JPWO2020217404A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2020217404A5 JPWO2020217404A5 JP2021515423A JP2021515423A JPWO2020217404A5 JP WO2020217404 A5 JPWO2020217404 A5 JP WO2020217404A5 JP 2021515423 A JP2021515423 A JP 2021515423A JP 2021515423 A JP2021515423 A JP 2021515423A JP WO2020217404 A5 JPWO2020217404 A5 JP WO2020217404A5
- Authority
- JP
- Japan
- Prior art keywords
- chip
- piece
- adhesive
- support
- thermosetting resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims 14
- 230000001070 adhesive effect Effects 0.000 claims 14
- 239000010410 layer Substances 0.000 claims 14
- 239000011347 resin Substances 0.000 claims 10
- 229920005989 resin Polymers 0.000 claims 10
- 229920001187 thermosetting polymer Polymers 0.000 claims 9
- 239000000758 substrate Substances 0.000 claims 7
- 239000004065 semiconductor Substances 0.000 claims 5
- 238000000034 method Methods 0.000 claims 4
- 239000012790 adhesive layer Substances 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 2
- 239000011342 resin composition Substances 0.000 claims 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2019/017713 WO2020217404A1 (ja) | 2019-04-25 | 2019-04-25 | ドルメン構造を有する半導体装置及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2020217404A1 JPWO2020217404A1 (enExample) | 2020-10-29 |
| JPWO2020217404A5 true JPWO2020217404A5 (enExample) | 2022-01-26 |
| JP7294410B2 JP7294410B2 (ja) | 2023-06-20 |
Family
ID=72941128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021515423A Active JP7294410B2 (ja) | 2019-04-25 | 2019-04-25 | ドルメン構造を有する半導体装置及びその製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US12412880B2 (enExample) |
| JP (1) | JP7294410B2 (enExample) |
| KR (1) | KR102711424B1 (enExample) |
| CN (1) | CN113574663B (enExample) |
| SG (1) | SG11202110111YA (enExample) |
| TW (1) | TWI830901B (enExample) |
| WO (1) | WO2020217404A1 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020217394A1 (ja) * | 2019-04-25 | 2020-10-29 | 日立化成株式会社 | ドルメン構造を有する半導体装置及びその製造方法、並びに、支持片形成用積層フィルム及びその製造方法 |
| KR102711424B1 (ko) | 2019-04-25 | 2024-09-26 | 가부시끼가이샤 레조낙 | 돌멘 구조를 갖는 반도체 장치 및 그 제조 방법 |
| WO2021038785A1 (ja) * | 2019-08-29 | 2021-03-04 | 昭和電工マテリアルズ株式会社 | 支持片の製造方法、半導体装置の製造方法、及び支持片形成用積層フィルム |
| JP2023102570A (ja) | 2022-01-12 | 2023-07-25 | 株式会社レゾナック | 個片化体形成用積層フィルム及びその製造方法、並びに半導体装置の製造方法 |
| CN120981923A (zh) * | 2023-07-21 | 2025-11-18 | 株式会社力森诺科 | 半导体装置及半导体装置的制造方法 |
| TW202548938A (zh) * | 2024-02-02 | 2025-12-16 | 日商力森諾科股份有限公司 | 單片化體形成用積層膜及半導體裝置之製造方法 |
Family Cites Families (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3210126B2 (ja) | 1993-03-15 | 2001-09-17 | 株式会社東芝 | 液晶表示装置の製造方法 |
| US5721452A (en) | 1995-08-16 | 1998-02-24 | Micron Technology, Inc. | Angularly offset stacked die multichip device and method of manufacture |
| JP2002222889A (ja) * | 2001-01-24 | 2002-08-09 | Nec Kyushu Ltd | 半導体装置及びその製造方法 |
| KR20030018204A (ko) * | 2001-08-27 | 2003-03-06 | 삼성전자주식회사 | 스페이서를 갖는 멀티 칩 패키지 |
| US6787916B2 (en) * | 2001-09-13 | 2004-09-07 | Tru-Si Technologies, Inc. | Structures having a substrate with a cavity and having an integrated circuit bonded to a contact pad located in the cavity |
| US6930378B1 (en) | 2003-11-10 | 2005-08-16 | Amkor Technology, Inc. | Stacked semiconductor die assembly having at least one support |
| DE10360708B4 (de) | 2003-12-19 | 2008-04-10 | Infineon Technologies Ag | Halbleitermodul mit einem Halbleiterstapel, Umverdrahtungsplatte, und Verfahren zur Herstellung derselben |
| US7312261B2 (en) * | 2004-05-11 | 2007-12-25 | International Business Machines Corporation | Thermal interface adhesive and rework |
| JP4188337B2 (ja) | 2004-05-20 | 2008-11-26 | 株式会社東芝 | 積層型電子部品の製造方法 |
| US7064430B2 (en) * | 2004-08-31 | 2006-06-20 | Stats Chippac Ltd. | Stacked die packaging and fabrication method |
| TWI292617B (en) | 2006-02-03 | 2008-01-11 | Siliconware Precision Industries Co Ltd | Stacked semiconductor structure and fabrication method thereof |
| JP4954569B2 (ja) * | 2006-02-16 | 2012-06-20 | 日東電工株式会社 | 半導体装置の製造方法 |
| CN103311208A (zh) * | 2006-03-21 | 2013-09-18 | 普罗米鲁斯有限责任公司 | 可用于芯片堆叠、芯片和晶片粘结的方法和材料 |
| US20080029885A1 (en) | 2006-08-07 | 2008-02-07 | Sandisk Il Ltd. | Inverted Pyramid Multi-Die Package Reducing Wire Sweep And Weakening Torques |
| TWI317993B (en) | 2006-08-18 | 2009-12-01 | Advanced Semiconductor Eng | Stackable semiconductor package |
| JP2010040835A (ja) * | 2008-08-06 | 2010-02-18 | Toshiba Corp | 積層型半導体装置の製造方法 |
| JP5791866B2 (ja) | 2009-03-06 | 2015-10-07 | 株式会社ディスコ | ワーク分割装置 |
| KR20120010220A (ko) | 2009-03-23 | 2012-02-02 | 히다치 가세고교 가부시끼가이샤 | 다이본딩용 수지 페이스트, 그것을 이용한 반도체 장치의 제조 방법, 및 반도체 장치 |
| US8169058B2 (en) | 2009-08-21 | 2012-05-01 | Stats Chippac, Ltd. | Semiconductor device and method of stacking die on leadframe electrically connected by conductive pillars |
| KR20120080634A (ko) * | 2009-11-13 | 2012-07-17 | 히다치 가세고교 가부시끼가이샤 | 반도체 장치, 반도체 장치의 제조 방법 및 접착제층 부착 반도체 웨이퍼 |
| KR20110083969A (ko) * | 2010-01-15 | 2011-07-21 | 삼성전자주식회사 | 반도체 패키지 및 그 제조 방법 |
| JP4976522B2 (ja) | 2010-04-16 | 2012-07-18 | 日東電工株式会社 | 熱硬化型ダイボンドフィルム、ダイシング・ダイボンドフィルム、及び、半導体装置の製造方法 |
| JP5013148B1 (ja) | 2011-02-16 | 2012-08-29 | 株式会社東京精密 | ワーク分割装置及びワーク分割方法 |
| KR101774938B1 (ko) * | 2011-08-31 | 2017-09-06 | 삼성전자 주식회사 | 지지대를 갖는 반도체 패키지 및 그 형성 방법 |
| JP5537515B2 (ja) * | 2011-09-01 | 2014-07-02 | 株式会社東芝 | 積層型半導体装置の製造方法と製造装置 |
| JP2013127014A (ja) * | 2011-12-16 | 2013-06-27 | Hitachi Chemical Co Ltd | 接着シート |
| JP5840479B2 (ja) | 2011-12-20 | 2016-01-06 | 株式会社東芝 | 半導体装置およびその製造方法 |
| WO2013133275A1 (ja) * | 2012-03-08 | 2013-09-12 | 日立化成株式会社 | 接着シート及び半導体装置の製造方法 |
| KR101906269B1 (ko) * | 2012-04-17 | 2018-10-10 | 삼성전자 주식회사 | 반도체 패키지 및 그 제조 방법 |
| CN105143380B (zh) | 2013-03-28 | 2019-05-17 | 古河电气工业株式会社 | 粘合带及晶片加工用胶带 |
| JP2015176906A (ja) * | 2014-03-13 | 2015-10-05 | 株式会社東芝 | 半導体装置および半導体装置の製造方法 |
| KR102161776B1 (ko) | 2014-03-28 | 2020-10-06 | 에스케이하이닉스 주식회사 | 적층 패키지 |
| US9418974B2 (en) | 2014-04-29 | 2016-08-16 | Micron Technology, Inc. | Stacked semiconductor die assemblies with support members and associated systems and methods |
| US9412722B1 (en) | 2015-02-12 | 2016-08-09 | Dawning Leading Technology Inc. | Multichip stacking package structure and method for manufacturing the same |
| DE102015204698B4 (de) * | 2015-03-16 | 2023-07-20 | Disco Corporation | Verfahren zum Teilen eines Wafers |
| JP6603479B2 (ja) | 2015-05-18 | 2019-11-06 | 日東電工株式会社 | 接着フィルム、ダイシングテープ一体型接着フィルム、複層フィルム、半導体装置の製造方法および半導体装置 |
| US10297575B2 (en) * | 2016-05-06 | 2019-05-21 | Amkor Technology, Inc. | Semiconductor device utilizing an adhesive to attach an upper package to a lower die |
| WO2018159305A1 (ja) | 2017-02-28 | 2018-09-07 | パナソニックIpマネジメント株式会社 | ピラー供給用シートの製造方法、ガラスパネルユニットの製造方法及びガラス窓の製造方法 |
| KR102711424B1 (ko) | 2019-04-25 | 2024-09-26 | 가부시끼가이샤 레조낙 | 돌멘 구조를 갖는 반도체 장치 및 그 제조 방법 |
| IT201900006736A1 (it) | 2019-05-10 | 2020-11-10 | Applied Materials Inc | Procedimenti di fabbricazione di package |
-
2019
- 2019-04-25 KR KR1020217029577A patent/KR102711424B1/ko active Active
- 2019-04-25 SG SG11202110111YA patent/SG11202110111YA/en unknown
- 2019-04-25 CN CN201980094137.9A patent/CN113574663B/zh active Active
- 2019-04-25 US US17/438,943 patent/US12412880B2/en active Active
- 2019-04-25 WO PCT/JP2019/017713 patent/WO2020217404A1/ja not_active Ceased
- 2019-04-25 JP JP2021515423A patent/JP7294410B2/ja active Active
-
2020
- 2020-04-17 TW TW109112888A patent/TWI830901B/zh active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPWO2020217404A5 (enExample) | ||
| US11024781B2 (en) | Glueless light emitting device with phosphor converter | |
| JP2013062314A5 (enExample) | ||
| JP6361709B2 (ja) | 半導体装置の製造方法 | |
| CN104393014B (zh) | 一种阵列基板及其制备方法、柔性显示面板和显示装置 | |
| JP2021000826A5 (enExample) | ||
| JP2010004050A5 (enExample) | ||
| JP2013522662A5 (enExample) | ||
| JP2011517302A5 (enExample) | ||
| JP2010245412A5 (enExample) | ||
| JP2013519242A5 (enExample) | ||
| JP2015224143A5 (enExample) | ||
| JP2016033967A5 (enExample) | ||
| JP2010073893A5 (enExample) | ||
| JP2014110390A5 (enExample) | ||
| JP2014192386A5 (enExample) | ||
| JP2016149517A5 (enExample) | ||
| JP2018125378A5 (enExample) | ||
| JP2016048768A (ja) | 配線板及び半導体装置の製造方法 | |
| CN109401654B (zh) | 一种封装载带基材、双界面载带及其制作方法 | |
| JP2015525809A5 (enExample) | ||
| JP2019022999A5 (enExample) | ||
| JP2019046968A5 (enExample) | ||
| JP2014029992A5 (enExample) | ||
| JP2022023990A5 (enExample) |