TWI329616B - - Google Patents

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Publication number
TWI329616B
TWI329616B TW94122254A TW94122254A TWI329616B TW I329616 B TWI329616 B TW I329616B TW 94122254 A TW94122254 A TW 94122254A TW 94122254 A TW94122254 A TW 94122254A TW I329616 B TWI329616 B TW I329616B
Authority
TW
Taiwan
Prior art keywords
layer
diamond
manufacturing
heat dissipation
substrate
Prior art date
Application number
TW94122254A
Other languages
English (en)
Chinese (zh)
Other versions
TW200702301A (en
Inventor
Ping Yin Liu
Hung Yin Tsai
Chia Jen Ting
Chun Hao Hsieh
Yem Yeu Chang
Chang Pin Chou
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW094122254A priority Critical patent/TW200702301A/zh
Publication of TW200702301A publication Critical patent/TW200702301A/zh
Application granted granted Critical
Publication of TWI329616B publication Critical patent/TWI329616B/zh

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Thin Film Transistor (AREA)
TW094122254A 2005-07-01 2005-07-01 Silicon-diamond structure with high heat-dissipation and insulation and its manufacturing method TW200702301A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094122254A TW200702301A (en) 2005-07-01 2005-07-01 Silicon-diamond structure with high heat-dissipation and insulation and its manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094122254A TW200702301A (en) 2005-07-01 2005-07-01 Silicon-diamond structure with high heat-dissipation and insulation and its manufacturing method

Publications (2)

Publication Number Publication Date
TW200702301A TW200702301A (en) 2007-01-16
TWI329616B true TWI329616B (https=) 2010-09-01

Family

ID=45074506

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094122254A TW200702301A (en) 2005-07-01 2005-07-01 Silicon-diamond structure with high heat-dissipation and insulation and its manufacturing method

Country Status (1)

Country Link
TW (1) TW200702301A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110504160A (zh) * 2018-05-16 2019-11-26 梁剑波 半导体器件的制造方法和半导体器件

Also Published As

Publication number Publication date
TW200702301A (en) 2007-01-16

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