JPWO2022254690A1 - - Google Patents

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Publication number
JPWO2022254690A1
JPWO2022254690A1 JP2021561022A JP2021561022A JPWO2022254690A1 JP WO2022254690 A1 JPWO2022254690 A1 JP WO2022254690A1 JP 2021561022 A JP2021561022 A JP 2021561022A JP 2021561022 A JP2021561022 A JP 2021561022A JP WO2022254690 A1 JPWO2022254690 A1 JP WO2022254690A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021561022A
Other languages
Japanese (ja)
Other versions
JP7074937B1 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of JP7074937B1 publication Critical patent/JP7074937B1/ja
Publication of JPWO2022254690A1 publication Critical patent/JPWO2022254690A1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2021561022A 2021-06-04 2021-06-04 めっき装置 Active JP7074937B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/021358 WO2022254690A1 (ja) 2021-06-04 2021-06-04 めっき装置

Publications (2)

Publication Number Publication Date
JP7074937B1 JP7074937B1 (ja) 2022-05-24
JPWO2022254690A1 true JPWO2022254690A1 (zh) 2022-12-08

Family

ID=81731724

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021561022A Active JP7074937B1 (ja) 2021-06-04 2021-06-04 めっき装置

Country Status (5)

Country Link
US (1) US20240218553A1 (zh)
JP (1) JP7074937B1 (zh)
KR (1) KR102518086B1 (zh)
CN (1) CN115698389B (zh)
WO (1) WO2022254690A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024042700A1 (ja) * 2022-08-26 2024-02-29 株式会社荏原製作所 基板状態測定装置、めっき装置、及び基板状態測定方法
WO2024127641A1 (ja) * 2022-12-16 2024-06-20 株式会社荏原製作所 めっき装置
JP7373684B1 (ja) * 2023-03-02 2023-11-02 株式会社荏原製作所 めっき装置
JP7305075B1 (ja) * 2023-03-17 2023-07-07 株式会社荏原製作所 めっき装置

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05186898A (ja) * 1992-01-09 1993-07-27 Fujitsu Ltd メッキ方法及びメッキ装置
JP2950016B2 (ja) * 1992-05-22 1999-09-20 三菱電機株式会社 湿式プロセスにおけるめっき膜厚およびエッチング溝深さの測定方法
JP3346744B2 (ja) * 1999-01-11 2002-11-18 沖電気工業株式会社 メッキ成長装置及びメッキ成長方法
JP2001177238A (ja) * 1999-12-20 2001-06-29 Ibiden Co Ltd プリント基板の製造方法
JP3797860B2 (ja) 2000-09-27 2006-07-19 株式会社荏原製作所 めっき装置及びめっき方法
US6790763B2 (en) * 2000-12-04 2004-09-14 Ebara Corporation Substrate processing method
JP3661657B2 (ja) * 2002-03-14 2005-06-15 住友金属鉱山株式会社 電気めっき方法および電気めっき装置
JP4139124B2 (ja) * 2002-04-16 2008-08-27 株式会社荏原製作所 めっき装置及び方法
JP2004083932A (ja) * 2002-08-22 2004-03-18 Ebara Corp 電解処理装置
WO2004065664A1 (ja) * 2003-01-23 2004-08-05 Ebara Corporation めっき装置及びめっき方法
WO2004111572A1 (en) * 2003-06-13 2004-12-23 Ebara Corporation Measuring apparatus
JP4852333B2 (ja) * 2006-03-31 2012-01-11 株式会社荏原製作所 分極曲線測定方法及び電解処理装置
JP2008019496A (ja) 2006-07-14 2008-01-31 Matsushita Electric Ind Co Ltd 電解めっき装置および電解めっき方法
JP2008121062A (ja) * 2006-11-10 2008-05-29 Ebara Corp めっき装置及びめっき方法
JP2008208421A (ja) * 2007-02-26 2008-09-11 Ebara Corp めっき方法及びめっき装置
US8106651B2 (en) * 2008-04-17 2012-01-31 Novellus Systems, Inc. Methods and apparatuses for determining thickness of a conductive layer
JP5124756B1 (ja) * 2011-09-08 2013-01-23 ユケン工業株式会社 めっき電流密度分布測定装置およびめっき電流密度分布の測定方法
US20140231245A1 (en) * 2013-02-18 2014-08-21 Globalfoundries Inc. Adjustable current shield for electroplating processes
WO2014185159A1 (ja) * 2013-05-13 2014-11-20 株式会社Ｊｃｕ 基板めっき装置
JP6335763B2 (ja) * 2014-11-20 2018-05-30 株式会社荏原製作所 めっき装置及びめっき方法
JP2017052986A (ja) * 2015-09-08 2017-03-16 株式会社荏原製作所 調整板、これを備えためっき装置、及びめっき方法
JP2017115170A (ja) * 2015-12-21 2017-06-29 株式会社荏原製作所 めっき装置及びめっき方法
JP6756540B2 (ja) * 2016-08-08 2020-09-16 株式会社荏原製作所 めっき装置、めっき装置の制御方法、及び、めっき装置の制御方法をコンピュータに実行させるためのプログラムを格納した記憶媒体
JP2019002065A (ja) * 2017-06-20 2019-01-10 株式会社荏原製作所 めっき装置、及びプログラムを記録した記録媒体
JP6861610B2 (ja) * 2017-11-07 2021-04-21 株式会社荏原製作所 めっき解析方法、めっき解析システム、及びめっき解析のためのコンピュータプログラム
JP6933963B2 (ja) * 2017-11-22 2021-09-08 株式会社荏原製作所 電気めっき装置における給電点の配置の決定方法および矩形の基板をめっきするための電気めっき装置
JP7256708B2 (ja) * 2019-07-09 2023-04-12 株式会社荏原製作所 めっき装置

Also Published As

Publication number Publication date
KR102518086B1 (ko) 2023-04-06
CN115698389A (zh) 2023-02-03
CN115698389B (zh) 2023-06-16
JP7074937B1 (ja) 2022-05-24
WO2022254690A1 (ja) 2022-12-08
KR20220164696A (ko) 2022-12-13
US20240218553A1 (en) 2024-07-04

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