JPWO2023100807A5 - - Google Patents
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- Publication number
- JPWO2023100807A5 JPWO2023100807A5 JP2023564962A JP2023564962A JPWO2023100807A5 JP WO2023100807 A5 JPWO2023100807 A5 JP WO2023100807A5 JP 2023564962 A JP2023564962 A JP 2023564962A JP 2023564962 A JP2023564962 A JP 2023564962A JP WO2023100807 A5 JPWO2023100807 A5 JP WO2023100807A5
- Authority
- JP
- Japan
- Prior art keywords
- electrode plate
- insulating layer
- electrode
- thickness direction
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021195483 | 2021-12-01 | ||
| PCT/JP2022/043765 WO2023100807A1 (ja) | 2021-12-01 | 2022-11-28 | 絶縁チップおよび信号伝達装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023100807A1 JPWO2023100807A1 (https=) | 2023-06-08 |
| JPWO2023100807A5 true JPWO2023100807A5 (https=) | 2024-08-16 |
Family
ID=86612197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023564962A Pending JPWO2023100807A1 (https=) | 2021-12-01 | 2022-11-28 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240332345A1 (https=) |
| JP (1) | JPWO2023100807A1 (https=) |
| CN (1) | CN118355497A (https=) |
| DE (1) | DE112022005449T5 (https=) |
| WO (1) | WO2023100807A1 (https=) |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03293775A (ja) * | 1989-12-25 | 1991-12-25 | Toshiba Corp | 強誘電体コンデンサ及び半導体装置 |
| JPH07161932A (ja) * | 1993-12-03 | 1995-06-23 | Kawasaki Steel Corp | 半導体装置 |
| JP3677674B2 (ja) * | 2000-03-14 | 2005-08-03 | 松下電器産業株式会社 | 半導体装置 |
| JP3596813B2 (ja) * | 2002-08-09 | 2004-12-02 | 沖電気工業株式会社 | 半導体装置 |
| JP2005093531A (ja) * | 2003-09-12 | 2005-04-07 | Oki Electric Ind Co Ltd | 半導体素子の構造とその製造方法 |
| US8169014B2 (en) * | 2006-01-09 | 2012-05-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Interdigitated capacitive structure for an integrated circuit |
| US9299655B2 (en) * | 2010-11-18 | 2016-03-29 | The Silanna Group Pty Ltd | Single-chip integrated circuit with capacitive isolation and method for making the same |
| US8659149B2 (en) * | 2011-08-09 | 2014-02-25 | National Semiconductor Corporation | Semiconductor structure with galvanic isolation |
| US8921988B2 (en) * | 2012-12-28 | 2014-12-30 | NeoEnergy Microelectronics, Inc. | Galvanically-isolated device and method for fabricating the same |
| US9380705B2 (en) * | 2013-03-14 | 2016-06-28 | Analog Devices, Inc. | Laterally coupled isolator devices |
| JP6591637B2 (ja) | 2013-11-13 | 2019-10-16 | ローム株式会社 | 半導体装置および半導体モジュール |
| JP6555084B2 (ja) * | 2015-11-02 | 2019-08-07 | 富士通株式会社 | 容量素子及び容量素子の製造方法 |
| US20200168534A1 (en) * | 2018-11-28 | 2020-05-28 | Texas Instruments Incorporated | Multi-chip module including standalone capacitors |
-
2022
- 2022-11-28 CN CN202280078736.3A patent/CN118355497A/zh active Pending
- 2022-11-28 WO PCT/JP2022/043765 patent/WO2023100807A1/ja not_active Ceased
- 2022-11-28 JP JP2023564962A patent/JPWO2023100807A1/ja active Pending
- 2022-11-28 DE DE112022005449.2T patent/DE112022005449T5/de active Pending
-
2024
- 2024-05-29 US US18/676,517 patent/US20240332345A1/en active Pending
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