JPWO2021085465A5 - - Google Patents

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JPWO2021085465A5
JPWO2021085465A5 JP2021553647A JP2021553647A JPWO2021085465A5 JP WO2021085465 A5 JPWO2021085465 A5 JP WO2021085465A5 JP 2021553647 A JP2021553647 A JP 2021553647A JP 2021553647 A JP2021553647 A JP 2021553647A JP WO2021085465 A5 JPWO2021085465 A5 JP WO2021085465A5
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thickness
film
alcu film
alcu
layer
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JP2021553647A
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JP7545404B2 (ja
JPWO2021085465A1 (https=
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Priority claimed from PCT/JP2020/040408 external-priority patent/WO2021085465A1/ja
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JP2021553647A 2019-10-30 2020-10-28 弾性波装置 Active JP7545404B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019197792 2019-10-30
JP2019197792 2019-10-30
PCT/JP2020/040408 WO2021085465A1 (ja) 2019-10-30 2020-10-28 弾性波装置

Publications (3)

Publication Number Publication Date
JPWO2021085465A1 JPWO2021085465A1 (https=) 2021-05-06
JPWO2021085465A5 true JPWO2021085465A5 (https=) 2022-06-27
JP7545404B2 JP7545404B2 (ja) 2024-09-04

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JP2021553647A Active JP7545404B2 (ja) 2019-10-30 2020-10-28 弾性波装置

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US (1) US12519453B2 (https=)
JP (1) JP7545404B2 (https=)
CN (1) CN114600373A (https=)
WO (1) WO2021085465A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12483221B2 (en) 2021-07-15 2025-11-25 Skyworks Solutions, Inc. Multilayer piezoelectric substrate device with partially recessed passivation layer
US12081199B2 (en) * 2022-01-13 2024-09-03 Rf360 Singapore Pte. Ltd. Surface acoustic wave (SAW) device with one or more intermediate layers for self-heating improvement
US20230327630A1 (en) * 2022-04-08 2023-10-12 Skyworks Solutions, Inc. Method of manufacture of acoustic wave device with trench portions for transverse mode suppression
CN115567027B (zh) * 2022-11-03 2023-07-07 常州承芯半导体有限公司 换能装置、声表面波谐振装置及其形成方法、滤波装置
WO2024117061A1 (ja) * 2022-11-28 2024-06-06 京セラ株式会社 弾性波装置および通信装置
US20250373229A1 (en) * 2024-05-29 2025-12-04 Rf360 Singapore Pte. Ltd. Surface acoustic wave (saw) device with barrier layers between aluminum-copper layers

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3379049B2 (ja) * 1993-10-27 2003-02-17 富士通株式会社 表面弾性波素子とその製造方法
JP3445971B2 (ja) * 2000-12-14 2003-09-16 富士通株式会社 弾性表面波素子
US7148610B2 (en) 2002-02-01 2006-12-12 Oc Oerlikon Balzers Ag Surface acoustic wave device having improved performance and method of making the device
JP2005151063A (ja) * 2003-11-13 2005-06-09 Fujitsu Media Device Kk 弾性表面波装置の製造方法
JP2007013815A (ja) 2005-07-01 2007-01-18 Sanyo Electric Co Ltd 弾性表面波素子およびその製造方法
WO2017212774A1 (ja) * 2016-06-07 2017-12-14 株式会社村田製作所 弾性波装置及びその製造方法
JP2018014715A (ja) * 2016-07-06 2018-01-25 京セラ株式会社 弾性波素子、フィルタ素子および通信装置
CN110024286B (zh) * 2016-11-22 2024-02-06 株式会社村田制作所 弹性波装置、前端电路以及通信装置
WO2019009373A1 (ja) * 2017-07-06 2019-01-10 京セラ株式会社 弾性波素子、フィルタ素子および通信装置
JP2019114986A (ja) * 2017-12-25 2019-07-11 株式会社村田製作所 弾性波装置
US10700662B2 (en) * 2017-12-28 2020-06-30 Taiyo Yuden Co., Ltd. Acoustic wave device, filter, and multiplexer

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