JP2022511074A5 - - Google Patents

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Publication number
JP2022511074A5
JP2022511074A5 JP2021532034A JP2021532034A JP2022511074A5 JP 2022511074 A5 JP2022511074 A5 JP 2022511074A5 JP 2021532034 A JP2021532034 A JP 2021532034A JP 2021532034 A JP2021532034 A JP 2021532034A JP 2022511074 A5 JP2022511074 A5 JP 2022511074A5
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JP
Japan
Prior art keywords
layer
piezoelectric
functional layer
thin
saw device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021532034A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022511074A (ja
JP7550757B2 (ja
Filing date
Publication date
Priority claimed from DE102018131946.0A external-priority patent/DE102018131946A1/de
Application filed filed Critical
Publication of JP2022511074A publication Critical patent/JP2022511074A/ja
Publication of JP2022511074A5 publication Critical patent/JP2022511074A5/ja
Application granted granted Critical
Publication of JP7550757B2 publication Critical patent/JP7550757B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2021532034A 2018-12-12 2019-11-29 薄膜ｓａｗデバイス Active JP7550757B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102018131946.0 2018-12-12
DE102018131946.0A DE102018131946A1 (de) 2018-12-12 2018-12-12 Dünnfilm-SAW-Vorrichtung
PCT/EP2019/083119 WO2020120175A1 (en) 2018-12-12 2019-11-29 Thin film saw device

Publications (3)

Publication Number Publication Date
JP2022511074A JP2022511074A (ja) 2022-01-28
JP2022511074A5 true JP2022511074A5 (https=) 2022-11-10
JP7550757B2 JP7550757B2 (ja) 2024-09-13

Family

ID=68766748

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021532034A Active JP7550757B2 (ja) 2018-12-12 2019-11-29 薄膜ｓａｗデバイス

Country Status (7)

Country Link
US (1) US11936362B2 (https=)
EP (1) EP3895309B1 (https=)
JP (1) JP7550757B2 (https=)
CN (2) CN113169720B (https=)
DE (1) DE102018131946A1 (https=)
TW (1) TW202110087A (https=)
WO (1) WO2020120175A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017111448B4 (de) * 2017-05-24 2022-02-10 RF360 Europe GmbH SAW-Vorrichtung mit unterdrückten Störmodensignalen
KR102844657B1 (ko) * 2023-07-18 2025-08-11 (주)와이솔 개선된 q성능을 갖는 표면탄성파 소자 및 그 제조 방법

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06132760A (ja) * 1992-10-21 1994-05-13 Murata Mfg Co Ltd 弾性表面波装置
JP2008078739A (ja) * 2006-09-19 2008-04-03 Fujitsu Media Device Kk 弾性波デバイスおよびフィルタ
JP5637136B2 (ja) * 2009-07-07 2014-12-10 株式会社村田製作所 弾性波デバイスおよび弾性波デバイスの製造方法
JP5429200B2 (ja) * 2010-05-17 2014-02-26 株式会社村田製作所 複合圧電基板の製造方法および圧電デバイス
TW201334071A (zh) 2012-02-07 2013-08-16 Ritedia Corp 光透射氮化鋁層及相關裝置及方法
WO2013191122A1 (ja) * 2012-06-22 2013-12-27 株式会社村田製作所 弾性波装置
FR3024587B1 (fr) 2014-08-01 2018-01-26 Soitec Procede de fabrication d'une structure hautement resistive
FR3026582A1 (fr) 2014-09-29 2016-04-01 Commissariat Energie Atomique Circuit resonant a frequence et a impedance variables
JP6360847B2 (ja) * 2016-03-18 2018-07-18 太陽誘電株式会社 弾性波デバイス
FR3052298B1 (fr) * 2016-06-02 2018-07-13 Soitec Structure hybride pour dispositif a ondes acoustiques de surface
FR3053532B1 (fr) * 2016-06-30 2018-11-16 Soitec Structure hybride pour dispositif a ondes acoustiques de surface
KR102294196B1 (ko) * 2017-03-09 2021-08-27 가부시키가이샤 무라타 세이사쿠쇼 탄성파 장치, 고주파 프론트 엔드 회로 및 통신 장치
DE102017111448B4 (de) 2017-05-24 2022-02-10 RF360 Europe GmbH SAW-Vorrichtung mit unterdrückten Störmodensignalen
CN107733395A (zh) * 2017-11-14 2018-02-23 安徽云塔电子科技有限公司 一种压电谐振器和压电谐振器的制备方法

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