JPWO2021145217A5 - - Google Patents
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- JPWO2021145217A5 JPWO2021145217A5 JP2021571138A JP2021571138A JPWO2021145217A5 JP WO2021145217 A5 JPWO2021145217 A5 JP WO2021145217A5 JP 2021571138 A JP2021571138 A JP 2021571138A JP 2021571138 A JP2021571138 A JP 2021571138A JP WO2021145217 A5 JPWO2021145217 A5 JP WO2021145217A5
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- semiconductor device
- light emitting
- plan
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202062960581P | 2020-01-13 | 2020-01-13 | |
| US62/960,581 | 2020-01-13 | ||
| PCT/JP2020/049117 WO2021145217A1 (ja) | 2020-01-13 | 2020-12-28 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021145217A1 JPWO2021145217A1 (https=) | 2021-07-22 |
| JP7082721B2 JP7082721B2 (ja) | 2022-06-08 |
| JPWO2021145217A5 true JPWO2021145217A5 (https=) | 2022-06-08 |
Family
ID=76863982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021571138A Active JP7082721B2 (ja) | 2020-01-13 | 2020-12-28 | 半導体装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20220337029A1 (https=) |
| EP (1) | EP4071945B1 (https=) |
| JP (1) | JP7082721B2 (https=) |
| CN (1) | CN114982078B (https=) |
| TW (1) | TWI784382B (https=) |
| WO (1) | WO2021145217A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114981680B (zh) * | 2020-01-07 | 2025-05-16 | 艾尔默斯半导体欧洲股份公司 | 光模块和具有至少一个这种光模块的LiDAR设备 |
| JP7292241B2 (ja) * | 2020-06-23 | 2023-06-16 | 株式会社東芝 | 半導体装置およびその製造方法 |
| TWI800381B (zh) * | 2022-05-19 | 2023-04-21 | 璦司柏電子股份有限公司 | 內建閘極驅動晶片的覆晶封裝功率電晶體模組 |
| DE102023112751A1 (de) * | 2023-05-15 | 2024-11-21 | Ams-Osram International Gmbh | Integriertes bauelementpackage mit einem auf einem halbleiterchip angeordneten laserpackage |
| CN118368510B (zh) * | 2024-06-14 | 2024-10-18 | 宁波舜宇光电信息有限公司 | 一种深度信息摄像模组及3d传感装置 |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6005262A (en) * | 1997-08-20 | 1999-12-21 | Lucent Technologies Inc. | Flip-chip bonded VCSEL CMOS circuit with silicon monitor detector |
| US6246708B1 (en) * | 1997-08-27 | 2001-06-12 | Xerox Corporation | Semiconductor laser with associated electronic components integrally formed therewith |
| US6392290B1 (en) * | 2000-04-07 | 2002-05-21 | Siliconix Incorporated | Vertical structure for semiconductor wafer-level chip scale packages |
| DE10041079A1 (de) * | 2000-08-22 | 2002-03-14 | Osram Opto Semiconductors Gmbh | Lasermodul mit Ansteuerschaltung |
| JP2002232062A (ja) * | 2001-02-02 | 2002-08-16 | Ricoh Co Ltd | 光電子集積素子 |
| JP2003068861A (ja) * | 2001-08-28 | 2003-03-07 | Matsushita Electric Works Ltd | 半導体スイッチ装置 |
| KR20070061994A (ko) | 2005-12-12 | 2007-06-15 | 삼성전자주식회사 | 표시 장치 및 그 제조 방법 |
| JP5092431B2 (ja) * | 2006-02-03 | 2012-12-05 | 株式会社デンソー | 半導体装置 |
| JP4856465B2 (ja) * | 2006-04-19 | 2012-01-18 | 日本オプネクスト株式会社 | 光半導体素子搭載基板、および光送信モジュール |
| US8294208B2 (en) * | 2008-03-04 | 2012-10-23 | International Rectifier Corporation | Semiconductor device having a gate contact on one surface electrically connected to a gate bus on an opposing surface |
| US7910992B2 (en) * | 2008-07-15 | 2011-03-22 | Maxim Integrated Products, Inc. | Vertical MOSFET with through-body via for gate |
| US9587817B2 (en) * | 2014-09-28 | 2017-03-07 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED tube lamp |
| JP2010177454A (ja) * | 2009-01-29 | 2010-08-12 | Sanyo Electric Co Ltd | 絶縁ゲート型半導体装置 |
| CN104157685B (zh) * | 2010-07-27 | 2018-01-16 | 株式会社电装 | 具有开关元件和续流二极管的半导体装置及其控制方法 |
| JP5584146B2 (ja) | 2011-01-20 | 2014-09-03 | 株式会社東芝 | 半導体装置およびその製造方法 |
| JP5566354B2 (ja) * | 2011-09-06 | 2014-08-06 | 三菱電機株式会社 | 電力用半導体スイッチおよび電力変換装置 |
| JP5956736B2 (ja) * | 2011-10-18 | 2016-07-27 | 日本放送協会 | 積層型半導体装置及びその製造方法 |
| JP6287105B2 (ja) * | 2013-11-22 | 2018-03-07 | ソニー株式会社 | 光通信デバイス、受信装置、送信装置及び送受信システム |
| JP6555247B2 (ja) * | 2016-12-28 | 2019-08-07 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
| US10574026B2 (en) * | 2017-03-23 | 2020-02-25 | Infineon Technologies Ag | Circuit and method for driving a laser diode |
| US20180278011A1 (en) * | 2017-03-23 | 2018-09-27 | Infineon Technologies Ag | Laser diode module |
| DE102017108050B4 (de) * | 2017-04-13 | 2022-01-13 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterstrahlungsquelle |
| DE102017112101A1 (de) | 2017-06-01 | 2018-12-06 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleitermodul |
| US20190067901A1 (en) * | 2017-08-30 | 2019-02-28 | Lumentum Operations Llc | Integrated package for laser driver and laser diode |
| US10681814B2 (en) * | 2017-09-08 | 2020-06-09 | Kemet Electronics Corporation | High density multi-component packages |
| JP6967929B2 (ja) * | 2017-09-28 | 2021-11-17 | シャープ株式会社 | 光センサ及び電子機器 |
| JP6828697B2 (ja) | 2018-02-06 | 2021-02-10 | 株式会社豊田中央研究所 | Ｉｉｉ族窒化物半導体装置およびｉｉｉ族窒化物半導体基板の製造方法 |
| EP3783759B1 (en) * | 2018-04-19 | 2024-05-01 | Sony Semiconductor Solutions Corporation | Semiconductor laser drive device and method for manufacturing same |
| WO2020118279A1 (en) | 2018-12-06 | 2020-06-11 | Finisar Corporation | Optoelectronic assembly |
| US11166363B2 (en) * | 2019-01-11 | 2021-11-02 | Tactotek Oy | Electrical node, method for manufacturing electrical node and multilayer structure comprising electrical node |
| JP2020145274A (ja) * | 2019-03-05 | 2020-09-10 | 富士ゼロックス株式会社 | 発光装置、光学装置および情報処理装置 |
| JP7318305B2 (ja) * | 2019-05-17 | 2023-08-01 | 富士フイルムビジネスイノベーション株式会社 | 発光装置 |
-
2020
- 2020-12-28 EP EP20913120.0A patent/EP4071945B1/en active Active
- 2020-12-28 JP JP2021571138A patent/JP7082721B2/ja active Active
- 2020-12-28 TW TW109146542A patent/TWI784382B/zh active
- 2020-12-28 CN CN202080092513.3A patent/CN114982078B/zh active Active
- 2020-12-28 WO PCT/JP2020/049117 patent/WO2021145217A1/ja not_active Ceased
-
2022
- 2022-06-30 US US17/854,921 patent/US20220337029A1/en not_active Abandoned
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