JPWO2023032611A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2023032611A5
JPWO2023032611A5 JP2023545398A JP2023545398A JPWO2023032611A5 JP WO2023032611 A5 JPWO2023032611 A5 JP WO2023032611A5 JP 2023545398 A JP2023545398 A JP 2023545398A JP 2023545398 A JP2023545398 A JP 2023545398A JP WO2023032611 A5 JPWO2023032611 A5 JP WO2023032611A5
Authority
JP
Japan
Prior art keywords
conductive portion
insulating layer
back surface
side conductive
transmission device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023545398A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023032611A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/030340 external-priority patent/WO2023032611A1/ja
Publication of JPWO2023032611A1 publication Critical patent/JPWO2023032611A1/ja
Publication of JPWO2023032611A5 publication Critical patent/JPWO2023032611A5/ja
Pending legal-status Critical Current

Links

JP2023545398A 2021-08-30 2022-08-08 Pending JPWO2023032611A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021140075 2021-08-30
PCT/JP2022/030340 WO2023032611A1 (ja) 2021-08-30 2022-08-08 信号伝達装置および絶縁チップ

Publications (2)

Publication Number Publication Date
JPWO2023032611A1 JPWO2023032611A1 (https=) 2023-03-09
JPWO2023032611A5 true JPWO2023032611A5 (https=) 2024-05-23

Family

ID=85412225

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023545398A Pending JPWO2023032611A1 (https=) 2021-08-30 2022-08-08

Country Status (5)

Country Link
US (1) US20240186309A1 (https=)
JP (1) JPWO2023032611A1 (https=)
CN (1) CN117981081A (https=)
DE (1) DE112022003691T5 (https=)
WO (1) WO2023032611A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010113383A1 (ja) * 2009-03-31 2010-10-07 日本電気株式会社 半導体装置
JP5714455B2 (ja) 2011-08-31 2015-05-07 ルネサスエレクトロニクス株式会社 半導体集積回路
JP6841634B2 (ja) * 2016-11-08 2021-03-10 ローム株式会社 電子部品
JP6909995B2 (ja) * 2017-06-27 2021-07-28 パナソニックＩｐマネジメント株式会社 アイソレータ
US11044022B2 (en) * 2018-08-29 2021-06-22 Analog Devices Global Unlimited Company Back-to-back isolation circuit
US11152975B2 (en) * 2019-10-16 2021-10-19 Analog Devices International Unlimited Company High frequency galvanic isolators
CN114762114A (zh) * 2019-11-29 2022-07-15 罗姆股份有限公司 半导体装置
JP7686394B2 (ja) * 2020-12-24 2025-06-02 ローム株式会社 ゲートドライバ
JP7749398B2 (ja) 2021-09-30 2025-10-06 大和ハウス工業株式会社 梁接合構造及び鉄骨造建物

Similar Documents

Publication Publication Date Title
KR100263403B1 (ko) 초음파 탐촉자(ultrasonic wave probe)
CN108074886B (zh) 半导体装置封装及其制造方法
JPWO2023032612A5 (https=)
US12400991B2 (en) Clip structure for semiconductor package and semiconductor package including the same
CN106910996A (zh) 天线装置、移动终端及其制造方法
JPWO2023032611A5 (https=)
CN210379235U (zh) 电池和穿戴式电子设备
JP2019211508A5 (ja) 半導体モジュールおよび半導体モジュールを用いた通信方法
JPWO2023176662A5 (https=)
CN106886333B (zh) 感测装置
CN110323561A (zh) 一种集成多种射频模块的印制电路板及制作方法
CN206209794U (zh) 指纹识别模组及电子装置
CN119674496A (zh) 一种aip模组、有源相控阵天线和通信装置
JPWO2022234848A5 (https=)
JP2019530326A (ja) 超音波アレイ用の冗長な接続点を有するフレキシブル回路
TW201717476A (zh) 具天線之金屬網格觸控模組及其天線導接裝置
TWI820052B (zh) 無線裝置
JPWO2023171391A5 (https=)
JPWO2024043105A5 (https=)
CN104934670B (zh) 一种低损耗扁平传输线
CN116034332A (zh) 显示面板及其制作方法、显示装置
JP6413786B2 (ja) Ｉｃカード
CN221575979U (zh) 一种压电陶瓷片的连接结构
CN108062501A (zh) 指纹识别模组及电子装置
CN112995374B (zh) 显示模组及电子设备