WO2021000075A1 - 一种传输线 - Google Patents

一种传输线 Download PDF

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Publication number
WO2021000075A1
WO2021000075A1 PCT/CN2019/093954 CN2019093954W WO2021000075A1 WO 2021000075 A1 WO2021000075 A1 WO 2021000075A1 CN 2019093954 W CN2019093954 W CN 2019093954W WO 2021000075 A1 WO2021000075 A1 WO 2021000075A1
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WO
WIPO (PCT)
Prior art keywords
layer
ground
base layer
superimposed
transmission line
Prior art date
Application number
PCT/CN2019/093954
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English (en)
French (fr)
Inventor
梁悦
陈勇利
王建安
Original Assignee
瑞声声学科技(深圳)有限公司
瑞声精密制造科技(常州)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 瑞声声学科技(深圳)有限公司, 瑞声精密制造科技(常州)有限公司 filed Critical 瑞声声学科技(深圳)有限公司
Priority to PCT/CN2019/093954 priority Critical patent/WO2021000075A1/zh
Priority to CN201910606434.9A priority patent/CN110364798A/zh
Priority to US16/990,948 priority patent/US11374299B2/en
Publication of WO2021000075A1 publication Critical patent/WO2021000075A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines
    • H01P3/082—Multilayer dielectric
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/026—Coplanar striplines [CPS]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/18—Waveguides; Transmission lines of the waveguide type built-up from several layers to increase operating surface, i.e. alternately conductive and dielectric layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material

Definitions

  • the invention relates to the field of electronic information and communication, and in particular to a transmission line.
  • the signal transmission line is often laminated with multiple layers of materials, with a certain thickness, and the multiple connection layers involved are generally made of conductive materials such as metal with hardness. Larger, resulting in poor bending performance of the transmission line.
  • the purpose of the present invention is to provide a transmission line with good bending performance.
  • a transmission line comprising a main baseline layer and a superimposed line layer stacked on a local part of the main baseline layer, the main baseline layer having a superimposing portion on which the superimposed line layer is superimposed and no superimposing line
  • the non-superimposed portion of the layer, the superimposed line layer and the superimposed portion constitute the non-bendable portion of the transmission line
  • the non-superimposed portion constitutes the bendable portion of the transmission line
  • the main base layer includes a first ground Layer, a first base layer stacked on one side of the first ground layer, a signal line layer stacked on a side of the first base layer away from the first ground layer, and a signal line layer stacked on the signal line layer away from all
  • the second base layer on the side of the first base layer, the superimposed line layer includes a third base layer and a second ground layer, and the third base layer is stacked on the side of the second base layer away from the signal line layer, so The second ground stack is arranged on a side of the third base layer away from the second base layer
  • the signal line layer includes an overlapping portion where the second base layer is stacked and an extension portion where the second base layer is not stacked.
  • the signal line layer includes a plurality of ground plates spaced apart from each other and a signal line located between two adjacent ground plates.
  • the sum of the thickness of the second base layer and the thickness of the third base layer is equal to the thickness of the first base layer.
  • the main baseline layer further includes a first protective layer disposed on the side of the first ground layer away from the first base layer, and the superimposed line layer further includes a layer superimposed on the second ground layer The second protective layer on the side away from the third base layer.
  • the length of the second protective layer is the same as the length of the second ground layer and is smaller than the length of the third base layer, and the length of the first protective layer is smaller than the length of the first ground layer .
  • the transmission line further includes a plurality of first ground vias arranged at intervals in the non-overlapping portion, and the first ground vias pass through the first base layer and have two ends connected to the signal line respectively.
  • the ground plate of the layer is electrically connected to the first ground layer.
  • the transmission line further includes a plurality of second ground vias arranged at intervals in the superimposing portion, and the second ground vias sequentially pass through the first base layer, the signal line layer, and the The second base layer and the third base layer are electrically connected to the first ground layer, the second ground layer, and the ground plate of the signal line layer.
  • a transmission line comprising a main baseline layer and a superimposed line layer stacked on a local part of the main baseline layer, the main baseline layer having a superimposing portion on which the superimposed line layer is superimposed and no superimposing line
  • the non-superimposed portion of the layer, the superimposed line layer and the superimposed portion constitute the non-bendable portion of the transmission line
  • the non-superimposed portion constitutes the bendable portion of the transmission line
  • the main base layer includes a first ground Layer, a first base layer stacked on one side of the first ground layer, a signal line layer stacked on a side of the first base layer away from the first ground layer, and a signal line layer stacked on the signal line layer away from all
  • the second base layer on the side of the first base layer, the superimposed line layer includes a third base layer and a second ground layer, and the third base layer is stacked on the side of the second base layer away from the signal line layer, so The second ground stack is arranged on a side of the third base layer away from the second base layer
  • the signal line layer includes an overlapping portion where the second base layer is stacked and an extension portion where the second base layer is not stacked.
  • the signal line layer includes a plurality of ground plates spaced apart from each other and a signal line located between two adjacent ground plates.
  • the sum of the thickness of the second base layer and the thickness of the third base layer is equal to the thickness of the first base layer.
  • the main baseline layer further includes a first protective layer disposed on the side of the first ground layer away from the first base layer, and the superimposed line layer further includes a layer superimposed on the second ground layer The second protective layer on the side away from the third base layer.
  • the length of the second protective layer is the same as the length of the second ground layer and is smaller than the length of the third base layer, and the length of the first protective layer is smaller than the length of the first ground layer .
  • the transmission line further includes a plurality of first ground vias arranged at intervals in the non-overlapping portion, and the first ground vias pass through the first base layer and have two ends connected to the signal line respectively.
  • the ground plate of the layer is electrically connected to the first ground layer.
  • the transmission line further includes a plurality of second ground vias arranged at intervals in the superimposing portion, and the second ground vias sequentially pass through the first base layer, the signal line layer, and the The second base layer and the third base layer are electrically connected to the first ground layer, the second ground layer, and the ground plate of the signal line layer.
  • FIG. 1 is a schematic structural diagram of a transmission line provided by an embodiment of the present invention
  • Figure 2 is an exploded schematic diagram of the transmission line shown in Figure 1;
  • Figure 3 is a partial enlarged view of A in Figure 1;
  • Fig. 4 is a schematic diagram from another angle of Fig. 1;
  • Figure 5 is a partial cross-sectional view along line B-B of Figure 4.
  • Fig. 6 is a partial enlarged view of C in Fig. 5.
  • an element when an element is referred to as being “fixed on” or “disposed on” another element, the element may be directly on the other element or there may be a centering element at the same time.
  • an element When an element is referred to as being “connected” to another element, it can be directly connected to the other element or an intermediate element may also exist.
  • a transmission line 100 includes a main base layer 10 and a superimposed line layer 20 stacked on a local part of the main base layer 10.
  • the main baseline layer 10 has a superimposed portion 11 on which a superimposed wire layer 20 is superimposed and a non-superimposed portion 12 without superimposed wire layer 20.
  • the superimposed wire layer 20 and superimposed portion 11 constitute the non-bendable part of the transmission line 100
  • the non-superimposed portion 12 constitutes the bendable part of the transmission line 100
  • the thickness of the bendable part is small, so it has better bendability and improves the practicability and service life of the transmission line 100.
  • the main base layer 10 includes a first protective layer 13, a first ground layer 14 stacked on the first protective layer 13, and a first base layer 15 stacked on the first ground layer 14.
  • the thickness and material properties of the first base layer 15, the second base layer 17, and the third base layer 21 determine the performance index of the entire transmission line 100 to a large extent, and it is usually preferably made of a material with a smaller dielectric constant and loss factor, and In this embodiment, the sum of the thickness of the second base layer 17 and the thickness of the third base layer 21 is equal to the thickness of the first base layer 15. Understandably, the thicknesses of the first base layer 15, the second base layer 17 and the third base layer 21 are also It can be set differently according to the thickness requirements in the actual production process.
  • the length of the first protection layer 13 is less than the length of the first ground layer 14
  • the length of the second protection layer 23 is the same as the length of the second ground layer 22 and is less than the length of the third base layer 21
  • the first protection layer 14 and the second protective layer 23 have the functions of soldering resistance and insulation, can prevent the internal metal from being oxidized, and can also avoid problems such as short circuit caused by the contact between the transmission line 100 and the external conductor.
  • the signal line layer 16 includes a plurality of ground plates 161 arranged at intervals and signal lines 162 located between adjacent ground plates 161.
  • the number of ground plates 161 in this embodiment is preferably Three but not limited to three.
  • the three ground plates 161 are arranged at intervals and a signal line 162 is provided between two adjacent ground plates 161. Since the ground plate 161 and the signal line 162 are located on the same plane, There is no need to provide additional conductive blind vias to connect each signal line 162, which avoids the problem that the transmission line 100 cannot be transmitted due to the fracture of the conductive blind vias.
  • the manufacturing process of the conductive blind vias is complicated and the cost is high. The performance has a greater impact. Therefore, without the need to provide conductive blind vias, the cost is reduced, the signal transmission loss is greatly reduced, and the reliability of the transmission line 100 is improved.
  • the signal line 162 at the non-bendable part forms a strip line structure with the first ground layer 14 and the second ground layer 22, and the signal line 162 at the bendable part forms a strip line structure.
  • the ground plates 161 on both sides form a coplanar waveguide structure.
  • the signal line layer 16 includes an overlapping portion 163 on which the second base layer 17 is stacked and an extension portion 164 on which the second base layer 17 is not stacked, that is, the ground plate 161 and the signal line 162
  • the two ends respectively extend to the outside of the second base layer 17, and the outer end of the coplanar waveguide structure is not covered with the second base layer 17, so it can be used as a test window to facilitate the performance test of the transmission line 100.
  • the transmission line 100 further includes a plurality of first ground vias 30 and second ground vias 40 arranged at intervals.
  • the first ground vias 30 are located in the non-overlapping portion 12, and the second ground vias 40 are located in the overlapping portion 11.
  • the length of the first ground via 30 is less than the length of the second ground via 40 and both are perpendicularly connected to the first ground layer 14.
  • the first ground via 30 passes through the first base layer 15 and has two ends connected to the first
  • the ground layer 14 is electrically connected to the ground plate 161 of the signal line layer 16, and the second ground via 40 passes through the first base layer 15, the signal line layer 16, the second base layer 17, and the third base layer 21 in turn, and is electrically connected to the first base layer.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
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Abstract

本发明提供了一种传输线，包括主基线层和叠设于主基线层局部部位上的叠加线层，主基线层具有叠设有叠加线层的叠加部和没有叠设叠加线层的非叠加部，叠加线层和叠加部构成传输线的不可弯折部分，非叠加部构成传输线的可弯折部分，主基线层包括第一接地层、叠设于第一接地层一侧的第一基层、叠设于第一基层远离第一接地层一侧的信号线层以及叠设于信号线层远离第一基层一侧的第二基层，叠加线层包括第三基层和第二接地层，第三基层叠设于第二基层远离信号线层的一侧，第二接地层叠设于第三基层远离第二基层的一侧。本发明提供的传输线，可弯折部分的厚度小，因此弯折性能好，从而提升了传输线的实用性和使用寿命。

Description

一种传输线 技术领域
本发明涉及电子信息和通信领域，尤其涉及一种传输线。
 背景技术
随着手机、平板电脑、笔记本等消费类电子设备向轻薄化方向发展，传统的利用同轴线电缆来传输高频信号的方式已变得捉襟见肘，一种使用新的信号传输线来取代同轴传输线实现信号传输成为未来可能的新的应用趋势之一。
为了使传输线能与天线等电路模块实现阻抗匹配，信号传输线常采用多层材料压合的方式，具有一定的厚度，而且涉及到的多个连接层一般都是由金属等导电材料制成，硬度较大，因而导致传输线的弯折性能较差。
因此，有必要提供一种传输线来解决现有传输线弯折性能差的问题。
 技术问题
本发明的目的在于提供一种折弯性能好的传输线。
 技术解决方案
本发明的目的采用如下技术方案实现：
一种传输线，包括主基线层和叠设于所述主基线层局部部位上的叠加线层，所述主基线层具有叠设有所述叠加线层的叠加部和没有叠设所述叠加线层的非叠加部，所述叠加线层和所述叠加部构成所述传输线的不可弯折部分，所述非叠加部构成所述传输线的可弯折部分，所述主基线层包括第一接地层、叠设于所述第一接地层一侧的第一基层、叠设于所述第一基层远离所述第一接地层一侧的信号线层以及叠设于所述信号线层远离所述第一基层一侧的第二基层，所述叠加线层包括第三基层和第二接地层，所述第三基层叠设于所述第二基层远离所述信号线层的一侧，所述第二接地层叠设于所述第三基层远离所述第二基层的一侧。
作为一种改进，所述信号线层包括叠设有所述第二基层的重叠部和没有叠设所述第二基层的延伸部。
作为一种改进，所述信号线层包括若干个相互间隔设置的接地板以及位于相邻两个所述接地板之间的信号线。
作为一种改进，所述第二基层的厚度与所述第三基层的厚度之和等于所述第一基层的厚度。
作为一种改进，所述主基线层还包括设于所述第一接地层远离所述第一基层一侧的第一保护层，所述叠加线层还包括叠设于所述第二接地层远离所述第三基层一侧的第二保护层。
作为一种改进，所述第二保护层的长度与所述第二接地层的长度相同并小于所述第三基层的长度，所述第一保护层的长度小于所述第一接地层的长度。
作为一种改进，所述传输线还包括若干个间隔设置于所述非叠加部的第一接地过孔，所述第一接地过孔穿过所述第一基层且两端分别与所述信号线层的所述接地板和所述第一接地层电性连接。
作为一种改进，所述传输线还包括若干个间隔设置于所述叠加部的第二接地过孔，所述第二接地过孔依次穿过所述第一基层、所述信号线层、所述第二基层及所述第三基层且电性连接所述第一接地层、所述第二接地层和所述信号线层的所述接地板。
 有益效果
本发明的目的采用如下技术方案实现：
一种传输线，包括主基线层和叠设于所述主基线层局部部位上的叠加线层，所述主基线层具有叠设有所述叠加线层的叠加部和没有叠设所述叠加线层的非叠加部，所述叠加线层和所述叠加部构成所述传输线的不可弯折部分，所述非叠加部构成所述传输线的可弯折部分，所述主基线层包括第一接地层、叠设于所述第一接地层一侧的第一基层、叠设于所述第一基层远离所述第一接地层一侧的信号线层以及叠设于所述信号线层远离所述第一基层一侧的第二基层，所述叠加线层包括第三基层和第二接地层，所述第三基层叠设于所述第二基层远离所述信号线层的一侧，所述第二接地层叠设于所述第三基层远离所述第二基层的一侧。
作为一种改进，所述信号线层包括叠设有所述第二基层的重叠部和没有叠设所述第二基层的延伸部。
作为一种改进，所述信号线层包括若干个相互间隔设置的接地板以及位于相邻两个所述接地板之间的信号线。
作为一种改进，所述第二基层的厚度与所述第三基层的厚度之和等于所述第一基层的厚度。
作为一种改进，所述主基线层还包括设于所述第一接地层远离所述第一基层一侧的第一保护层，所述叠加线层还包括叠设于所述第二接地层远离所述第三基层一侧的第二保护层。
作为一种改进，所述第二保护层的长度与所述第二接地层的长度相同并小于所述第三基层的长度，所述第一保护层的长度小于所述第一接地层的长度。
作为一种改进，所述传输线还包括若干个间隔设置于所述非叠加部的第一接地过孔，所述第一接地过孔穿过所述第一基层且两端分别与所述信号线层的所述接地板和所述第一接地层电性连接。
作为一种改进，所述传输线还包括若干个间隔设置于所述叠加部的第二接地过孔，所述第二接地过孔依次穿过所述第一基层、所述信号线层、所述第二基层及所述第三基层且电性连接所述第一接地层、所述第二接地层和所述信号线层的所述接地板。
 附图说明
图1为本发明实施例提供的传输线的结构示意图；
图2为图1中所示传输线的分解示意图；
图3为图1中A处的局部放大图；
图4为图1的另一角度示意图；
图5为图4的沿B-B线的局部剖视图；
图6为图5中C处的局部放大图。
附图标记：100、传输线；10、主基线层；20、叠加线层；11、叠加部；12、非叠加部；13、第一保护层；14、第一接地层；15、第一基层；16、信号线层；17、第二基层；21、第三基层；22、第二接地层；23、第二保护层；161、接地板；162、信号线；163、重叠部；164、延伸部；30、第一接地过孔；40、第二接地过孔。
 本发明的实施方式
下面结合附图和实施方式对本发明作进一步说明。
需要说明的是，本发明实施例中所有方向性指示（诸如上、下、左、右、前、后、内、外、顶部、底部……）仅用于解释在某一特定姿态（如附图所示）下各部件之间的相对位置关系等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
还需要说明的是，当元件被称为“固定于”或“设置于”另一个元件上时，该元件可以直接在另一个元件上或者可能同时存在居中元件。当一个元件被称为“连接”另一个元件，它可以是直接连接另一个元件或者可能同时存在居中元件。
请参阅图1、图4、图5及图6，依照本发明实施例提供的一种传输线100，包括主基线层10和叠设于所述主基线层10局部部位上的叠加线层20，主基线层10具有叠设有叠加线层20的叠加部11和没有叠设叠加线层20的非叠加部12，叠加线层20和叠加部11构成传输线100的不可弯折部分，非叠加部12构成传输线100的可弯折部分，可弯折部分的厚度较小，因此具有较好的可弯折性，提高了传输线100的实用性和使用寿命。
请参阅图4、图5及图6，主基线层10包括第一保护层13、叠设于第一保护层13的第一接地层14、叠设于第一接地层14的第一基层15、叠设于第一基层15的信号线层16以及叠设于信号线层16的第二基层17，叠加线层20包括第三基层21、叠设在第三基层21的第二接地层22以及叠设于第二接地层22的第二保护层23，第三基层21叠设在第二基层17上。第一基层15、第二基层17以及第三基层21的厚度以及材料物性在很大程度上决定了整个传输线100的性能指标，通常优选为具有较小介质常数和损耗因子的材料制成，而且在本实施例中，第二基层17的厚度与第三基层21的厚度之和等于第一基层15的厚度，可以理解地，第一基层15、第二基层17以及第三基层21的厚度也可以根据实际制作过程中的厚度要求有不同设置。
请参阅图2，第一保护层13的长度小于第一接地层14的长度，第二保护层23的长度与第二接地层22的长度相同且小于第三基层21的长度，第一保护层14和第二保护层23具有阻焊和绝缘的作用，可以防止内部金属被氧化，还能避免因传输线100与外部导体接触而发生短路等问题。
请参阅图2、图3与图4，信号线层16包括多个间隔设置的接地板161和位于相邻接地板161之间的信号线162，接地板161的数量在本实施例中优选为三个但并不局限于三个，三个接地板161相互间隔设置且相邻两个接地板161之间都设有一个信号线162，由于接地板161和信号线162都位于同一平面，因此不需要额外设置导电盲孔连接各信号线162，避免了因导电盲孔断裂导致传输线100无法传输的问题，而且导电盲孔的制作工艺较复杂，成本较高，且导电盲孔对传输线100的性能有较大的影响，因此在不需要设置导电盲孔的情况下，减少了成本，也在很大程度上减少了信号的传输损耗，提升了传输线100的可靠性。
请参阅图2、图3与图4，位于不可弯折部分的信号线162与第一接地层14和第二接地层22形成带状线结构，位于可弯折部分的信号线162与位于其两侧的接地板161形成共面波导结构，信号线层16包括叠设有第二基层17的重叠部163和没有叠设第二基层17的延伸部164，即接地板161和信号线162的两端分别延伸至第二基层17外，共面波导结构的外端部上未覆盖有第二基层17，因此可以作为测试窗口，从而方便对传输线100进行性能测试。
请参阅图2，传输线100还包括若干个间隔设置的第一接地过孔30和第二接地过孔40，第一接地过孔30位于非叠加部12，第二接地过孔40位于叠加部11，第一接地过孔30的长度小于第二接地过孔40的长度且两者均与第一接地层14垂直连接，第一接地过孔30穿过第一基层15且两端分别与第一接地层14和信号线层16的接地板161电性连接，第二接地过孔40依次穿过第一基层15、信号线层16、第二基层17及第三基层21且电性连接第一接地层14、第二接地层22以及信号线层16的接地板161。
以上所述的仅是本发明的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本发明创造构思的前提下，还可以做出改进，但这些均属于本发明的保护范围。

Claims (8)

  1. 一种传输线，其特征在于，包括主基线层和叠设于所述主基线层局部部位上的叠加线层，所述主基线层具有叠设有所述叠加线层的叠加部和没有叠设所述叠加线层的非叠加部，所述叠加线层和所述叠加部构成所述传输线的不可弯折部分，所述非叠加部构成所述传输线的可弯折部分，所述主基线层包括第一接地层、叠设于所述第一接地层一侧的第一基层、叠设于所述第一基层远离所述第一接地层一侧的信号线层以及叠设于所述信号线层远离所述第一基层一侧的第二基层，所述叠加线层包括第三基层和第二接地层，所述第三基层叠设于所述第二基层远离所述信号线层的一侧，所述第二接地层叠设于所述第三基层远离所述第二基层的一侧。
  2. 根据权利要求1所述的传输线，其特征在于，所述信号线层包括叠设有所述第二基层的重叠部和没有叠设所述第二基层的延伸部。
  3. 根据权利要求1所述的传输线，其特征在于，所述信号线层包括若干个相互间隔设置的接地板以及位于相邻两个所述接地板之间的信号线。
  4. 根据权利要求1所述的传输线，其特征在于，所述第二基层的厚度与所述第三基层的厚度之和等于所述第一基层的厚度。
  5. 根据权利要求1所述的传输线，其特征在于，所述主基线层还包括设于所述第一接地层远离所述第一基层一侧的第一保护层，所述叠加线层还包括叠设于所述第二接地层远离所述第三基层一侧的第二保护层。
  6. 根据权利要求5所述的传输线，其特征在于，所述第二保护层的长度与所述第二接地层的长度相同并小于所述第三基层的长度，所述第一保护层的长度小于所述第一接地层的长度。
  7. 根据权利要求3所述的传输线，其特征在于，所述传输线还包括若干个间隔设置于所述非叠加部的第一接地过孔，所述第一接地过孔穿过所述第一基层且两端分别与所述信号线层的所述接地板和所述第一接地层电性连接。
  8. 根据权利要求3所述的传输线，其特征在于，所述传输线还包括若干个间隔设置于所述叠加部的第二接地过孔，所述第二接地过孔依次穿过所述第一基层、所述信号线层、所述第二基层及所述第三基层且电性连接所述第一接地层、所述第二接地层和所述信号线层的所述接地板。
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