JPWO2022270306A5 - - Google Patents
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- Publication number
- JPWO2022270306A5 JPWO2022270306A5 JP2023529811A JP2023529811A JPWO2022270306A5 JP WO2022270306 A5 JPWO2022270306 A5 JP WO2022270306A5 JP 2023529811 A JP2023529811 A JP 2023529811A JP 2023529811 A JP2023529811 A JP 2023529811A JP WO2022270306 A5 JPWO2022270306 A5 JP WO2022270306A5
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- semiconductor device
- switching element
- thickness direction
- conductive portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021105049 | 2021-06-24 | ||
| JP2021105049 | 2021-06-24 | ||
| PCT/JP2022/023070 WO2022270306A1 (ja) | 2021-06-24 | 2022-06-08 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022270306A1 JPWO2022270306A1 (https=) | 2022-12-29 |
| JPWO2022270306A5 true JPWO2022270306A5 (https=) | 2025-06-10 |
| JP7827718B2 JP7827718B2 (ja) | 2026-03-10 |
Family
ID=84544292
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023529811A Active JP7827718B2 (ja) | 2021-06-24 | 2022-06-08 | 半導体装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240105566A1 (https=) |
| JP (1) | JP7827718B2 (https=) |
| CN (1) | CN117546282A (https=) |
| DE (1) | DE112022002743T5 (https=) |
| WO (1) | WO2022270306A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025154475A1 (ja) * | 2024-01-18 | 2025-07-24 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
| DE102024200743A1 (de) * | 2024-01-29 | 2025-07-31 | Zf Friedrichshafen Ag | Halbleiterschaltung |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011066078A (ja) * | 2009-09-15 | 2011-03-31 | Panasonic Electric Works Co Ltd | 回路モジュールおよびその製造方法 |
| JP6425380B2 (ja) | 2013-12-26 | 2018-11-21 | ローム株式会社 | パワー回路およびパワーモジュール |
| JP7015721B2 (ja) * | 2018-04-05 | 2022-02-03 | 新光電気工業株式会社 | 配線基板、電子装置 |
| JP7293936B2 (ja) * | 2019-07-19 | 2023-06-20 | 富士電機株式会社 | 半導体装置及び半導体装置の製造方法 |
-
2022
- 2022-06-08 WO PCT/JP2022/023070 patent/WO2022270306A1/ja not_active Ceased
- 2022-06-08 JP JP2023529811A patent/JP7827718B2/ja active Active
- 2022-06-08 CN CN202280043844.7A patent/CN117546282A/zh not_active Withdrawn
- 2022-06-08 DE DE112022002743.6T patent/DE112022002743T5/de not_active Withdrawn
-
2023
- 2023-11-03 US US18/501,436 patent/US20240105566A1/en active Pending
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