管芯固定粘结剂30粘结到箔36，并由键合引线14连到载体组件线路。图2的改进组件结构使得不用切割加工步骤即可直接去除芯片，这个步骤对于将芯片及管芯固定粘结剂下面的箔与层叠到散热片的连续的箔层的剩余位置分离是必需的。
当用压感粘结剂材料将金属箔键合到基层散热片时，图2的改进结构特别有用。许多压感粘结剂可能不具备合适的硬度，当放在特定的载体材料如聚酰亚胺的下面时，它不能提供引线键合加工过程中的超声能量的有效传送。因此，当键合到载体键合区下有压感粘结剂的“软”载体结构时会出现低的引线键合成品率。然而通过采用只在硬芯片下的散热片上的有图形的金属箔，引线键合问题可基本解决。另外可通过添加填充剂得到硬度更大的粘结剂。当用独立粘结剂键合薄膜(非压感粘结剂)及层叠加工来制作散热结构时，箔或基层金属散热片的表面构造可以用化学或机械方法来改进，以降低粘结特性，使芯片返工/替换步骤中更易于去除箔。
本发明的另一个重要特征在于散热结构中也可采用不同的金属以提供其它用于装配应用的特殊性能。例如，通过采用带有铜叠层箔层的铝基层金属散热片，散热片可焊，或容易接受贵金属镀层。对一个可焊的散热叠层结构，各种不同的封装结构可使用美国专利申请系列号08/349,854(这里先前已提到)中描述的加工和方法作为去除芯片的可选方案。本发明的改进在图3、4中图示，它们分别与图1、2相似。图3显示了与图1的结构相似的用于芯片直接焊接的散热结构，其中铝散热片22被层叠到铜箔24，铜箔24用粘结剂层或薄膜26完全覆盖了散热片表面。在铜箔上面及在载体切开区内覆盖了有图形的焊料40，芯片10用管芯固定粘结剂30安装在载体切开区。同样，图4显示了与图2相似的结构，其中用载体芯片位置切开区内的压感粘结剂薄膜38，及在芯片10及管芯固定粘结剂30下面的铜箔上的一层焊接剂40，将有图形的铜箔层层叠到散热片。在这个结构中，可以选择不去除散热叠层组件的顶表面的铜箔层来去除和替换芯片10。
当有焊料层时，芯片的去除既可通过用将箔固定到散热片基层的粘结剂层作为分离界面，剥去连接芯片及管芯固定粘结剂下面的箔，或通过将焊料层作为分离界面，用足够的局部加热将芯片及管芯固定粘结剂从叠层的散热组件分离。
本发明提供了在多种类型载体上，包括环氧树脂/玻璃板、挠曲基板及陶瓷单芯片模块、多芯片模块和电路板组件，用于芯片直接焊接组件的返工的方便而有成本效益的方法。将芯片焊到散热片要求芯片和散热片都有现有的可焊冶金法。芯片上的背面金属化相当普遍，但昂贵。而且在有些情况下，有成本效益的散热结构上的可焊金属化(如铜)与封装应用是不相容的。这些不相容性要求用昂贵的贵/半贵金属涂层以将芯片焊到散热片表面。通过使用这里公开的本发明，可以不需要使用昂贵的散热片覆盖层及背面金属化层。简单的用机械方法去除芯片及粘结剂要求碾磨或抛光操作以去除载体上安装位置上剩余的管芯固定粘结剂。这些操作是昂贵的，费时的，需要特殊的工具和装置，会引入对元件和/或组件的损伤，及需要使用补充的清洗操作以去除组件的粒子污染。芯片粘结剂的化学法去除产生与机械法去除操作类似的许多问题，及涉及包括需要用强的、腐蚀性的及对环境有害的溶液，且化学品可能与组成组件的一些材料不相容的其它问题。为消除返工组件上可能的腐蚀也要求二次清洗操作和使用附加的化学中和步骤。尽管可以进行芯片返工(即好芯片被胶粘到有缺陷芯片的顶部，然后进行引线键合)，但这种技术的应用被限制于下述的位置放置的封装组件，它们具有宽松的载体键合区尺寸及可忽略的Z高度形状系数的封装限制。相反，本发明与紧凑排列的芯片直接焊接连线尺寸相容，并且一开始就对用于印制电路板基芯片、挠曲基板上芯片、单芯片模块及多芯片模块组件的大多数芯片直接焊接到散热封装结构施加的形状系数封装限制相容。
图5图示的实施例提供了降低组件成本并有芯片返工/替换能力的方法。这两种能力的获得是通过开发这样的封装结构和装配加工，其中采用可去除的、双面的、导热和/或导电带作为芯片载体固定介质取代常规的散布式或用网板印刷的芯片固定粘结剂。这种芯片直接焊接封装结构的关键元件在图5中画出，并图示了用于与图1中所示的结构相似的封装结构的已公开的带/固定方法。在图5中，完整的封装结构包括基层金属散热片51，它用有图形的粘结剂键合薄膜53层叠到电路载体52(由如聚酰亚胺、玻璃增强环氧树脂、环氧树脂/玻璃或陶瓷的材料组成)。电路载体52有金属电路连线54和绝缘的覆盖膜55，电路载体52在芯片56直接固定到散热片51所要求的地方有开孔。但是，在图5的结构中，芯片56用金属箔或带层57固定到基层金属散热片51，金属箔或带层57在箔57的上下表面都有压感粘结剂层59。具有双面粘结剂层59的箔/带57可以通过采用呈现在释放片上有图形的印花釉，或用固定标签常用的方法以带和卷的形式被涂覆到载体或芯片表面。独立的压感粘结剂层(非中间箔层)也可用作芯片到载体的固定介质，且可用同样的方法固定。通过采用有粘结剂层59的箔57得到优化的热性能和/或电接地能力，粘结剂层59和箔57两者都被织构化(textured)并掺有导热和/或导电颗粒以提供载体/芯片固定界面的散热和/或电的连续性。颗粒的填充剂使芯片-载体界面变硬以增强引线键合的成品率。用常规的自动定位工具通过压感粘结剂表面上的定位将芯片56固定到封装上，接着通过键合引线63将芯片56输入输出端62与载体线路键合区61相连。如果芯片上或芯片装配区出现缺陷，芯片的返工或替换可以简单地通过将粘结剂箔/带及被固定的有缺陷芯片从基层载体表面剥离而完成。在引线键合及芯片去除后，通过将新鲜的粘结剂箔/带层部分加到载体芯片位置就完成了芯片的替换。然后新的引线键合加到芯片上及载体互连键合区的原先没有键合的地方。
图6、7图示了提供这样一种紧凑的电子封装的问题的现状及一种解决方法，这种封装必须受到有限的形状系数的物理尺寸的限制，并进一步由与低成本消费电子产品应用的要求相容的低利润容限的制造技术生产。基于电路板的问题的一种解决方法是通过根据载体电子元件的降低成本的芯片直接焊接(DCA)封装和随后的将带式载体封装的组件装进形状系数电子元件而开发出一种带式载体封装(TCP)结构。
图6显示了一种常规的在许多现有应用中如寻呼机、磁盘驱动挠性电路和目前技术水平的无线电收发机的封装中使用的COF/COB引线键合结构。该结构包括挠性电路材料、有金属连线78的印制接线板或等效的电路载体76、电绝缘覆盖层80和电镀的引线键合互连键合区79。在图6中，电路载体76用粘结剂层74层叠到铝传热片70。用粘结剂71将硅集成电路(芯片)72直接固定到铝散热片70上，粘结剂层71在芯片定位前就被分配到传热片上。芯片定位后，粘结剂必须通过加热固化，通常是在批处理炉中以125-150℃加热约一小时。粘结剂固化后，键合引线85将芯片72与电镀的引线键合互连键合区79连在一起。然后用有机的、热的或紫外线固化的密封剂材料82将键合引线85保护起来。芯片直接焊接(DCA)载体装配部件(由上面的元件确定)然后就用粘结剂、螺丝、铆钉、栓钉或其它固定装置或介质粘到或粘入另一个装配部件、部件罩或最后的形状系数封装的主表面。尽管采用常规的COF/COB结构很普遍，但存在一些设计、材料和加工的不利之处，增加了成本、降低了性能，并可能造成制造的回收率损失。其例子包括下面的情况和结构。这种技术需要使用芯片固定粘结剂、分配和批固化操作。如果需要导电的芯片固定粘结剂，则粘结剂的挤出及键合区的短路会造成组件回收率损失。芯片固定粘结剂一旦固化就不能去除，从而不能支持芯片的返工和替换。芯片到载体键合区的间距设计限制使线环高度及键合引线的长度受到限制。这些几何尺寸的限制妨碍了电性能(可能的最小连线电感)的全面优化和整个封装的高度最小化。需要二次固定加工、材料和/或零件来将COF/COB装配部件粘结到封装罩或形状系数封装表面。
图7显示了用于COF/COB技术的带式载体封装(TCP)结构。在TCP封装结构中，叠层载体组件，包括载体76、金属连线78和电绝缘的覆盖层80，用粘结剂层74层叠到铝散热片。载体组件和散热片70在芯片固定位置处都有孔或开孔。在上、下两侧分别有粘结剂层88和89的金属或有机的带或箔材料87用压感粘结剂层88固定到铝散热片70的下表面。被固定的带或箔堵住了铝散热片70中的开孔，并在封装中形成一个腔。然后芯片72在芯片固定腔的基面上被固定到呈现在露出的带上的粘结剂。可以通过适当选择带芯及粘结剂填充材料来使用导热或导电的带。一些具有这些特点的商业上可用的带可用来优化散热和/或电接地特性。常用的具有金属或聚合物带芯的散热固定的具有导热和/或导电性能的带是由AdhesiveResearch Co.(AR 9045和AR 8044)或Chromerics Corp(XTS 412或T405)制造的。
在加了引线键合及应用密封剂82并固化后，通过去除背面的带粘结剂释放片90，COF/COB载体装配部件可以粘结到封装罩或给定的形状系数封装的主表面。相反，在给定的封装罩或形状系数封装表面的COF/COB载体在原位的装配也可以这样实现：首先去除背面的粘结剂释放片90，并在芯片定位、引线键合及密封之前将带/散热片/载体组件粘结到封装罩或形状系数封装表面。
用TCP结构可获得几个结构的和装配加工的好处，如上所述的，它克服了已指出的现有技术的问题。TCP取消了芯片的分配和固化操作，它是可返工的。有缺陷的芯片可以从带粘结剂去除并被替换，或带和芯片可以同时从散热片去除，紧接着是带和芯片的替换。这种结构消除了与芯片粘结剂挤出到键合区上有关的回收率损失，并通过消除附加的界面层和热阻，改善了散热的导热通道。TCP为增强电性能、紧凑封装和引线键合牢固性提供了更好的结构。例如，线的长度可减少多达25-40％，因此提高了键合引线的电特性(更小的电感和飞行时间(time of flight))；线环的高度可降低40-50％。线环高度的降低节省了更多的空间并提高了密封加工的成品率(低的线环更容易完全密封，它减小了密封剂流到电子组件其它要求严格的区域的可能性)；而且在许多应用中，芯片到载体键合区的紧凑的引线键合间距要求通过搭接来减小芯片厚度而消除尖锐的、不牢靠的引线键合。通过在TCP中的引线键合，可放松牢固引线键合要求的封装设计参数，可消除可能的芯片搭接需要。 TCP还取消了将组件粘结到封装罩或形状系数封装表面所需的补充的载体固定材料、加工，和/或零件的必要性及成本。
TCP也可用于印制电路板基芯片应用，其中带被直接用在硬的印制电路板(PCB)的背面。对COB的应用，PCB内的孔会呈现在芯片固定位置。由于这种条件下的电路板是硬的，所以不一定需要金属散热片/硬化剂。
虽然已参照优选的实施例显示并描述了本发明，熟练的技术人员可以理解在不偏离本发明的精神和范围的情况下，可以做形式及细节上的各种改动。

Claims (35)

1、可返工的芯片直接焊接组件，包括：其上具有键合区位置的载体元件，所述键合区提供了用于集成电路器件焊接的表面；
具有上表面和下表面的薄金属箔层，所述下表面由粘结剂层粘结到所述键合区位置表面；
将所述集成电路器件的所述下表面粘接到所述金属箔层的上表面的粘结剂材料，所述集成电路器件从所述载体元件的去除是通过将所述金属箔层从所述载体元件剥离以从所述载体元件去除所述集成电路器件、所述粘结剂材料和在所述粘结剂材料下面的所述箔部分。
2、权利要求1的可返工芯片直接焊接组件，其特征在于：所述薄金属箔层在上、下表面都有压感粘结剂涂层，且所述上表面的所述粘结剂涂层将所述集成电路器件固定在所述键合区位置上。
3、权利要求1的可返工芯片直接焊接组件，其特征在于：所述载体元件是金属散热片。
4、权利要求1的可返工芯片直接焊接组件，其特征在于：所述粘结剂层是压感粘结剂膜。
5、权利要求1的可返工芯片直接焊接组件，其特征在于：所述金属箔层是铝。
6、权利要求1的可返工芯片直接焊接组件，其特征在于：所述薄金属箔层由可焊接的材料形成，且所述组件还包括覆盖在所述薄金属箔层上表面的焊料层，且所述粘结剂材料将所述集成电路器件粘接到所述焊料层。
7、权利要求6的可返工芯片直接焊接组件，其特征在于：所述薄金属箔层由铜形成。
8、用载体组件制作电子组件的方法，该电子组件包括在所呈现的键合区位置处有平坦表面的元件芯片，该载体组件包括用于连接这种元件到其它电子组件元件的连线装置，所述方法包括：
在所述键合区位置粘结箔膜层；
在所述键合区位置将管芯固定粘结剂涂层涂覆到所述箔膜层上；
在所述键合区位置将元件芯片固定到所述粘结剂层；
在所述载体组件上将所述元件芯片连接到所述连线装置；
确定在所述键合区位置安装的所述元件芯片必须被替换；
通过将所述箔膜层从所述键合区位置剥离以将所述箔膜层、所述管芯固定粘结剂和所述元件芯片作为一个整体去除，从而将所述元件芯片从所述电子组件中去除；
在所述键合区位置替换所述管芯固定粘结剂涂层；
在所述键合区位置将替换的元件芯片固定到所述的管芯固定粘结剂上；及
将所述替换的元件芯片连接到所述载体组件的所述连线装置上。
9、权利要求8的制造电子组件的方法，其特征在于：所述电子组件通过将所述箔膜层粘结到散热片部件的表面以形成叠层的散热组件，及利用在确定了所述键合区位置的所述载体内的切开开孔处呈现的所述箔层的表面，将所述叠层的散热组件粘结到所述载体组件而形成。
10、权利要求9的制造电子组件的方法，其特征在于：所述电子组件通过在延伸位于所述载体切开开孔处的表面区域的表面上将所述箔膜层粘结到所述散热片表面形成，并且通过切割所述切开开孔内及所述管芯固定粘结剂周围的所述箔膜层，以将在所述管芯固定粘结剂下面的箔膜与粘结到所述散热片的所述箔膜层的剩余部分分离的步骤来进行去除芯片、管芯固定粘结剂和箔膜层的步骤。
11、权利要求10的制造电子组件的方法，其特征在于：在替换所述管芯固定粘结剂涂层的步骤之前，该方法包括将有图形的箔膜层粘结到箔层已被去除的所述散热片表面的区域的步骤。
12、权利要求9的制造电子组件的方法，其特征在于：所述电子组件通过将有图形的箔膜层粘结到所述散热片表面形成，当所述叠层的散热组件被粘结到所述载体组件时，所述散热片表面整个地位于所述切开开孔之中。
13、权利要求12的制造电子组件的方法，其特征在于：在替换所述管芯固定粘结剂涂层的步骤之前，该方法进一步包括将替换的有图形的箔膜层粘结到所述有图形的箔膜层被去除的所述散热片表面的步骤。
14、可返工的芯片直接焊接组件，包括：
具有上、下表面的载体组件，包括载体元件，并有集成电路器件将被固定在其上的芯片固定位置；
在所述载体组件中作为从所述载体组件的上表面延伸到下表面的孔而形成的芯片固定位置，包括邻近于所述芯片固定位置的所述载体组件旁的导体接触端；
粘结到所述载体组件下表面的粘结剂涂覆的箔材料，在所述芯片固定位置呈现粘结剂涂覆的箔表面；
在所述芯片固定位置用所述粘结剂涂覆的箔表面固定到所述箔材料的集成电路器件，由此将所述集成电路器件置于所述芯片固定位置的所述载体组件孔内；及
将由所述集成电路器件所载的线路连接到所述载体组件导体接触端的电连接装置。
15、权利要求14的可返工的芯片直接焊接组件，其特征在于：所述载体组件进一步包括粘结到所述载体元件的散热片，且所述芯片固定位置的孔经过所述载体元件和所述散热片从载体组件上表面延伸到所述载体组件下表面。
16、权利要求15的可返工的芯片直接焊接组件，其特征在于：所述箔材料是铝箔，且所述粘结剂是压感粘结剂。
17、权利要求15的可返工的芯片直接焊接组件，其特征在于：所述箔材料是有机芯带，且所述粘结剂是压感粘结剂。
18、权利要求16的可返工的芯片直接焊接组件，其特征在于：所述铝箔在每个表面有粘结剂涂层，所述载体组件可用它粘结到与所述载体组件下表面相邻的表面，并被其支撑。
19、权利要求17的可返工的芯片直接焊接组件，其特征在于：所述有机芯带在每个表面有粘结剂涂层，所述载体组件可用它粘结到与所述载体组件下表面相邻的表面，并被其支撑。
20、权利要求15的可返工的芯片直接焊接组件，其特征在于：所述集成电路器件用键合引线固定到载体组件导体接触端。
21、权利要求20的可返工的芯片直接焊接组件，其特征在于：安在所述芯片固定位置的所述集成电路器件被引线键合到所述导体接触端，并被包围所述芯片固定位置处的所述集成电路器件和所述键合引线的密封剂所密封。
22、权利要求16的可返工的芯片直接焊接组件，其特征在于：所述压感粘结剂包括增强导热性的填充材料。
23、权利要求17的可返工的芯片直接焊接组件，其特征在于：所述压感粘结剂包括增强导热性的填充材料。
24、权利要求16的可返工的芯片直接焊接组件，其特征在于：所述压感粘结剂包括使所述粘结剂涂层导电的填充材料。
25、权利要求17的可返工的芯片直接焊接组件，其特征在于：所述压感粘结剂包括使所述粘结剂涂层导电的填充材料。
26、可返工的芯片直接焊接组件，包括：
具有上下表面的载体元件和将散热片的上表面粘结到所述载体元件下表面的载体组件；
在所述载体组件上的芯片固定位置；
在所述载体元件内的孔，它将所述散热片的上表面露出，与位于邻近所述孔周围的所述载体元件上的导体接触端一起形成所述芯片固定位置；
具有上、下表面的箔层，在所述下表面上有粘结剂涂层，它在所述芯片固定位置处将所述箔层粘结到所述散热片；
被粘结到所述箔层上表面涂层的集成电路器件；及
将所述集成电路器件连到所述载体元件上的所述接触端区的电连接装置。
27、权利要求26的可返工的芯片直接焊接组件，其特征在于：所述箔层在所述上、下表面均有压感粘结剂涂层，且所述集成电路器件在所述芯片固定位置处用所述压感粘结剂涂层进行粘结。
28、权利要求26的可返工的芯片直接焊接组件，其特征在于：所述箔层是上、下表面均有压感粘结剂的可剥离的铝箔。
29、权利要求28的可返工的芯片直接焊接组件，其特征在于：所述载体元件是挠性电路板和硬电路板之一。
30、权利要求29的可返工的芯片直接焊接组件，其特征在于：在所述箔的表面的粘结剂层包括增强所述粘结剂层导热性的填充材料。
31、权利要求29的可返工的芯片直接焊接组件，其特征在于：在所述箔的表面的粘结剂层包括使所述粘结剂层导电的填充材料。
32、制造电子组件的方法，该电子组件包括被固定在载体组件上的芯片固定位置的具有平面的元件芯片，该载体组件包括用于将这个元件芯片与所述载体组件上其它元件相连的连线装置，该方法包括：
形成穿过确定了芯片固定位置的所述载体组件的开孔；
将粘结剂涂覆的箔层固定到跨过所述开孔的所述载体组件，所述开孔穿过所述载体，以形成带有粘结剂涂覆的表面的芯片固定腔，该表面在所述腔的基面；
将所述芯片在所述腔中固定，并被在所述腔的基面的所述粘结剂涂覆的表面所固定；及
将所述芯片与所述载体组件连线装置进行电连接。
33、权利要求32的制造电子组件的方法，其特征在于：所述载体组件通过将载体元件层叠到散热片而形成；穿过所述载体组件的所述开孔包括穿过所述载体元件和所述散热片的对准开孔，且所述芯片固定腔的所述基面通过粘结到所述散热片的粘结剂涂覆的箔层而形成。
34、权利要求33的制造电子组件的方法，其特征在于：电连接所述芯片的步骤包括将所述芯片引线键合到所述载体组件，且所述方法进一步包括应用密封剂包围所述芯片和所述键合引线。
35、权利要求34的制造电子组件的方法，其特征在于：所述对粘结剂涂覆的箔层进行粘结的步骤包括粘结在两面均有粘结剂涂层的箔层，进一步包括用没粘结到所述散热片的箔表面上的粘结剂涂层将所述电子组件粘结到安装表面。
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US6134776A (en) 2000-10-24
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US5757073A (en) 1998-05-26
JPH10178028A (ja) 1998-06-30
MY126300A (en) 2006-09-29

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