CN114600373A - 弹性波装置 - Google Patents

弹性波装置 Download PDF

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Publication number
CN114600373A
CN114600373A CN202080074325.8A CN202080074325A CN114600373A CN 114600373 A CN114600373 A CN 114600373A CN 202080074325 A CN202080074325 A CN 202080074325A CN 114600373 A CN114600373 A CN 114600373A
Authority
CN
China
Prior art keywords
layer
wave device
elastic wave
electrode
piezoelectric substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080074325.8A
Other languages
English (en)
Chinese (zh)
Inventor
林泰伸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of CN114600373A publication Critical patent/CN114600373A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02929—Means for compensation or elimination of undesirable effects of ageing changes of characteristics, e.g. electro-acousto-migration
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02866—Means for compensation or elimination of undesirable effects of bulk wave excitation and reflections
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H03H9/14538—Formation
    • H03H9/14541—Multilayer finger or busbar electrode
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02157—Dimensional parameters, e.g. ratio between two dimension parameters, length, width or thickness

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
CN202080074325.8A 2019-10-30 2020-10-28 弹性波装置 Pending CN114600373A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019197792 2019-10-30
JP2019-197792 2019-10-30
PCT/JP2020/040408 WO2021085465A1 (ja) 2019-10-30 2020-10-28 弾性波装置

Publications (1)

Publication Number Publication Date
CN114600373A true CN114600373A (zh) 2022-06-07

Family

ID=75716027

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080074325.8A Pending CN114600373A (zh) 2019-10-30 2020-10-28 弹性波装置

Country Status (4)

Country Link
US (1) US12519453B2 (https=)
JP (1) JP7545404B2 (https=)
CN (1) CN114600373A (https=)
WO (1) WO2021085465A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115567027A (zh) * 2022-11-03 2023-01-03 常州承芯半导体有限公司 换能装置、声表面波谐振装置及其形成方法、滤波装置

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12483221B2 (en) 2021-07-15 2025-11-25 Skyworks Solutions, Inc. Multilayer piezoelectric substrate device with partially recessed passivation layer
US12081199B2 (en) * 2022-01-13 2024-09-03 Rf360 Singapore Pte. Ltd. Surface acoustic wave (SAW) device with one or more intermediate layers for self-heating improvement
US20230327630A1 (en) * 2022-04-08 2023-10-12 Skyworks Solutions, Inc. Method of manufacture of acoustic wave device with trench portions for transverse mode suppression
WO2024117061A1 (ja) * 2022-11-28 2024-06-06 京セラ株式会社 弾性波装置および通信装置
US20250373229A1 (en) * 2024-05-29 2025-12-04 Rf360 Singapore Pte. Ltd. Surface acoustic wave (saw) device with barrier layers between aluminum-copper layers

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5773917A (en) * 1993-10-27 1998-06-30 Fujitsu Limited Surface acoustic wave device and production process thereof
WO2019009373A1 (ja) * 2017-07-06 2019-01-10 京セラ株式会社 弾性波素子、フィルタ素子および通信装置
CN109314503A (zh) * 2016-06-07 2019-02-05 株式会社村田制作所 弹性波装置及其制造方法
CN110011637A (zh) * 2017-12-25 2019-07-12 株式会社村田制作所 弹性波装置
CN110024286A (zh) * 2016-11-22 2019-07-16 株式会社村田制作所 弹性波装置、前端电路以及通信装置
CN110022134A (zh) * 2017-12-28 2019-07-16 太阳诱电株式会社 声波器件、滤波器以及复用器

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3445971B2 (ja) * 2000-12-14 2003-09-16 富士通株式会社 弾性表面波素子
US7148610B2 (en) 2002-02-01 2006-12-12 Oc Oerlikon Balzers Ag Surface acoustic wave device having improved performance and method of making the device
JP2005151063A (ja) * 2003-11-13 2005-06-09 Fujitsu Media Device Kk 弾性表面波装置の製造方法
JP2007013815A (ja) 2005-07-01 2007-01-18 Sanyo Electric Co Ltd 弾性表面波素子およびその製造方法
JP2018014715A (ja) * 2016-07-06 2018-01-25 京セラ株式会社 弾性波素子、フィルタ素子および通信装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5773917A (en) * 1993-10-27 1998-06-30 Fujitsu Limited Surface acoustic wave device and production process thereof
CN109314503A (zh) * 2016-06-07 2019-02-05 株式会社村田制作所 弹性波装置及其制造方法
CN110024286A (zh) * 2016-11-22 2019-07-16 株式会社村田制作所 弹性波装置、前端电路以及通信装置
WO2019009373A1 (ja) * 2017-07-06 2019-01-10 京セラ株式会社 弾性波素子、フィルタ素子および通信装置
CN110011637A (zh) * 2017-12-25 2019-07-12 株式会社村田制作所 弹性波装置
CN110022134A (zh) * 2017-12-28 2019-07-16 太阳诱电株式会社 声波器件、滤波器以及复用器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115567027A (zh) * 2022-11-03 2023-01-03 常州承芯半导体有限公司 换能装置、声表面波谐振装置及其形成方法、滤波装置
WO2024094057A1 (zh) * 2022-11-03 2024-05-10 常州承芯半导体有限公司 换能装置、声表面波谐振装置及其形成方法、滤波装置

Also Published As

Publication number Publication date
WO2021085465A1 (ja) 2021-05-06
JP7545404B2 (ja) 2024-09-04
US20220247377A1 (en) 2022-08-04
JPWO2021085465A1 (https=) 2021-05-06
US12519453B2 (en) 2026-01-06

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