JPWO2023176662A5 - - Google Patents

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Publication number
JPWO2023176662A5
JPWO2023176662A5 JP2024507819A JP2024507819A JPWO2023176662A5 JP WO2023176662 A5 JPWO2023176662 A5 JP WO2023176662A5 JP 2024507819 A JP2024507819 A JP 2024507819A JP 2024507819 A JP2024507819 A JP 2024507819A JP WO2023176662 A5 JPWO2023176662 A5 JP WO2023176662A5
Authority
JP
Japan
Prior art keywords
insulating
insulating layer
unit
chip
back surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024507819A
Other languages
English (en)
Japanese (ja)
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JPWO2023176662A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/008970 external-priority patent/WO2023176662A1/ja
Publication of JPWO2023176662A1 publication Critical patent/JPWO2023176662A1/ja
Publication of JPWO2023176662A5 publication Critical patent/JPWO2023176662A5/ja
Pending legal-status Critical Current

Links

JP2024507819A 2022-03-17 2023-03-09 Pending JPWO2023176662A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022042493 2022-03-17
PCT/JP2023/008970 WO2023176662A1 (ja) 2022-03-17 2023-03-09 絶縁チップおよび信号伝達装置

Publications (2)

Publication Number Publication Date
JPWO2023176662A1 JPWO2023176662A1 (https=) 2023-09-21
JPWO2023176662A5 true JPWO2023176662A5 (https=) 2024-11-22

Family

ID=88023245

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024507819A Pending JPWO2023176662A1 (https=) 2022-03-17 2023-03-09

Country Status (4)

Country Link
US (1) US20250014799A1 (https=)
JP (1) JPWO2023176662A1 (https=)
CN (1) CN118891723A (https=)
WO (1) WO2023176662A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025094846A1 (ja) * 2023-11-01 2025-05-08 ローム株式会社 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101568979B (zh) * 2007-02-27 2012-07-18 株式会社村田制作所 层叠式变压器部件
JP6591637B2 (ja) * 2013-11-13 2019-10-16 ローム株式会社 半導体装置および半導体モジュール
JP6764252B2 (ja) * 2016-05-10 2020-09-30 ローム株式会社 電子部品およびその製造方法
JP6865644B2 (ja) * 2017-06-20 2021-04-28 ルネサスエレクトロニクス株式会社 半導体装置

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