JPWO2022186192A5 - - Google Patents
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- Publication number
- JPWO2022186192A5 JPWO2022186192A5 JP2023503858A JP2023503858A JPWO2022186192A5 JP WO2022186192 A5 JPWO2022186192 A5 JP WO2022186192A5 JP 2023503858 A JP2023503858 A JP 2023503858A JP 2023503858 A JP2023503858 A JP 2023503858A JP WO2022186192 A5 JPWO2022186192 A5 JP WO2022186192A5
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- bonding electrode
- bonding
- manufacturing
- oxide film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 14
- 238000004519 manufacturing process Methods 0.000 claims 10
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 8
- 229910052759 nickel Inorganic materials 0.000 claims 7
- 238000000034 method Methods 0.000 claims 5
- 238000006243 chemical reaction Methods 0.000 claims 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 4
- 229910052737 gold Inorganic materials 0.000 claims 4
- 239000010931 gold Substances 0.000 claims 4
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 claims 4
- 229910052763 palladium Inorganic materials 0.000 claims 4
- 229910000838 Al alloy Inorganic materials 0.000 claims 2
- 229910001252 Pd alloy Inorganic materials 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 claims 2
- 239000011810 insulating material Substances 0.000 claims 2
- 238000007747 plating Methods 0.000 claims 2
- 230000008021 deposition Effects 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021032617 | 2021-03-02 | ||
| JP2021032617 | 2021-03-02 | ||
| PCT/JP2022/008577 WO2022186192A1 (ja) | 2021-03-02 | 2022-03-01 | 半導体素子、電力変換装置および半導体素子の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022186192A1 JPWO2022186192A1 (https=) | 2022-09-09 |
| JPWO2022186192A5 true JPWO2022186192A5 (https=) | 2023-09-27 |
| JP7584620B2 JP7584620B2 (ja) | 2024-11-15 |
Family
ID=83154753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023503858A Active JP7584620B2 (ja) | 2021-03-02 | 2022-03-01 | 半導体素子の製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7584620B2 (https=) |
| CN (1) | CN116888708A (https=) |
| WO (1) | WO2022186192A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7708018B2 (ja) * | 2022-07-01 | 2025-07-15 | 株式会社デンソー | 半導体装置 |
| JP2024134749A (ja) * | 2023-03-22 | 2024-10-04 | 三菱電機株式会社 | 半導体装置、電力変換装置および半導体装置の製造方法 |
| WO2025004877A1 (ja) * | 2023-06-27 | 2025-01-02 | 三菱電機株式会社 | 半導体装置、電力変換装置および半導体装置の製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4465760B2 (ja) * | 1999-12-14 | 2010-05-19 | 富士電機システムズ株式会社 | 縦型半導体装置の製造方法 |
| JP5707709B2 (ja) * | 2009-03-23 | 2015-04-30 | 富士電機株式会社 | 半導体装置の製造方法 |
| JP5649322B2 (ja) * | 2010-04-12 | 2015-01-07 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
| JP2017059636A (ja) * | 2015-09-15 | 2017-03-23 | 三菱電機株式会社 | 半導体装置の製造方法 |
-
2022
- 2022-03-01 WO PCT/JP2022/008577 patent/WO2022186192A1/ja not_active Ceased
- 2022-03-01 JP JP2023503858A patent/JP7584620B2/ja active Active
- 2022-03-01 CN CN202280016917.3A patent/CN116888708A/zh active Pending
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