JPWO2021085465A1 - - Google Patents
Info
- Publication number
- JPWO2021085465A1 JPWO2021085465A1 JP2021553647A JP2021553647A JPWO2021085465A1 JP WO2021085465 A1 JPWO2021085465 A1 JP WO2021085465A1 JP 2021553647 A JP2021553647 A JP 2021553647A JP 2021553647 A JP2021553647 A JP 2021553647A JP WO2021085465 A1 JPWO2021085465 A1 JP WO2021085465A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
- H03H9/02929—Means for compensation or elimination of undesirable effects of ageing changes of characteristics, e.g. electro-acousto-migration
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/25—Constructional features of resonators using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
- H03H9/02866—Means for compensation or elimination of undesirable effects of bulk wave excitation and reflections
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
- H03H9/14538—Formation
- H03H9/14541—Multilayer finger or busbar electrode
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02157—Dimensional parameters, e.g. ratio between two dimension parameters, length, width or thickness
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019197792 | 2019-10-30 | ||
| JP2019197792 | 2019-10-30 | ||
| PCT/JP2020/040408 WO2021085465A1 (ja) | 2019-10-30 | 2020-10-28 | 弾性波装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021085465A1 true JPWO2021085465A1 (https=) | 2021-05-06 |
| JPWO2021085465A5 JPWO2021085465A5 (https=) | 2022-06-27 |
| JP7545404B2 JP7545404B2 (ja) | 2024-09-04 |
Family
ID=75716027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021553647A Active JP7545404B2 (ja) | 2019-10-30 | 2020-10-28 | 弾性波装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US12519453B2 (https=) |
| JP (1) | JP7545404B2 (https=) |
| CN (1) | CN114600373A (https=) |
| WO (1) | WO2021085465A1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12483221B2 (en) | 2021-07-15 | 2025-11-25 | Skyworks Solutions, Inc. | Multilayer piezoelectric substrate device with partially recessed passivation layer |
| US12081199B2 (en) * | 2022-01-13 | 2024-09-03 | Rf360 Singapore Pte. Ltd. | Surface acoustic wave (SAW) device with one or more intermediate layers for self-heating improvement |
| US20230327630A1 (en) * | 2022-04-08 | 2023-10-12 | Skyworks Solutions, Inc. | Method of manufacture of acoustic wave device with trench portions for transverse mode suppression |
| CN115567027B (zh) * | 2022-11-03 | 2023-07-07 | 常州承芯半导体有限公司 | 换能装置、声表面波谐振装置及其形成方法、滤波装置 |
| WO2024117061A1 (ja) * | 2022-11-28 | 2024-06-06 | 京セラ株式会社 | 弾性波装置および通信装置 |
| US20250373229A1 (en) * | 2024-05-29 | 2025-12-04 | Rf360 Singapore Pte. Ltd. | Surface acoustic wave (saw) device with barrier layers between aluminum-copper layers |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019009373A1 (ja) * | 2017-07-06 | 2019-01-10 | 京セラ株式会社 | 弾性波素子、フィルタ素子および通信装置 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3379049B2 (ja) * | 1993-10-27 | 2003-02-17 | 富士通株式会社 | 表面弾性波素子とその製造方法 |
| JP3445971B2 (ja) * | 2000-12-14 | 2003-09-16 | 富士通株式会社 | 弾性表面波素子 |
| US7148610B2 (en) | 2002-02-01 | 2006-12-12 | Oc Oerlikon Balzers Ag | Surface acoustic wave device having improved performance and method of making the device |
| JP2005151063A (ja) * | 2003-11-13 | 2005-06-09 | Fujitsu Media Device Kk | 弾性表面波装置の製造方法 |
| JP2007013815A (ja) | 2005-07-01 | 2007-01-18 | Sanyo Electric Co Ltd | 弾性表面波素子およびその製造方法 |
| WO2017212774A1 (ja) * | 2016-06-07 | 2017-12-14 | 株式会社村田製作所 | 弾性波装置及びその製造方法 |
| JP2018014715A (ja) * | 2016-07-06 | 2018-01-25 | 京セラ株式会社 | 弾性波素子、フィルタ素子および通信装置 |
| CN110024286B (zh) * | 2016-11-22 | 2024-02-06 | 株式会社村田制作所 | 弹性波装置、前端电路以及通信装置 |
| JP2019114986A (ja) * | 2017-12-25 | 2019-07-11 | 株式会社村田製作所 | 弾性波装置 |
| US10700662B2 (en) * | 2017-12-28 | 2020-06-30 | Taiyo Yuden Co., Ltd. | Acoustic wave device, filter, and multiplexer |
-
2020
- 2020-10-28 CN CN202080074325.8A patent/CN114600373A/zh active Pending
- 2020-10-28 JP JP2021553647A patent/JP7545404B2/ja active Active
- 2020-10-28 WO PCT/JP2020/040408 patent/WO2021085465A1/ja not_active Ceased
-
2022
- 2022-04-20 US US17/724,754 patent/US12519453B2/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019009373A1 (ja) * | 2017-07-06 | 2019-01-10 | 京セラ株式会社 | 弾性波素子、フィルタ素子および通信装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021085465A1 (ja) | 2021-05-06 |
| JP7545404B2 (ja) | 2024-09-04 |
| CN114600373A (zh) | 2022-06-07 |
| US20220247377A1 (en) | 2022-08-04 |
| US12519453B2 (en) | 2026-01-06 |
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