JP2025510560A5 - - Google Patents
Info
- Publication number
- JP2025510560A5 JP2025510560A5 JP2024552761A JP2024552761A JP2025510560A5 JP 2025510560 A5 JP2025510560 A5 JP 2025510560A5 JP 2024552761 A JP2024552761 A JP 2024552761A JP 2024552761 A JP2024552761 A JP 2024552761A JP 2025510560 A5 JP2025510560 A5 JP 2025510560A5
- Authority
- JP
- Japan
- Prior art keywords
- composite structure
- support substrate
- thin layer
- manufacturing
- crystal thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR2202859 | 2022-03-30 | ||
| FR2202859A FR3134234B1 (fr) | 2022-03-30 | 2022-03-30 | Structure composite comprenant une couche mince monocristalline sur un substrat support en carbure de silicium poly-cristallin et procede de fabrication associe |
| PCT/EP2023/056240 WO2023186498A1 (fr) | 2022-03-30 | 2023-03-10 | Structure composite comprenant une couche mince monocristalline sur un substrat support en carbure de silicium poly-cristallin et procede de fabrication associe |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2025510560A JP2025510560A (ja) | 2025-04-15 |
| JP2025510560A5 true JP2025510560A5 (https=) | 2026-01-21 |
Family
ID=82196623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024552761A Pending JP2025510560A (ja) | 2022-03-30 | 2023-03-10 | 多結晶炭化ケイ素製の支持基板上の単結晶薄層を含む複合構造体、および関連する製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP4500575A1 (https=) |
| JP (1) | JP2025510560A (https=) |
| KR (1) | KR20240165938A (https=) |
| CN (1) | CN118922912A (https=) |
| FR (1) | FR3134234B1 (https=) |
| TW (1) | TW202343780A (https=) |
| WO (1) | WO2023186498A1 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3142829B1 (fr) | 2022-12-05 | 2026-01-02 | Soitec Silicon On Insulator | Procédé de fabrication d’un substrat pour un dispositif électronique de puissance ou radiofréquence |
| US20240332365A1 (en) | 2023-03-31 | 2024-10-03 | Stmicroelectronics International N.V. | Low resistivity polycrystalline based substrate or wafer |
| FR3160512A1 (fr) * | 2024-03-25 | 2025-09-26 | Soitec | Dispositif monolithique incluant un transistor et un condensateur cointégrés sur un substrat à base de diamant, et procédé de fabrication d’un tel dispositif |
| FR3160513A1 (fr) * | 2024-03-25 | 2025-09-26 | Soitec | Dispositif monolithique incluant un transistor et un condensateur cointégrés sur un substrat à base de diamant, et procédé de fabrication d’un tel dispositif |
| FR3160520A1 (fr) * | 2024-03-25 | 2025-09-26 | Soitec | Dispositif monolithique incluant un transistor et un condensateur cointégrés sur un substrat à base de diamant, et procédé de fabrication d’un tel dispositif |
| FR3165752A1 (fr) * | 2024-08-21 | 2026-02-27 | Soitec | Procédé de fabrication d’une structure composite incluant une couche mince monocristalline transférée sur un substrat support |
| FR3165753A1 (fr) * | 2024-08-21 | 2026-02-27 | Soitec | Procédé de fabrication d’une structure composite incluant une couche mince monocristalline transférée sur un substrat support |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6619874B2 (ja) | 2016-04-05 | 2019-12-11 | 株式会社サイコックス | 多結晶ＳｉＣ基板およびその製造方法 |
-
2022
- 2022-03-30 FR FR2202859A patent/FR3134234B1/fr active Active
-
2023
- 2023-03-06 TW TW112108051A patent/TW202343780A/zh unknown
- 2023-03-10 KR KR1020247029841A patent/KR20240165938A/ko active Pending
- 2023-03-10 EP EP23709735.7A patent/EP4500575A1/fr active Pending
- 2023-03-10 JP JP2024552761A patent/JP2025510560A/ja active Pending
- 2023-03-10 CN CN202380026936.9A patent/CN118922912A/zh active Pending
- 2023-03-10 WO PCT/EP2023/056240 patent/WO2023186498A1/fr not_active Ceased
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