JP7550757B2 - 薄膜ｓａｗデバイス - Google Patents

薄膜ｓａｗデバイス Download PDF

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JP7550757B2
JP7550757B2 JP2021532034A JP2021532034A JP7550757B2 JP 7550757 B2 JP7550757 B2 JP 7550757B2 JP 2021532034 A JP2021532034 A JP 2021532034A JP 2021532034 A JP2021532034 A JP 2021532034A JP 7550757 B2 JP7550757 B2 JP 7550757B2
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Prior art keywords
layer
piezoelectric
functional layer
saw device
tcf
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Japanese (ja)
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JP2022511074A (ja
JP2022511074A5 (https=
Inventor
クナップ、マティアス
ブライル、インゴ
ハウザー、マルクス
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アールエフ３６０・シンガポール・ピーティーイー・リミテッド
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H10N30/079—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing using intermediate layers, e.g. for growth control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
    • H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
    • H10N30/708—Intermediate layers, e.g. barrier, adhesion or growth control buffer layers
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves
    • H03H9/6489—Compensation of undesirable effects

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
JP2021532034A 2018-12-12 2019-11-29 薄膜ｓａｗデバイス Active JP7550757B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102018131946.0 2018-12-12
DE102018131946.0A DE102018131946A1 (de) 2018-12-12 2018-12-12 Dünnfilm-SAW-Vorrichtung
PCT/EP2019/083119 WO2020120175A1 (en) 2018-12-12 2019-11-29 Thin film saw device

Publications (3)

Publication Number Publication Date
JP2022511074A JP2022511074A (ja) 2022-01-28
JP2022511074A5 JP2022511074A5 (https=) 2022-11-10
JP7550757B2 true JP7550757B2 (ja) 2024-09-13

Family

ID=68766748

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021532034A Active JP7550757B2 (ja) 2018-12-12 2019-11-29 薄膜ｓａｗデバイス

Country Status (7)

Country Link
US (1) US11936362B2 (https=)
EP (1) EP3895309B1 (https=)
JP (1) JP7550757B2 (https=)
CN (2) CN113169720B (https=)
DE (1) DE102018131946A1 (https=)
TW (1) TW202110087A (https=)
WO (1) WO2020120175A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017111448B4 (de) * 2017-05-24 2022-02-10 RF360 Europe GmbH SAW-Vorrichtung mit unterdrückten Störmodensignalen
KR102844657B1 (ko) * 2023-07-18 2025-08-11 (주)와이솔 개선된 q성능을 갖는 표면탄성파 소자 및 그 제조 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008078739A (ja) 2006-09-19 2008-04-03 Fujitsu Media Device Kk 弾性波デバイスおよびフィルタ
JP2017532758A (ja) 2014-08-01 2017-11-02 ソイテック 無線周波アプリケーションの構造
WO2017207911A1 (fr) 2016-06-02 2017-12-07 Soitec Structure hybride pour dispositif a ondes acoustiques de surface
WO2018002504A1 (fr) 2016-06-30 2018-01-04 Soitec Structure hybride pour dispositif a ondes acoustiques de surface
WO2018163842A1 (ja) 2017-03-09 2018-09-13 株式会社村田製作所 弾性波装置、高周波フロントエンド回路及び通信装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06132760A (ja) * 1992-10-21 1994-05-13 Murata Mfg Co Ltd 弾性表面波装置
JP5637136B2 (ja) * 2009-07-07 2014-12-10 株式会社村田製作所 弾性波デバイスおよび弾性波デバイスの製造方法
JP5429200B2 (ja) * 2010-05-17 2014-02-26 株式会社村田製作所 複合圧電基板の製造方法および圧電デバイス
TW201334071A (zh) 2012-02-07 2013-08-16 Ritedia Corp 光透射氮化鋁層及相關裝置及方法
WO2013191122A1 (ja) * 2012-06-22 2013-12-27 株式会社村田製作所 弾性波装置
FR3026582A1 (fr) 2014-09-29 2016-04-01 Commissariat Energie Atomique Circuit resonant a frequence et a impedance variables
JP6360847B2 (ja) * 2016-03-18 2018-07-18 太陽誘電株式会社 弾性波デバイス
DE102017111448B4 (de) 2017-05-24 2022-02-10 RF360 Europe GmbH SAW-Vorrichtung mit unterdrückten Störmodensignalen
CN107733395A (zh) * 2017-11-14 2018-02-23 安徽云塔电子科技有限公司 一种压电谐振器和压电谐振器的制备方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008078739A (ja) 2006-09-19 2008-04-03 Fujitsu Media Device Kk 弾性波デバイスおよびフィルタ
JP2017532758A (ja) 2014-08-01 2017-11-02 ソイテック 無線周波アプリケーションの構造
WO2017207911A1 (fr) 2016-06-02 2017-12-07 Soitec Structure hybride pour dispositif a ondes acoustiques de surface
WO2018002504A1 (fr) 2016-06-30 2018-01-04 Soitec Structure hybride pour dispositif a ondes acoustiques de surface
WO2018163842A1 (ja) 2017-03-09 2018-09-13 株式会社村田製作所 弾性波装置、高周波フロントエンド回路及び通信装置

Also Published As

Publication number Publication date
US11936362B2 (en) 2024-03-19
JP2022511074A (ja) 2022-01-28
EP3895309A1 (en) 2021-10-20
WO2020120175A1 (en) 2020-06-18
US20210320642A1 (en) 2021-10-14
CN113169720B (zh) 2025-08-26
CN113169720A (zh) 2021-07-23
CN121012456A (zh) 2025-11-25
TW202110087A (zh) 2021-03-01
EP3895309B1 (en) 2025-09-03
DE102018131946A1 (de) 2020-06-18

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