JPWO2023171391A5 - - Google Patents

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Publication number
JPWO2023171391A5
JPWO2023171391A5 JP2024506053A JP2024506053A JPWO2023171391A5 JP WO2023171391 A5 JPWO2023171391 A5 JP WO2023171391A5 JP 2024506053 A JP2024506053 A JP 2024506053A JP 2024506053 A JP2024506053 A JP 2024506053A JP WO2023171391 A5 JPWO2023171391 A5 JP WO2023171391A5
Authority
JP
Japan
Prior art keywords
insulating layer
dielectric constant
insulating
high dielectric
constant film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024506053A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023171391A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/006472 external-priority patent/WO2023171391A1/ja
Publication of JPWO2023171391A1 publication Critical patent/JPWO2023171391A1/ja
Publication of JPWO2023171391A5 publication Critical patent/JPWO2023171391A5/ja
Pending legal-status Critical Current

Links

JP2024506053A 2022-03-09 2023-02-22 Pending JPWO2023171391A1 (https=)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022036062 2022-03-09
JP2022036063 2022-03-09
PCT/JP2023/006472 WO2023171391A1 (ja) 2022-03-09 2023-02-22 絶縁チップおよび信号伝達装置

Publications (2)

Publication Number Publication Date
JPWO2023171391A1 JPWO2023171391A1 (https=) 2023-09-14
JPWO2023171391A5 true JPWO2023171391A5 (https=) 2024-11-26

Family

ID=87935007

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024506053A Pending JPWO2023171391A1 (https=) 2022-03-09 2023-02-22

Country Status (3)

Country Link
US (1) US20240420884A1 (https=)
JP (1) JPWO2023171391A1 (https=)
WO (1) WO2023171391A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025094846A1 (ja) * 2023-11-01 2025-05-08 ローム株式会社 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8410575B2 (en) * 2010-03-30 2013-04-02 Infineon Technologies Austria Ag High voltage semiconductor devices and methods of forming the same
WO2014112179A1 (ja) * 2013-01-18 2014-07-24 三菱電機株式会社 信号伝送絶縁デバイス及びパワー半導体モジュール
US10199340B2 (en) * 2014-11-18 2019-02-05 Mitsubishi Electric Corporation Signal transmission insulative device and power semiconductor module
JP7284121B2 (ja) * 2020-03-23 2023-05-30 株式会社東芝 アイソレータ

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