JPWO2022234848A5 - - Google Patents

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Publication number
JPWO2022234848A5
JPWO2022234848A5 JP2023518697A JP2023518697A JPWO2022234848A5 JP WO2022234848 A5 JPWO2022234848 A5 JP WO2022234848A5 JP 2023518697 A JP2023518697 A JP 2023518697A JP 2023518697 A JP2023518697 A JP 2023518697A JP WO2022234848 A5 JPWO2022234848 A5 JP WO2022234848A5
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JP
Japan
Prior art keywords
signal
conductive part
insulating layer
pad
back side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023518697A
Other languages
English (en)
Japanese (ja)
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JPWO2022234848A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/019530 external-priority patent/WO2022234848A1/ja
Publication of JPWO2022234848A1 publication Critical patent/JPWO2022234848A1/ja
Publication of JPWO2022234848A5 publication Critical patent/JPWO2022234848A5/ja
Pending legal-status Critical Current

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JP2023518697A 2021-05-07 2022-05-02 Pending JPWO2022234848A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021078989 2021-05-07
PCT/JP2022/019530 WO2022234848A1 (ja) 2021-05-07 2022-05-02 信号伝達装置および絶縁モジュール

Publications (2)

Publication Number Publication Date
JPWO2022234848A1 JPWO2022234848A1 (https=) 2022-11-10
JPWO2022234848A5 true JPWO2022234848A5 (https=) 2024-02-09

Family

ID=83932747

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023518697A Pending JPWO2022234848A1 (https=) 2021-05-07 2022-05-02

Country Status (5)

Country Link
US (1) US20240072031A1 (https=)
JP (1) JPWO2022234848A1 (https=)
CN (1) CN117242571A (https=)
DE (1) DE112022002471T5 (https=)
WO (1) WO2022234848A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63266855A (ja) * 1987-04-23 1988-11-02 Nec Corp 半導体装置
JP5714455B2 (ja) 2011-08-31 2015-05-07 ルネサスエレクトロニクス株式会社 半導体集積回路
KR20150096391A (ko) * 2012-12-19 2015-08-24 르네사스 일렉트로닉스 가부시키가이샤 반도체장치
JP6395304B2 (ja) * 2013-11-13 2018-09-26 ローム株式会社 半導体装置および半導体モジュール
JP2016127162A (ja) * 2015-01-05 2016-07-11 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP6909995B2 (ja) * 2017-06-27 2021-07-28 パナソニックIpマネジメント株式会社 アイソレータ
JP7023814B2 (ja) * 2018-08-29 2022-02-22 株式会社東芝 アイソレータ及び通信システム

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