WO2014185159A1 - 基板めっき装置 - Google Patents
基板めっき装置 Download PDFInfo
- Publication number
- WO2014185159A1 WO2014185159A1 PCT/JP2014/058713 JP2014058713W WO2014185159A1 WO 2014185159 A1 WO2014185159 A1 WO 2014185159A1 JP 2014058713 W JP2014058713 W JP 2014058713W WO 2014185159 A1 WO2014185159 A1 WO 2014185159A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- plating
- substrate
- paddle
- plating apparatus
- substrate holder
- Prior art date
Links
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
Definitions
- the present invention relates to a plating apparatus for plating a substrate surface by immersing the substrate in a plating solution.
- a plating apparatus for semiconductor substrates in which a plating jig that holds a substrate is installed vertically and the plating solution is allowed to flow in from the bottom surface of the plating tank and overflow from the top surface, the plating solution is applied to the entire surface to be plated of the substrate during the plating process.
- a paddle capable of reciprocating movement is provided between the plating jig and the anode so as to be uniformly supplied to the anode.
- the substrate is held by a plating jig and plating is performed while reciprocating the paddle.
- the liquid flow direction and the paddle traveling direction are reversed, and the liquid flow direction is alternated. There was a problem that the flow velocity of the can not be increased.
- Patent Document 1 discloses a plating apparatus that generates a vortex in the plating solution supplied from the lower part of the plating tank by a vortex generator that generates a vortex in the plating solution.
- an object of the present invention is to provide a plating apparatus capable of performing a plating process in which the plating film thickness is uniform over the entire substrate and the deposition rate is high.
- the present invention solves the above-mentioned problem, a plating tank for storing a plating solution, a substrate holder for detachably holding a substrate, an anode disposed to face the substrate held by the substrate holder,
- a plating apparatus comprising: a rail portion that extends over a plating tank so as to be parallel to the substrate holder; and a paddle that is suspended and supported by the rail portion and is capable of reciprocating along the rail portion.
- a plating apparatus characterized in that a blade portion that is rotatable or rotatable around a shaft portion is suspended.
- the plating apparatus can adjust the flow velocity and direction hitting the substrate by providing a rotatable or pivotable blade portion on the paddle that can reciprocate along the rail portion, and can average the entire surface of the substrate without unevenness. Therefore, the plating film thickness can be made uniform.
- the liquid flow near the surface to be plated of the substrate becomes one direction, and the liquid flow is applied to the substrate surface at a high speed with a small amount of power. be able to.
- the blade of the paddle is rotated (oscillated) within a predetermined angle range so that the liquid flow is perpendicular to the surface to be plated of the substrate W and the entire surface of the substrate W is covered. Because of the flow, the plating process can be performed uniformly.
- FIG. 1 is a schematic plan view of the plating apparatus of the present invention
- FIG. 2 is a schematic front view of the plating apparatus of the present invention.
- the plating apparatus of the present invention is disposed to face a plating tank 1 for containing a plating solution, a substrate holder 2 for detachably holding a substrate, and a substrate W held by the substrate holder 2.
- each member will be described.
- the rail portion 5 is bridged above the plating tank 1 and between the substrate holder 2 and the anode 3 so as to be parallel to the substrate holder 2.
- a paddle 4 provided with driving means (not shown) for reciprocating left and right along the rail portion 5 is suspended and supported on the rail portion 5.
- the paddle 4 includes a motor 43 that is a rotation driving unit for the blade portion 41, and includes a shaft portion 42 that is rotatably suspended in conjunction with the motor 43.
- the shaft portion 42 of the paddle 4 is formed with two blade portions 41 that protrude in opposite directions, and is rotatably provided by the rotational force transmitted from the motor 43 via the shaft portion 42.
- the blade portion 41 is formed in a rectangular cross section, but it may be formed in an arc shape having a concave surface in the rotational traveling direction of the impeller. By providing such a concave surface, the blade portion 41 can efficiently catch the plating solution and improve the flow velocity.
- the number of blade portions 41 is not particularly limited, but two is particularly preferable.
- the width of the blade portion 41 (the length in the vertical direction in the drawing) be at least wide enough to cover the height of the surface to be plated of the substrate W.
- the paddle 4 of this embodiment reciprocates left and right along the rail portion 5, but at this time, the blade portion 41 always rotates in one direction.
- the blade portion 41 always rotates clockwise while the paddle 4 reciprocates. In this way, regardless of the traveling direction of the paddle 4, the rotation direction of the blade portion 41 is always constant, so that the liquid flow near the surface to be plated of the substrate W becomes one direction, and the liquid flow is reduced with less power. Can be applied at high speed.
- the second embodiment is the same as that of the first embodiment in that the paddle 4 suspended and supported by the rail portion 5 spanned above the plating tank 1 can reciprocate.
- the second embodiment is characterized by the following points. That is, in the present embodiment, the blade portion 41 of the paddle 4 is provided so as to be rotatable (swingable) by the motor 43 within a predetermined angle range. Specifically, the blade portion 41 provided so as to protrude from the shaft portion 42 in the direction of the substrate W rotates from the position perpendicular to the substrate W to the left and right as indicated by the arrows in the figure.
- the rotation angle of the blade portion 41 is not particularly limited, but in order to efficiently generate a liquid flow with the least power, it is 30 ° to 90 ° (15 ° to 45 ° on one side with respect to the perpendicular to the substrate W). It is preferable to set it in the range of degrees. Further, the number of blades 41 is not limited, but an excessive liquid flow is generated when the number of blades is increased.
- the paddle 4 since the paddle 4 reciprocates left and right along the rail portion 5 while the blade portion 41 rotates within a predetermined angle range, the liquid flow is to be plated on the substrate W. Since it strikes perpendicularly to the surface and flows over the entire surface of the substrate W, the plating process can be performed uniformly.
- the paddle 4 may be moved while being held at a constant angle with respect to the traveling direction of the paddle 4 without rotating the blade portion 41. According to this method, since the liquid flow can be efficiently applied to the surface to be plated of the substrate W, the plating process can be performed uniformly with less power.
- the paddle 4 may be provided with a stopper that holds the blade portion 41 so as to freely rotate and restricts the rotation angle of the blade portion 41 within a predetermined range.
- the resistance of the liquid with respect to the blade part 41 changes according to the traveling direction of the paddle 4, the direction and angle of the blade part 41 are changed and held in accordance with the movement of the paddle 4.
- FIG. 5 shows different embodiments of the paddle of the plating apparatus of the present invention.
- the paddle of this embodiment is of a type called a so-called crossflow impeller, and two blade portions 41 are symmetrically suspended between upper and lower disk-shaped support portions 44 with a rotation shaft portion therebetween.
- the blade portion 41 is formed to be rotatable about a shaft portion 42 provided continuously to the upper support portion 44 as a rotation axis.
- the paddle 4 of this embodiment is provided with a cover 45 that is curved in a semicircular shape along a side surface facing the anode 3 side.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
2 … … 基板ホルダ
3 … … アノード
4 … … パドル
5 … … レール部
41 … … 羽根部
42 … … 軸部
43 … … モーター部
44 … … 支持部
45 … … カバー
Claims (5)
- めっき液を収容するめっき槽と、基板を着脱自在に保持する基板ホルダと、基板ホルダに保持された基板に対向して配置されたアノードと、基板ホルダと平行するようにめっき槽の上方に架け渡されたレール部と、該レール部に懸垂支持されレール部に沿って往復移動可能なパドルとを備えためっき装置であって、該パドルには軸部を中心に回転自在もしくは回動自在な羽根部が垂設されていることを特徴とするめっき装置。
- 前記羽根部は、駆動手段により常に一方向に回転することを特徴とする請求項1に記載のめっき装置。
- 前記羽根部は、駆動手段により所定の角度の範囲内において回動することを特徴とする請求項1に記載のめっき装置。
- 前記パドルにおいて、上下の円板状の支持部の間に垂設された一組の羽根部が、上部の支持部に連設された軸部を回転軸として回転自在に形成されていることを特徴とする請求項1に記載のめっき装置。
- 前記パドルにおいて、側面に沿って半円形に湾曲するカバーが設けられていることを特徴とする請求項4に記載のめっき装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/889,954 US20160138181A1 (en) | 2013-05-13 | 2014-03-27 | Substrate plating device |
CN201480026900.1A CN105209670A (zh) | 2013-05-13 | 2014-03-27 | 基板镀敷装置 |
JP2015516981A JPWO2014185159A1 (ja) | 2013-05-13 | 2014-03-27 | 基板めっき装置 |
KR1020157032809A KR20160009035A (ko) | 2013-05-13 | 2014-03-27 | 기판 도금 장치 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013101338 | 2013-05-13 | ||
JP2013-101338 | 2013-05-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2014185159A1 true WO2014185159A1 (ja) | 2014-11-20 |
Family
ID=51898143
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2014/058713 WO2014185159A1 (ja) | 2013-05-13 | 2014-03-27 | 基板めっき装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20160138181A1 (ja) |
JP (1) | JPWO2014185159A1 (ja) |
KR (1) | KR20160009035A (ja) |
CN (1) | CN105209670A (ja) |
TW (1) | TW201447047A (ja) |
WO (1) | WO2014185159A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115698389A (zh) * | 2021-06-04 | 2023-02-03 | 株式会社荏原制作所 | 镀覆装置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3220470U (ja) * | 2018-12-26 | 2019-03-07 | 株式会社Jcu | 樹脂フィルムの湿式処理装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0585859U (ja) * | 1991-07-05 | 1993-11-19 | 住友金属工業株式会社 | 電気めっき装置 |
JPH06330397A (ja) * | 1993-05-18 | 1994-11-29 | Kida Seiko Kk | 表面被覆処理装置 |
JPH11100698A (ja) * | 1997-09-26 | 1999-04-13 | Nec Ibaraki Ltd | メッキ装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5439327A (en) * | 1977-09-05 | 1979-03-26 | Kawasaki Steel Co | Apparatus for electrolytically treating strips |
JPS61133397A (ja) * | 1984-11-30 | 1986-06-20 | Nippon Kokan Kk <Nkk> | 管端のめつき装置 |
US5904827A (en) * | 1996-10-15 | 1999-05-18 | Reynolds Tech Fabricators, Inc. | Plating cell with rotary wiper and megasonic transducer |
JP2003328197A (ja) * | 2002-05-16 | 2003-11-19 | Marunaka Kogyo Kk | めっき液の攪拌装置 |
US20040222101A1 (en) * | 2003-04-18 | 2004-11-11 | Applied Materials, Inc. | Contact ring spin during idle time and deplate for defect reduction |
JP3775744B2 (ja) | 2003-05-26 | 2006-05-17 | 有限会社エフ・エー電子 | ワイヤカット放電加工機のワイヤの張力制御装置 |
JP2006041172A (ja) * | 2004-07-27 | 2006-02-09 | Univ Waseda | スルーホールを有するプリント配線板のメッキ方法およびメッキ装置 |
-
2014
- 2014-03-27 CN CN201480026900.1A patent/CN105209670A/zh active Pending
- 2014-03-27 US US14/889,954 patent/US20160138181A1/en not_active Abandoned
- 2014-03-27 JP JP2015516981A patent/JPWO2014185159A1/ja active Pending
- 2014-03-27 KR KR1020157032809A patent/KR20160009035A/ko not_active Application Discontinuation
- 2014-03-27 WO PCT/JP2014/058713 patent/WO2014185159A1/ja active Application Filing
- 2014-04-17 TW TW103114013A patent/TW201447047A/zh unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0585859U (ja) * | 1991-07-05 | 1993-11-19 | 住友金属工業株式会社 | 電気めっき装置 |
JPH06330397A (ja) * | 1993-05-18 | 1994-11-29 | Kida Seiko Kk | 表面被覆処理装置 |
JPH11100698A (ja) * | 1997-09-26 | 1999-04-13 | Nec Ibaraki Ltd | メッキ装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115698389A (zh) * | 2021-06-04 | 2023-02-03 | 株式会社荏原制作所 | 镀覆装置 |
CN115698389B (zh) * | 2021-06-04 | 2023-06-16 | 株式会社荏原制作所 | 镀覆装置 |
Also Published As
Publication number | Publication date |
---|---|
TW201447047A (zh) | 2014-12-16 |
JPWO2014185159A1 (ja) | 2017-02-23 |
KR20160009035A (ko) | 2016-01-25 |
US20160138181A1 (en) | 2016-05-19 |
CN105209670A (zh) | 2015-12-30 |
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